公开(公告)号：US20060001116A1

公开(公告)日：2006-01-05

申请号：US11143206

申请日：2005-06-02

申请人： Albert Auburger ,  Stefan Paulus ,  Adolf Koller

发明人： Albert Auburger ,  Stefan Paulus ,  Adolf Koller

IPC分类号： H01L31/0203

CPC分类号： B81B7/0067 ,  B81B2207/012 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012

摘要： The invention relates to a semiconductor module with a semiconductor sensor chip and an associated method. The sensor chip has a sensor region, and nonsensitive regions of the sensor chip are embedded in a nontransparent plastic package molding compound. The sensor region of the sensor chip is operably coupled to the external surroundings of the module via an opening in the nontransparent plastic package molding compound. The opening in the molding compound is formed by laser ablation.

摘要翻译： 本发明涉及具有半导体传感器芯片和相关方法的半导体模块。 传感器芯片具有传感器区域，传感器芯片的非敏感区域嵌入在不透明的塑料封装模塑料中。 传感器芯片的传感器区域通过非透明塑料封装模制化合物中的开口可操作地耦合到模块的外部周围。 模塑料中的开口由激光烧蚀形成。

公开(公告)号：US20070217734A1

公开(公告)日：2007-09-20

申请号：US11679601

申请日：2007-02-27

申请人： Albert Auburger ,  Jochen Dangelmaier ,  Cyrus Ghahremani ,  Thomas Lichtenegger ,  Stefan Paulus ,  Jean Schmitt ,  Horst Theuss ,  Helmut Wietschorke

发明人： Albert Auburger ,  Jochen Dangelmaier ,  Cyrus Ghahremani ,  Thomas Lichtenegger ,  Stefan Paulus ,  Jean Schmitt ,  Horst Theuss ,  Helmut Wietschorke

IPC分类号： G02B6/26

CPC分类号： G02B6/4202 ,  G02B6/423 ,  H01L31/0203 ,  H01L31/125 ,  H01L2224/48091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optocoupler, for converting optical signals into electrical signals and vice versa, includes a package with a jack connector for receiving an optical waveguide. On a lower side of the package, surface-mountable outer contacts are arranged on an interconnection film. A mounting position for semiconductor chips, including one optical semiconductor chip and one application-specific semiconductor chip, is provided in the package on the optical axis of the optical waveguide. The optical semiconductor chip is aligned with the optical axis inside the package. The outer contacts are arranged outside the package on the flexible interconnection film. Between the mounting position and the outer contacts, the interconnection film includes a curved region which is embedded in the package material such that the surface-mountable outer contacts on the lower side of the package are freely accessible.

摘要翻译： 用于将光信号转换为电信号的光耦合器，反之亦然，包括具有用于接收光波导的插座连接器的封装。 在封装的下侧，表面安装的外触点设置在互连膜上。 在光波导的光轴上的封装中设置包括一个光学半导体芯片和一个专用半导体芯片的半导体芯片的安装位置。 光学半导体芯片与封装内的光轴对准。 外部触点布置在柔性互连膜上的封装外部。 在安装位置和外部触点之间，互连膜包括嵌入封装材料中的弯曲区域，使得封装的下侧上的可表面安装的外部触点可自由接近。

公开(公告)号：US20060024851A1

公开(公告)日：2006-02-02

申请号：US11192444

申请日：2005-07-27

申请人： Albert Auburger ,  Hans Hurt ,  Stefan Paulus ,  Nikolaus Schunk ,  Frank Weberpals ,  Josef Wittl

发明人： Albert Auburger ,  Hans Hurt ,  Stefan Paulus ,  Nikolaus Schunk ,  Frank Weberpals ,  Josef Wittl

IPC分类号： H01L21/66 ,  H01L21/50

CPC分类号： H01L31/0203 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/1815 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for producing an optical or electronic module provided with a plastic package including: providing at least one optical or electronic component, the component having an operative region, via which it is in operative connection with the surroundings in the finished module, encapsulating the component with at least one polymer compound to form the plastic package, before or after the encapsulation, ascertaining the position of the component by direct measurement of the position of the component, aligning the component with respect to a device for partially removing the polymer compound or alignment of such a device with respect to the component, the alignment taking place with allowance for the ascertained position of the component, and partial removal of the polymer compound from the outside such that the polymer compound between the operative region and the outer side of the plastic package is at least partially removed.

