公开(公告)号：US20060128094A1

公开(公告)日：2006-06-15

申请号：US11342695

申请日：2006-01-31

申请人： Akio Nishida ,  Yasuko Yoshida ,  Shuji Ikeda

发明人： Akio Nishida ,  Yasuko Yoshida ,  Shuji Ikeda

IPC分类号： H01L21/8242

CPC分类号： H01L27/11 ,  H01L27/1104

摘要： In order to provide a semiconductor integrated circuit device such as a high-performance semiconductor integrated circuit device capable of reducing a soft error developed in each memory cell of a SRAM, the surface of a wiring of a cross-connecting portion, of a SRAM memory cell having a pair of n-channel type MISFETs whose gate electrodes and drains are respectively cross-connected, is formed in a shape that protrudes from the surface of a silicon oxide film. A silicon nitride film used as a capacitive insulating film, and an upper electrode are formed on the wiring. A capacitance can be formed of the wiring, the silicon nitride film and the upper electrode.

摘要翻译： 为了提供一种半导体集成电路器件，例如能够减少在SRAM的每个存储单元中产生的软错误的高性能半导体集成电路器件，SRAM存储器的交叉连接部分的布线表面 其栅电极和漏极分别交叉连接的一对n沟道型MISFET形成为从氧化硅膜的表面突出的形状。 在布线上形成用作电容绝缘膜的氮化硅膜和上电极。 电容可以由布线，氮化硅膜和上电极形成。

公开(公告)号：US20090218608A1

公开(公告)日：2009-09-03

申请号：US12362995

申请日：2009-01-30

申请人： Akio NISHIDA ,  Yasuko Yoshida ,  Shuji Ikeda

发明人： Akio NISHIDA ,  Yasuko Yoshida ,  Shuji Ikeda

IPC分类号： H01L27/11

CPC分类号： H01L27/11 ,  H01L27/1104

摘要： In order to provide a semiconductor integrated circuit device such as a high-performance semiconductor integrated circuit device capable of reducing a soft error developed in each memory cell of a SRAM, the surface of a wiring of a cross-connecting portion, of a SRAM memory cell having a pair of n-channel type MISFETs whose gate electrodes and drains are respectively cross-connected, is formed in a shape that protrudes from the surface of a silicon oxide film. A silicon nitride film used as a capacitive insulating film, and an upper electrode are formed on the wiring. A capacitance can be formed of the wiring, the silicon nitride film and the upper electrode.

摘要翻译： 为了提供一种半导体集成电路器件，例如能够减少在SRAM的每个存储单元中产生的软错误的高性能半导体集成电路器件，SRAM存储器的交叉连接部分的布线表面 其栅电极和漏极分别交叉连接的一对n沟道型MISFET形成为从氧化硅膜的表面突出的形状。 在布线上形成用作电容绝缘膜的氮化硅膜和上电极。 电容可以由布线，氮化硅膜和上电极形成。

公开(公告)号：US07488639B2

公开(公告)日：2009-02-10

申请号：US11342695

申请日：2006-01-31

申请人： Akio Nishida ,  Yasuko Yoshida ,  Shuji Ikeda

发明人： Akio Nishida ,  Yasuko Yoshida ,  Shuji Ikeda

IPC分类号： H01L21/8238

CPC分类号： H01L27/11 ,  H01L27/1104

摘要： In order to provide a semiconductor integrated circuit device such as a high-performance semiconductor integrated circuit device capable of reducing a soft error developed in each memory cell of a SRAM, the surface of a wiring of a cross-connecting portion, of a SRAM memory cell having a pair of n-channel type MISFETs whose gate electrodes and drains are respectively cross-connected, is formed in a shape that protrudes from the surface of a silicon oxide film. A silicon nitride film used as a capacitive insulating film, and an upper electrode are formed on the wiring. A capacitance can be formed of the wiring, the silicon nitride film and the upper electrode.

