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公开(公告)号:US5389198A
公开(公告)日:1995-02-14
申请号:US763519
申请日:1991-09-23
申请人: Akira Koide , Kazuo Sato , Seiko Suzuki , Norio Ichikawa , Hidehito Obayashi , Masahide Hayashi
发明人: Akira Koide , Kazuo Sato , Seiko Suzuki , Norio Ichikawa , Hidehito Obayashi , Masahide Hayashi
IPC分类号: G01P15/125 , B81B3/00 , H01L21/306 , H01L21/308 , H01L29/84 , H01L21/00
CPC分类号: H01L21/30608 , H01L21/3086 , G01P2015/0828
摘要: A method of manufacturing structures such as a pressure gauge, an accelerometer and the like with a single crystal material such as silicon uses etching techniques where the shape of a part subjected to stress concentration has a curvature, another part is formed in a plane body and a polyhedron is constituted by combining both.To attain the above constitution, a wafer of single crystal material is formed with a stepped surface having a value corresponding to at least the depth of the curvature in a first anisotropic etching process using a prescribed etching mask, and in a second anisotropic etching process, an etching mask is used by removing at least a part of the etching mask used in the first anisotropic etching process.
摘要翻译: 使用诸如硅的单晶材料制造诸如压力计,加速度计等的结构的方法使用蚀刻技术,其中经受应力集中的部分的形状具有曲率,另一部分形成在平面体中, 多面体是通过组合两者构成的。 为了实现上述结构,在使用规定的蚀刻掩模的第一各向异性蚀刻工艺中,形成具有至少与曲率深度相对应的值的阶梯面的单晶材料晶片,在第二各向异性蚀刻工艺中, 通过去除在第一各向异性蚀刻工艺中使用的蚀刻掩模的至少一部分来使用蚀刻掩模。
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公开(公告)号:US08438718B2
公开(公告)日:2013-05-14
申请号:US13028592
申请日:2011-02-16
申请人: Takanori Aono , Kengo Suzuki , Akira Koide , Masahide Hayashi
发明人: Takanori Aono , Kengo Suzuki , Akira Koide , Masahide Hayashi
IPC分类号: G01R3/00
CPC分类号: G01C19/56 , B81B2201/0235 , B81B2201/0242 , B81B2207/096 , B81C1/00285 , B81C2203/0118 , B81C2203/035 , G01C19/5769 , G01C19/5783 , G01P15/0802 , G01P2015/0882 , H01L2224/48145 , H01L2224/73265 , H01L2224/92247 , H01L2924/181 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908 , Y10T29/49171 , Y10T29/49176 , Y10T29/49826 , H01L2924/00012
摘要: A movable device of acceleration sensors and a vibration device of a gyroscope are formed on the same sensor wafer spaced apart from each other by a wall. A cap wafer having gaps corresponding to the movable mechanical components of the acceleration sensors and gyroscope is provided for the wafer and an adsorbent divided into a plurality of divisional portions is disposed in the gap for the gyroscope. After the sensor wafer and the cap wafer have been bonded together at a temperature of inactivation of the adsorbent and in an atmospheric pressure ambience of noble gas and activated gas, the adsorbent divisional portions are activated in sequence to adsorb the activated gas so as to adjust the pressure inside the gyroscope, thus manufacturing a combined sensor wafer.
摘要翻译: 加速度传感器的可移动装置和陀螺仪的振动装置形成在通过壁彼此间隔开的相同传感器晶片上。 为晶片提供具有与加速度传感器和陀螺仪的可移动机械部件相对应的间隙的盖片晶片,并且分离成多个分割部分的吸附剂设置在用于陀螺仪的间隙中。 在传感器晶片和盖晶片已经在吸附剂失活的温度下并且在惰性气体和活性气体的大气压氛围下结合在一起,吸附剂分段依次被激活以吸附活性气体,以便调节 陀螺仪内部的压力,从而制造组合的传感器晶片。
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公开(公告)号:US20130068020A1
公开(公告)日:2013-03-21
申请号:US13699235
申请日:2011-05-20
申请人: Takanori Aono , Kengo Suzuki , Akira Koide , Masahide Hayashi
发明人: Takanori Aono , Kengo Suzuki , Akira Koide , Masahide Hayashi
CPC分类号: G01P15/0802 , B81B2201/0235 , B81B2201/0242 , B81B2203/0315 , B81B2207/095 , B81C1/00293 , B81C2203/031 , G01C19/56 , G01C19/5783 , G01P15/125 , H01L21/561 , H01L23/315 , H01L24/94 , H01L2924/12042 , H01L2924/15788 , H01L2924/16235 , Y10T29/49146 , Y10T29/49826 , H01L2924/00
摘要: An acceleration sensor and an angular velocity sensor are sealed in respective pressure atmospheres suitable therefor in the process of a series of bonding steps, thereby improving the detection sensibilities of the sensors.A movable member 111 of an acceleration sensor 11 and a vibrator 121 of an angular velocity sensor 12 are fabricated on the same sensor wafer 10 with a wall 16 interposed therebetween. A cap wafer 20 is formed in which gaps 21, 22 corresponding to the movable member 111 of the acceleration sensor 11 and the vibrator 121 of the angular velocity sensor 12 are provided. Bumps 23 are disposed near the gap 22 of the angular velocity sensor 12. The acceleration sensor 11 is sealed at atmospheric pressure. Then, the angular velocity sensor 12 is subjected to high temperature and a high-load and is vacuum-sealed. Thereafter, cutting with a diamond grindstone and mounting of circuit substrates and a wiring substrate are performed to form a combined sensor.