摘要翻译： 一种用于制造具有塑料封装的光学或电子模块的方法，包括：提供至少一个光学或电子部件，所述部件具有操作区域，通过所述操作区域与所述完成模块中的周围环境可操作地连接，封装所述部件 与至少一种聚合物化合物形成塑料包装，在封装之前或之后，通过直接测量组分的位置来确定组分的位置，使组分相对于用于部分去除高分子化合物或对准的装置 的这种装置相对于部件的位置，允许组件的确定位置允许的对准，并且从外部部分去除聚合物化合物，使得在塑料的操作区域和外侧之间的高分子化合物 包装至少部分被去除。

公开(公告)号：US07442559B2

公开(公告)日：2008-10-28

申请号：US11192444

申请日：2005-07-27

申请人： Albert Auburger ,  Hans Hurt ,  Stefan Paulus ,  Nikolaus Schunk ,  Frank Weberpals ,  Josef Wittl

发明人： Albert Auburger ,  Hans Hurt ,  Stefan Paulus ,  Nikolaus Schunk ,  Frank Weberpals ,  Josef Wittl

IPC分类号： G01R31/26 ,  H01L21/66

CPC分类号： H01L31/0203 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/1815 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for producing an optical or electronic module provided with a plastic package including: providing at least one optical or electronic component, the component having an operative region, via which it is in operative connection with the surroundings in the finished module, encapsulating the component with at least one polymer compound to form the plastic package, before or after the encapsulation, ascertaining the position of the component by direct measurement of the position of the component, aligning the component with respect to a device for partially removing the polymer compound or alignment of such a device with respect to the component, the alignment taking place with allowance for the ascertained position of the component, and partial removal of the polymer compound from the outside such that the polymer compound between the operative region and the outer side of the plastic package is at least partially removed.

摘要翻译： 一种用于制造具有塑料封装的光学或电子模块的方法，包括：提供至少一个光学或电子部件，所述部件具有操作区域，通过所述操作区域与所述完成模块中的周围环境可操作地连接，封装所述部件 与至少一种聚合物化合物形成塑料包装，在封装之前或之后，通过直接测量组分的位置来确定组分的位置，使组分相对于用于部分去除高分子化合物或对准的装置 的这种装置相对于部件的位置，允许组件的确定位置允许的对准，并且从外部部分去除聚合物化合物，使得在塑料的操作区域和外侧之间的高分子化合物 包装至少部分被去除。

公开(公告)号：US20060027479A1

公开(公告)日：2006-02-09

申请号：US11191308

申请日：2005-07-28

申请人： Albert Auburger ,  Hans Hurt ,  Thomas Lichtenegger ,  Stefan Paulus ,  Nikolaus Schunk ,  Frank Weberpals ,  Josef Wittl

发明人： Albert Auburger ,  Hans Hurt ,  Thomas Lichtenegger ,  Stefan Paulus ,  Nikolaus Schunk ,  Frank Weberpals ,  Josef Wittl

IPC分类号： B65D65/00

CPC分类号： H01L25/167 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4245 ,  G02B6/4253 ,  G02B6/4257 ,  G02B6/426 ,  G02B6/4274 ,  H01L23/3135 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01S5/02216 ,  H01S5/02244 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： One or more aspects of the invention relate to an optical or electronic module with at least one optical or electronic component and a plastic package within which the component is embedded. The component has an operative region that facilitates operative connection with surroundings. The plastic package has a first region, which comprises a transparent polymer compound, and a second region, which comprises a non-transparent polymer compound. The first region extends such that it borders the operative region of the component.