摘要翻译： 为了提供一种半导体集成电路器件，例如能够减少在SRAM的每个存储单元中产生的软错误的高性能半导体集成电路器件，SRAM存储器的交叉连接部分的布线表面 其栅电极和漏极分别交叉连接的一对n沟道型MISFET形成为从氧化硅膜的表面突出的形状。 在布线上形成用作电容绝缘膜的氮化硅膜和上电极。 电容可以由布线，氮化硅膜和上电极形成。

公开(公告)号：US07067864B2

公开(公告)日：2006-06-27

申请号：US10363055

申请日：2001-12-26

申请人： Akio Nishida ,  Yasuko Yoshida ,  Shuji Ikeda

发明人： Akio Nishida ,  Yasuko Yoshida ,  Shuji Ikeda

IPC分类号： H01L27/108

CPC分类号： H01L27/11 ,  H01L27/1104

摘要： In order to provide a semiconductor integrated circuit device such as a high-performance semiconductor integrated circuit device capable of reducing a soft error developed in each memory cell of a SRAM, the surface of a wiring of a cross-connecting portion, of a SRAM memory cell having a pair of n-channel type MISFETs whose gate electrodes and drains are respectively cross-connected, is formed in a shape that protrudes from the surface of a silicon oxide film. A silicon nitride film used as a capacitive insulating film, and an upper electrode are formed on the wiring. A capacitance can be formed of the wiring, the silicon nitride film and the upper electrode.

摘要翻译： 为了提供一种半导体集成电路器件，例如能够减少在SRAM的每个存储单元中产生的软错误的高性能半导体集成电路器件，SRAM存储器的交叉连接部分的布线表面 其栅电极和漏极分别交叉连接的一对n沟道型MISFET形成为从氧化硅膜的表面突出的形状。 在布线上形成用作电容绝缘膜的氮化硅膜和上电极。 电容可以由布线，氮化硅膜和上电极形成。

公开(公告)号：US06677194B2

公开(公告)日：2004-01-13

申请号：US10162573

申请日：2002-06-06

申请人： Toshiaki Yamanaka ,  Akio Nishida ,  Yasuko Yoshida ,  Shuji Ikeda ,  Kenichi Kuroda ,  Shiro Kamohara ,  Shinichiro Kimura ,  Eiichi Murakami ,  Hideyuki Matsuoka ,  Masataka Minami

发明人： Toshiaki Yamanaka ,  Akio Nishida ,  Yasuko Yoshida ,  Shuji Ikeda ,  Kenichi Kuroda ,  Shiro Kamohara ,  Shinichiro Kimura ,  Eiichi Murakami ,  Hideyuki Matsuoka ,  Masataka Minami

IPC分类号： H01L218238

CPC分类号： H01L21/823807 ,  H01L21/2652 ,  H01L21/823842 ,  H01L21/823892

摘要： A low threshold voltage NMIS area and a high threshold voltage PMIS area are set by a photoresist mask also used for well formation. Using a photoresist mask with openings for the NMIS and PMIS, the NMIS and PMIS areas are set by one ion implantation step. After gate oxidation, ion implantation is conducted through an amorphous silicon film onto wells, channels, and gate electrodes. A plurality of CMIS threshold voltages can be set and the gate electrodes of both polarities can be formed in a reduced number of steps using photoresist. This solves the problem in which photomasks are required as many as there are ion implantation types for wells, channel stoppers, gate electrodes, and threshold voltage control and hence the number of manufacturing steps and the production cost are increased.