摘要翻译: 加速度传感器和角速度传感器在一系列接合步骤的过程中被密封在适合于其的相应的压力环境中,从而提高传感器的检测灵敏度。 加速度传感器11的可动部件111和角速度传感器12的振动器121被制造在相同的传感器晶片10上,壁16插入其中。 形成盖片20,其中设置有与加速度传感器11的可动构件111对应的间隙21,22和角速度传感器12的振子121。 凸起23设置在角速度传感器12的间隙22附近。加速度传感器11在大气压下被密封。 然后,对角速度传感器12进行高温高负荷的真空密封。 此后,进行用金刚石磨石切割并安装电路基板和布线基板以形成组合的传感器。
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公开(公告)号:US5707077A
公开(公告)日:1998-01-13
申请号:US479451
申请日:1995-06-07
IPC分类号: G01P15/125 , G01P15/18 , B60R21/32
CPC分类号: G01P15/125 , G01P15/18 , G01P2015/084
摘要: A three-dimensional acceleration sensor capable of detecting a small acceleration value and even an acceleration value amounting up to 100 G occurring in the event of a collision has a diaphragm for linking a frame and a massive part, and diaphragms and beams for linking the massive part and a central part. These elements are formed by working a single crystalline silicon plate. Gaps between the massive part and opposing electrodes are changed by acceleration applied to the massive part. A circuit connected to terminals detects the changes in gaps as changes in capacitances and determines direction and level of the applied acceleration.
摘要翻译: 能够检测碰撞时发生的加速度小,加速度高达100G的三维加速度传感器具有用于连接框架和块体的隔膜,以及用于连接大块的隔膜和梁 部分和中心部分。 这些元件通过加工单晶硅板形成。 大块部件和相对电极之间的间隙由施加在大块部件上的加速度而改变。 连接到端子的电路检测间隙的变化,作为电容的变化,并确定施加的加速度的方向和水平。
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公开(公告)号:US5441300A
公开(公告)日:1995-08-15
申请号:US978397
申请日:1992-11-18
IPC分类号: B60R21/0136 , B60R21/16 , B81B3/00 , G01P15/125 , G01P15/18 , B60R21/32
CPC分类号: G01P15/18 , G01P15/125 , G01P2015/0828 , G01P2015/084 , G01P2015/0842
摘要: A three-dimensional acceleration sensor capable of detecting a small acceleration value and even an acceleration value amounting up to 100G occurring in the event of a collision comprises a diaphragm for linking a frame and a massive part and diaphragms and beams for linking the massive part and a central part. These elements are formed by working a single crystalline silicon plate. Gaps between the massive part and opposing electrodes are changed by acceleration applied to the massive part. A circuit connected to terminals detects the changes in gaps as changes in capacitances and determines direction and level of the applied acceleration.