摘要翻译： 本发明的一个或多个方面涉及具有至少一个光学或电子部件的光学或电子模块以及嵌入该部件的塑料封装。 该组件具有便于与周围环境的操作连接的操作区域。 塑料包装具有包含透明高分子化合物的第一区域和包含不透明聚合物化合物的第二区域。 第一区域延伸成使得其与部件的操作区域相邻。

公开(公告)号：US07056764B2

公开(公告)日：2006-06-06

申请号：US10238820

申请日：2002-09-10

申请人： Albert Auburger ,  Bernd Stadler ,  Stefan Paulus ,  Horst Theuss

发明人： Albert Auburger ,  Bernd Stadler ,  Stefan Paulus ,  Horst Theuss

IPC分类号： H01L21/44 ,  G01R31/308

CPC分类号： G01L19/0069 ,  G01H1/00 ,  G01L19/147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/00014

摘要： An electronic sensor device has at least one sensor component, which bears on a bearing base of a rewiring structure. Contact areas of the sensor component are electrically conductively connected to contact pads of the rewiring structure. External contact areas of the rewiring structure are led outward from a housing for the electrical contact-connection of the electronic sensor device. A method is also described for producing the electronic sensor device.

公开(公告)号：US06784551B2

公开(公告)日：2004-08-31

申请号：US10238940

申请日：2002-09-10

申请人： Albert Auburger ,  Bernd Stadler ,  Stefan Paulus ,  Horst Theuss

发明人： Albert Auburger ,  Bernd Stadler ,  Stefan Paulus ,  Horst Theuss

IPC分类号： H01L2348

CPC分类号： H01L25/16 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/66 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48237 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/15313 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic device has a semiconductor chip and a passive component, whose electrical values can be varied. The semiconductor chip is electrically conductively connected to a rewiring structure that, together with the semiconductor chip and with the passive component, is enclosed by a housing made of plastic. A method for producing the electronic device is also described.

摘要翻译： 电子设备具有半导体芯片和无源元件，其电值可以变化。 半导体芯片导电地连接到重新布线结构，其与半导体芯片和被动元件一起被由塑料制成的壳体包围。 还描述了用于制造电子设备的方法。

公开(公告)号：US07476036B2

公开(公告)日：2009-01-13

申请号：US11679601

申请日：2007-02-27

申请人： Albert Auburger ,  Jochen Dangelmaier ,  Cyrus Ghahremani ,  Thomas Lichtenegger ,  Stefan Paulus ,  Jean Schmitt ,  Horst Theuss ,  Helmut Wietschorke

发明人： Albert Auburger ,  Jochen Dangelmaier ,  Cyrus Ghahremani ,  Thomas Lichtenegger ,  Stefan Paulus ,  Jean Schmitt ,  Horst Theuss ,  Helmut Wietschorke

IPC分类号： G02B6/42

CPC分类号： G02B6/4202 ,  G02B6/423 ,  H01L31/0203 ,  H01L31/125 ,  H01L2224/48091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optocoupler, for converting optical signals into electrical signals and vice versa, includes a package with a jack connector for receiving an optical waveguide. On a lower side of the package, surface-mountable outer contacts are arranged on an interconnection film. A mounting position for semiconductor chips, including one optical semiconductor chip and one application-specific semiconductor chip, is provided in the package on the optical axis of the optical waveguide. The optical semiconductor chip is aligned with the optical axis inside the package. The outer contacts are arranged outside the package on the flexible interconnection film. Between the mounting position and the outer contacts, the interconnection film includes a curved region which is embedded in the package material such that the surface-mountable outer contacts on the lower side of the package are freely accessible.