摘要翻译： 低阈值电压NMIS区域和高阈值电压PMIS区域由也用于阱形成的光致抗蚀剂掩模设置。 使用具有用于NMIS和PMIS的开口的光致抗蚀剂掩模，通过一个离子注入步骤设置NMIS和PMIS区域。 栅极氧化后，离子注入通过非晶硅膜导入孔，通道和栅电极。 可以设置多个CMIS阈值电压，并且可以以减少数量的步骤使用光致抗蚀剂形成两个极性的栅电极。 这解决了需要光掩模的问题，因为存在孔，通道阻挡件，栅电极和阈值电压控制的离子注入类型，因此制造步骤的数量和生产成本增加。

公开(公告)号：US07893505B2

公开(公告)日：2011-02-22

申请号：US12362995

申请日：2009-01-30

申请人： Akio Nishida ,  Yasuko Yoshida ,  Shuji Ikeda

发明人： Akio Nishida ,  Yasuko Yoshida ,  Shuji Ikeda

IPC分类号： H01L21/8234 ,  H01L21/8244

CPC分类号： H01L27/11 ,  H01L27/1104

摘要： In order to provide a semiconductor integrated circuit device such as a high-performance semiconductor integrated circuit device capable of reducing a soft error developed in each memory cell of a SRAM, the surface of a wiring of a cross-connecting portion, of a SRAM memory cell having a pair of n-channel type MISFETs whose gate electrodes and drains are respectively cross-connected, is formed in a shape that protrudes from the surface of a silicon oxide film. A silicon nitride film used as a capacitive insulating film, and an upper electrode are formed on the wiring. A capacitance can be formed of the wiring, the silicon nitride film and the upper electrode.

摘要翻译： 为了提供一种半导体集成电路器件，例如能够减少在SRAM的每个存储单元中产生的软错误的高性能半导体集成电路器件，SRAM存储器的交叉连接部分的布线表面 其栅电极和漏极分别交叉连接的一对n沟道型MISFET形成为从氧化硅膜的表面突出的形状。 在布线上形成用作电容绝缘膜的氮化硅膜和上电极。 电容可以由布线，氮化硅膜和上电极形成。

公开(公告)号：US06897499B2

公开(公告)日：2005-05-24

申请号：US10359678

申请日：2003-02-07

申请人： Akio Nishida ,  Noriyuki Yabuoshi ,  Yasuko Yoshida ,  Kazuhiro Komori ,  Sousuke Tsuji ,  Hideo Miwa ,  Mitsuhiro Higuchi ,  Koichi Imato

发明人： Akio Nishida ,  Noriyuki Yabuoshi ,  Yasuko Yoshida ,  Kazuhiro Komori ,  Sousuke Tsuji ,  Hideo Miwa ,  Mitsuhiro Higuchi ,  Koichi Imato

IPC分类号： H01L21/8234 ,  G11C11/412 ,  H01L21/335 ,  H01L21/8244 ,  H01L27/088 ,  H01L27/105 ,  H01L27/11 ,  H01L29/423 ,  H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119

CPC分类号： H01L27/11 ,  G11C11/412 ,  H01L27/105 ,  H01L27/1104 ,  H01L27/1116 ,  H01L29/4238

摘要： A gate electrode of each MISFET is formed on a substrate in an active region whose periphery is defined by an element isolation trench, and crosses the active region so as to extend from one end thereof to the other end thereof. The gate electrode has a gate length in a boundary region defined between the active region and the element isolation trench which is greater than a gate length in a central portion of the active region. The gate electrode is configured in an H-type flat pattern. Further, the gate electrode covers the whole of one side extending along a gate-length direction, of the boundary region defined between the active region L and the element isolation trench, and parts of two sides thereof extending along a gate-width direction. The MISFETs are formed in electrically separated wells and are connected in series to constitute part of a reference voltage generating circuit.