摘要翻译: 能够检测碰撞时发生的加速度小,加速度高达100G的三维加速度传感器包括用于连接框架和块状部件的隔膜以及用于连接块状部件的隔膜和梁 中心部分。 这些元件通过加工单晶硅板形成。 大块部件和相对电极之间的间隙由施加在大块部件上的加速度而改变。 连接到端子的电路检测间隙的变化,作为电容的变化,并确定施加的加速度的方向和水平。
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公开(公告)号:US09146253B2
公开(公告)日:2015-09-29
申请号:US13699235
申请日:2011-05-20
申请人: Takanori Aono , Kengo Suzuki , Akira Koide , Masahide Hayashi
发明人: Takanori Aono , Kengo Suzuki , Akira Koide , Masahide Hayashi
IPC分类号: G01P1/02 , G01P15/08 , B81C1/00 , G01C19/56 , G01P15/125 , G01C19/5783 , H01L23/00 , H01L23/31 , H01L21/56
CPC分类号: G01P15/0802 , B81B2201/0235 , B81B2201/0242 , B81B2203/0315 , B81B2207/095 , B81C1/00293 , B81C2203/031 , G01C19/56 , G01C19/5783 , G01P15/125 , H01L21/561 , H01L23/315 , H01L24/94 , H01L2924/12042 , H01L2924/15788 , H01L2924/16235 , Y10T29/49146 , Y10T29/49826 , H01L2924/00
摘要: An acceleration sensor and an angular velocity sensor are sealed in respective pressure atmospheres suitable therefor in the process of a series of bonding steps, thereby improving the detection sensibilities of the sensors.A movable member 111 of an acceleration sensor 11 and a vibrator 121 of an angular velocity sensor 12 are fabricated on the same sensor wafer 10 with a wall 16 interposed therebetween. A cap wafer 20 is formed in which gaps 21, 22 corresponding to the movable member 111 of the acceleration sensor 11 and the vibrator 121 of the angular velocity sensor 12 are provided. Bumps 23 are disposed near the gap 22 of the angular velocity sensor 12. The acceleration sensor 11 is sealed at atmospheric pressure. Then, the angular velocity sensor 12 is subjected to high temperature and a high-load and is vacuum-sealed. Thereafter, cutting with a diamond grindstone and mounting of circuit substrates and a wiring substrate are performed to form a combined sensor.
摘要翻译: 加速度传感器和角速度传感器在一系列接合步骤的过程中被密封在适合于其的相应的压力环境中,从而提高传感器的检测灵敏度。 加速度传感器11的可动部件111和角速度传感器12的振动器121被制造在相同的传感器晶片10上,壁16插入其中。 形成盖片20,其中设置有与加速度传感器11的可动构件111对应的间隙21,22和角速度传感器12的振子121。 凸起23设置在角速度传感器12的间隙22附近。加速度传感器11在大气压下被密封。 然后,对角速度传感器12进行高温高负荷的真空密封。 此后,进行用金刚石磨石切割并安装电路基板和布线基板以形成组合的传感器。
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公开(公告)号:US20110209815A1
公开(公告)日:2011-09-01
申请号:US13028592
申请日:2011-02-16
申请人: Takanori AONO , Kengo Suzuki , Akira Koide , Masahide Hayashi
发明人: Takanori AONO , Kengo Suzuki , Akira Koide , Masahide Hayashi
CPC分类号: G01C19/56 , B81B2201/0235 , B81B2201/0242 , B81B2207/096 , B81C1/00285 , B81C2203/0118 , B81C2203/035 , G01C19/5769 , G01C19/5783 , G01P15/0802 , G01P2015/0882 , H01L2224/48145 , H01L2224/73265 , H01L2224/92247 , H01L2924/181 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908 , Y10T29/49171 , Y10T29/49176 , Y10T29/49826 , H01L2924/00012
摘要: A movable device of acceleration sensors and a vibration device of a gyroscope are formed on the same sensor wafer spaced apart from each other by a wall. A cap wafer having gaps corresponding to the movable mechanical components of the acceleration sensors and gyroscope is provided for the wafer and an adsorbent divided into a plurality of divisional portions is disposed in the gap for the gyroscope. After the sensor wafer and the cap wafer have been bonded together at a temperature of inactivation of the adsorbent and in an atmospheric pressure ambience of noble gas and activated gas, the adsorbent divisional portions are activated in sequence to adsorb the activated gas so as to adjust the pressure inside the gyroscope, thus manufacturing a combined sensor wafer.