摘要翻译： 用于将光信号转换为电信号的光耦合器，反之亦然，包括具有用于接收光波导的插座连接器的封装。 在封装的下侧，表面安装的外触点设置在互连膜上。 在光波导的光轴上的封装中设置包括一个光学半导体芯片和一个专用半导体芯片的半导体芯片的安装位置。 光学半导体芯片与封装内的光轴对准。 外部触点布置在柔性互连膜上的封装外部。 在安装位置和外部触点之间，互连膜包括嵌入封装材料中的弯曲区域，使得封装的下侧上的可表面安装的外部触点可自由接近。

公开(公告)号：US20060049548A1

公开(公告)日：2006-03-09

申请号：US11216565

申请日：2005-08-31

申请人： Albert Auburger ,  Hans Hurt ,  Stefan Paulus ,  Nikolaus Schunk ,  Frank Weberpals ,  Josef Wittl

发明人： Albert Auburger ,  Hans Hurt ,  Stefan Paulus ,  Nikolaus Schunk ,  Frank Weberpals ,  Josef Wittl

IPC分类号： B29D11/00 ,  B29C45/14

CPC分类号： B29C70/72 ,  B23K26/009 ,  B23K2101/40 ,  B23K2103/42 ,  B23K2103/50 ,  B29C45/0055 ,  B29C45/14655 ,  B29C45/14836 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/1815 ,  H01S5/0078 ,  H01S5/02216 ,  H01S5/02228 ,  H01S5/02244 ,  H01S5/02296 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention relates to a method for producing an optical or electronic module provided with a plastic package. The method includes provision of at least one optical or electronic component, the component having an operative region via which it is in operative connection with the surroundings in the finished module, and application to the component of a protective layer which covers at least the operative region of the component. The method further includes encapsulation of the at least one component with at least one polymer compound to form the package, and partial removal of the polymer compound from the outside by a laser ablation device such that the polymer compound between the protective layer of the component and the outer side of the plastic package is removed. The protective layer is, in this case, not transparent with respect to the radiation emitted by the laser ablation device. The invention relates furthermore to an optical or electronic module with at least one optical or electronic component, to which a protective layer is applied.

摘要翻译： 本发明涉及一种用于制造具有塑料封装的光学或电子模块的方法。 该方法包括提供至少一个光学或电子部件，所述部件具有操作区域，通过该工作区域，其与完成的模块中的周围环境可操作地连接，以及应用于至少覆盖操作区域的保护层的部件 的组件。 该方法还包括用至少一种聚合物化合物包封至少一种组分以形成包装，以及通过激光烧蚀装置从外部部分去除高分子化合物，使得组分的保护层和 去除塑料包装的外侧。 在这种情况下，保护层相对于由激光烧蚀装置发射的辐射不透明。 本发明还涉及具有至少一个光学或电子部件的光学或电子模块，其上施加有保护层。

公开(公告)号：US20060014326A1

公开(公告)日：2006-01-19

申请号：US11220341

申请日：2005-09-06

申请人： Albert Auburger ,  Hainz Oswald ,  Helga Hainz ,  Dietmar Lang ,  Rudolf Lehner ,  Stefan Paulus ,  Martin Petz ,  Michael Weber

发明人： Albert Auburger ,  Hainz Oswald ,  Helga Hainz ,  Dietmar Lang ,  Rudolf Lehner ,  Stefan Paulus ,  Martin Petz ,  Michael Weber

IPC分类号： H01L21/44

CPC分类号： H01L21/568 ,  H01L23/3107 ,  H01L23/482 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/4848 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/854 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor component has a housing with a first main area and a second main area opposite to the first main area, which surrounds at least one semiconductor chip. The semiconductor chip has a first metallization layer on a first main side. A second main side of the semiconductor chip borders the second main area of the semiconductor component. The first metallization layer of the semiconductor chip is connected via electrical conductors to contacts that are likewise surrounded by the housing and border the second main area. The semiconductor chip furthermore has, on the second main side, a second metallization layer for carrying signals.

摘要翻译： 半导体部件具有壳体，其具有第一主区域和与第一主区域相对的第二主区域，该第一主区域围绕至少一个半导体芯片。 半导体芯片在第一主侧具有第一金属化层。 半导体芯片的第二主面与半导体部件的第二主要区域相接。 半导体芯片的第一金属化层通过电导体连接到同样被壳体包围并与第二主区域相接触的触点。 半导体芯片在第二主侧还具有用于承载信号的第二金属化层。