摘要翻译： 每个MISFET的栅电极形成在其周围由元件隔离沟槽限定的有源区中的衬底上，并且穿过有源区从其一端延伸到另一端。 栅极电极在有源区域和元件隔离沟槽之间限定的边界区域中的栅极长度大于有源区域的中心部分中的栅极长度。 栅电极配置为H型平面图案。 此外，栅电极覆盖沿着栅极长度方向延伸的整个一侧，限定在有源区域L和元件隔离沟槽之间的边界区域以及沿栅极宽度方向延伸的两侧的部分。 MISFET形成在电分离的阱中并且串联连接以构成参考电压产生电路的一部分。

公开(公告)号：US06403446B1

公开(公告)日：2002-06-11

申请号：US09536447

申请日：2000-03-28

申请人： Norio Ishitsuka ,  Hideo Miura ,  Shuji Ikeda ,  Yasuko Yoshida ,  Norio Suzuki ,  Masayuki Kojima ,  Kota Funayama

发明人： Norio Ishitsuka ,  Hideo Miura ,  Shuji Ikeda ,  Yasuko Yoshida ,  Norio Suzuki ,  Masayuki Kojima ,  Kota Funayama

IPC分类号： H01L2176

CPC分类号： H01L21/76232 ,  Y10S148/05

摘要： Manufacturing a semiconductor device avoiding an increase of transistor leak current or reduction of the withstanding voltage characteristics is by at least one of: The pad oxide film is removed along the substrate surface from the upper edge of the groove over a distance ranging from 5 to 40 nm: The exposed surface of the semiconductor substrate undergoes removal by isotropic etching within 20 nm; and oxidizing a groove portion formed in a semiconductor substrate in an oxidation environment with a gas ratio of hydrogen (H2) to oxygen (O2) being less than or equal to 0.5, an increase of the curvature radius beyond 3nm is achieved without associating the risk of creation of any level difference on the substrate surface at or near the upper groove edge portions in a groove separation structure. This eliminates either an increase of transistor leak current or reduction of the withstanding voltage characteristics thereof otherwise occurring due to local electric field concentration near or around the terminate ends of a gate electrode film which in turn leads to an ability to improve electrical reliability of transistors used.

摘要翻译： 制造半导体器件避免晶体管泄漏电流的增加或耐压特性的降低是至少以下之一：衬垫氧化膜沿着衬底表面从沟槽的上边缘移除5至40的距离 nm：通过各向同性蚀刻在20nm内去除半导体衬底的暴露表面; 并且在氧（H2）与氧气（O2）的气体比小于或等于0.5的氧化环境中氧化形成在半导体衬底中的沟槽部分，实现曲率半径超过3nm的增加，而不会使风险 在槽分离结构中的上槽边缘部分处或附近在基板表面上产生任何水平差。 这消除了晶体管泄漏电流的增加或由于栅极电极膜的端部附近或周围的局部电场浓度而导致的耐压特性的降低，这进而导致提高使用的晶体管的电可靠性的能力 。

公开(公告)号：US5880497A

公开(公告)日：1999-03-09

申请号：US592235

申请日：1996-01-26

申请人： Shuji Ikeda ,  Koichi Imato ,  Kazuo Yoshizaki ,  Kohji Yamasaki ,  Soichiro Hashiba ,  Keiichi Yoshizumi ,  Yasuko Yoshida ,  Kousuke Okuyama ,  Mitsugu Oshima ,  Kazushi Tomita ,  Tsuyoshi Tabata ,  Kazushi Fukuda ,  Junichi Takano ,  Toshiaki Yamanaka ,  Chiemi Hashimoto ,  Motoko Kawashima ,  Fumiyuki Kanai ,  Takashi Hashimoto

发明人： Shuji Ikeda ,  Koichi Imato ,  Kazuo Yoshizaki ,  Kohji Yamasaki ,  Soichiro Hashiba ,  Keiichi Yoshizumi ,  Yasuko Yoshida ,  Kousuke Okuyama ,  Mitsugu Oshima ,  Kazushi Tomita ,  Tsuyoshi Tabata ,  Kazushi Fukuda ,  Junichi Takano ,  Toshiaki Yamanaka ,  Chiemi Hashimoto ,  Motoko Kawashima ,  Fumiyuki Kanai ,  Takashi Hashimoto