摘要翻译: 加速度传感器的可移动装置和陀螺仪的振动装置形成在通过壁彼此间隔开的相同传感器晶片上。 为晶片提供具有与加速度传感器和陀螺仪的可移动机械部件相对应的间隙的盖片晶片,并且分离成多个分割部分的吸附剂设置在用于陀螺仪的间隙中。 在传感器晶片和盖晶片已经在吸附剂失活的温度下并且在惰性气体和活性气体的大气压氛围下结合在一起,吸附剂分段依次被激活以吸附活性气体,以便调节 陀螺仪内部的压力,从而制造组合的传感器晶片。
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公开(公告)号:US09279827B2
公开(公告)日:2016-03-08
申请号:US13976372
申请日:2011-11-24
申请人: Daisuke Maeda , Heewon Jeong , Masahide Hayashi
发明人: Daisuke Maeda , Heewon Jeong , Masahide Hayashi
IPC分类号: G01P21/00 , G01C19/5776 , G01C21/16
CPC分类号: G01P21/00 , G01C19/5776 , G01C21/16
摘要: Reliability and accuracy of a sensor are secured while adjustment cost of a sensor module is suppressed. A signal component analysis part 10 receives a signal output from a signal processing part 7 before passing through a low-pass filter 8, analyzes whether or not application of a fragile frequency with respect to a physical quantity is equal to or more than a threshold level, if the application of the fragile frequency is equal to or more than the threshold level, outputs output stop signals to output signal control parts 9, 16. The output signal control parts 9, 16 receive control signals output from the signal component analysis part 10, and outputs an acceleration signal and a physical quantity signal from which noise has been removed by the low-pass filters 8, 15 through the signal processing parts 7, 14.
摘要翻译: 确保传感器模块的调整成本得到抑制,从而确保传感器的可靠性和精度。 信号分量分析部分10在通过低通滤波器8之前接收从信号处理部分7输出的信号,分析相对于物理量的脆弱频率的施加是否等于或大于阈值水平 如果脆弱频率的应用等于或大于阈值电平,则将输出停止信号输出到输出信号控制部9,16。输出信号控制部9,16接收从信号分量分析部10输出的控制信号 并且通过信号处理部件7,14输出通过低通滤波器8,15除去噪声的加速度信号和物理量信号。
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公开(公告)号:US09151776B2
公开(公告)日:2015-10-06
申请号:US13983828
申请日:2012-01-10
申请人: Heewon Jeong , Masahide Hayashi
发明人: Heewon Jeong , Masahide Hayashi
IPC分类号: G01C19/5719 , G01P15/125 , G01P15/08 , G01C19/5733 , G01C19/5726 , H01L29/84 , G01C19/5769
CPC分类号: G01P15/125 , G01C19/5719 , G01C19/5726 , G01C19/5733 , G01C19/5769 , G01P15/0802 , G01P2015/0814 , H01L29/84
摘要: An object of the invention is to provide a combined sensor capable of suppressing the influence of electrostatic force generated by a potential difference and preventing a reduction in the S/N ratio or a variation in the sensitivity of a sensor.A combined sensor according to the invention includes first and second movable portions and first and second dummy portions provided around the first and second movable portions, which are formed in a layer of a laminated substrate. The first dummy portion and the second dummy portion are electrically separated from each other. A first potential is applied to the first movable portion and the first dummy portion and a second potential is applied to the second movable portion and the second dummy portion (see FIG. 2).
摘要翻译: 本发明的目的是提供一种组合传感器,其能够抑制由电位差产生的静电力的影响,并且防止S / N比的降低或传感器的灵敏度的变化。 根据本发明的组合传感器包括第一和第二可移动部分以及设置在第一和第二可移动部分周围的第一和第二虚拟部分,其形成在层压基板的层中。 第一虚拟部分和第二虚拟部分彼此电分离。 第一电位施加到第一可动部和第一虚拟部,第二电位施加到第二可动部和第二虚拟部(参照图2)。
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公开(公告)号:US07414307B2
公开(公告)日:2008-08-19
申请号:US10855344
申请日:2004-05-28
IPC分类号: H01L23/48
CPC分类号: H05K3/3442 , H01L2924/0002 , H05K3/202 , H05K3/284 , H05K2201/09036 , H05K2201/09745 , H05K2201/10636 , Y02P70/611 , Y02P70/613 , H01L2924/00
摘要: An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.
摘要翻译: 电子设备需要为了静电屏蔽而安装电子部件。 这种电子部件的安装提出了避免由于部件材料的线性膨胀系数之间的差异而产生的热应力和裂纹的问题。 在各引线的电子部件安装部中,以组合的方式形成定位凹部,接合物质厚度确保凹部,接合物质厚度确保凹部等,由此在接合物质中产生的裂纹的扩散可以 可以提高抑制和可靠性。 填充密封材料以密封和限制安装在电子部件安装部分中的电子部件而不留空隙有助于进一步抑制在接合物质中产生的裂纹的扩散,并确保接合物质的可靠性更好。
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