IPC分类号： H01L27/11

CPC分类号： H01L27/1108 ,  Y10S257/903 ,  Y10S257/904

摘要： A SRAM having its memory cell constructed to include transfer MISFETs to be controlled by word lines and a flip-flop circuit having driver MISFETs and load MISFETs. Plate electrodes of large area fixed on predetermined power source lines are arranged over the load MISFETs such that the plate electrodes over the offset region of the load MISFETs are formed with an opening. A silicon nitride film having a thickness permeable to hydrogen but not to humidity is formed over the transfer MISFETs and the driver MISFETs formed over the main surface of a semiconductor substrate and the load MISFETs formed of a polycrystalline silicon film deposited on the driver MISFETs.

摘要翻译： 其存储单元被构造成包括由字线控制的转移MISFET和具有驱动器MISFET和负载MISFET的触发器电路的SRAM。 固定在预定电源线上的大面积平板电极布置在负载MISFET上，使得负载MISFET的偏移区域上的平板电极形成开口。 在半导体衬底的主表面上形成的转移MISFET和驱动器MISFET上形成具有可渗透氢而不湿度的氮化硅膜，以及沉积在驱动器MISFET上的多晶硅膜形成的负载MISFET。

公开(公告)号：US5508540A

公开(公告)日：1996-04-16

申请号：US190596

申请日：1994-02-02

申请人： Shuji Ikeda ,  Koichi Imato ,  Kazuo Yoshizaki ,  Kohji Yamasaki ,  Soichiro Hashiba ,  Keiichi Yoshizumi ,  Yasuko Yoshida ,  Kousuke Okuyama ,  Mitsugu Oshima ,  Kazushi Tomita ,  Tsuyoshi Tabata ,  Kazushi Fukuda ,  Junichi Takano ,  Toshiaki Yamanaka ,  Chiemi Hashimoto ,  Motoko Kawashima ,  Fumiyuki Kanai ,  Takashi Hashimoto

发明人： Shuji Ikeda ,  Koichi Imato ,  Kazuo Yoshizaki ,  Kohji Yamasaki ,  Soichiro Hashiba ,  Keiichi Yoshizumi ,  Yasuko Yoshida ,  Kousuke Okuyama ,  Mitsugu Oshima ,  Kazushi Tomita ,  Tsuyoshi Tabata ,  Kazushi Fukuda ,  Junichi Takano ,  Toshiaki Yamanaka ,  Chiemi Hashimoto ,  Motoko Kawashima ,  Fumiyuki Kanai ,  Takashi Hashimoto

IPC分类号： H01L27/11 ,  H01L27/108 ,  H01L29/04 ,  H01L29/76

CPC分类号： H01L27/1108 ,  Y10S257/903 ,  Y10S257/904

摘要： A SRAM having its memory cell constructed to include transfer MISFETs to be controlled by word lines and a flip-flop circuit having driver MISFETs and load MISFETs. Plate electrodes of large area fixed on predetermined power source lines are arranged over the load MISFETs such that the plate electrodes over the offset region of the load MISFETs are formed with an opening. A silicon nitride film having a thickness permeable to hydrogen but not to humidity is formed over the transfer MISFETs and the driver MISFETs formed over the main surface of a semiconductor substrate and the load MISFETs formed of a polycrystalline silicon film deposited on the driver MISFETs.

摘要翻译： 其存储单元被构造成包括由字线控制的转移MISFET和具有驱动器MISFET和负载MISFET的触发器电路的SRAM。 固定在预定电源线上的大面积平板电极布置在负载MISFET上，使得负载MISFET的偏移区域上的平板电极形成开口。 在半导体衬底的主表面上形成的转移MISFET和驱动器MISFET上形成具有可渗透氢而不湿度的氮化硅膜，以及沉积在驱动器MISFET上的多晶硅膜形成的负载MISFET。