公开(公告)号：US20060014326A1

公开(公告)日：2006-01-19

申请号：US11220341

申请日：2005-09-06

申请人： Albert Auburger ,  Hainz Oswald ,  Helga Hainz ,  Dietmar Lang ,  Rudolf Lehner ,  Stefan Paulus ,  Martin Petz ,  Michael Weber

发明人： Albert Auburger ,  Hainz Oswald ,  Helga Hainz ,  Dietmar Lang ,  Rudolf Lehner ,  Stefan Paulus ,  Martin Petz ,  Michael Weber

IPC分类号： H01L21/44

CPC分类号： H01L21/568 ,  H01L23/3107 ,  H01L23/482 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/4848 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/854 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor component has a housing with a first main area and a second main area opposite to the first main area, which surrounds at least one semiconductor chip. The semiconductor chip has a first metallization layer on a first main side. A second main side of the semiconductor chip borders the second main area of the semiconductor component. The first metallization layer of the semiconductor chip is connected via electrical conductors to contacts that are likewise surrounded by the housing and border the second main area. The semiconductor chip furthermore has, on the second main side, a second metallization layer for carrying signals.

摘要翻译： 半导体部件具有壳体，其具有第一主区域和与第一主区域相对的第二主区域，该第一主区域围绕至少一个半导体芯片。 半导体芯片在第一主侧具有第一金属化层。 半导体芯片的第二主面与半导体部件的第二主要区域相接。 半导体芯片的第一金属化层通过电导体连接到同样被壳体包围并与第二主区域相接触的触点。 半导体芯片在第二主侧还具有用于承载信号的第二金属化层。

公开(公告)号：US06867492B2

公开(公告)日：2005-03-15

申请号：US10347539

申请日：2003-01-17

申请人： Albert Auburger ,  Frank Klose ,  Rudolf Lehner ,  Horst Theuss

发明人： Albert Auburger ,  Frank Klose ,  Rudolf Lehner ,  Horst Theuss

IPC分类号： H01L21/60 ,  H01L23/367 ,  H01L23/433 ,  H01L23/66 ,  H01L23/10 ,  H01L23/34

CPC分类号： H01L24/12 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/66 ,  H01L24/11 ,  H01L24/27 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00014

摘要： A radio-frequency power component and a radio-frequency power module, as well as to methods for producing them are encompassed. The radio-frequency power component has a semiconductor chip that is suitable for flip chip mounting. The semiconductor chip has an active upper face that produces power losses. This active upper face is covered by an electrically isolating layer leaving free contact surfaces, with a heat-dissipating metal layer being applied to its upper face. The metal layer directly dissipates the heat losses from the active semiconductor structures.

摘要翻译： 包括射频功率部件和射频功率模块以及其制造方法。 射频功率部件具有适用于倒装芯片安装的半导体芯片。 半导体芯片具有产生功率损耗的有源上表面。 该有源上表面被隔离层覆盖，留下自由的接触表面，散热金属层被施加到其上表面。 金属层直接消散有源半导体结构的热损失。

公开(公告)号：US07417198B2

公开(公告)日：2008-08-26

申请号：US10515236

申请日：2003-05-22

申请人： Bernd Betz ,  Jochen Dangelmaier ,  Rudolf Lehner ,  Stefan Paulus

发明人： Bernd Betz ,  Jochen Dangelmaier ,  Rudolf Lehner ,  Stefan Paulus

IPC分类号： H01L23/495 ,  H05K7/20

CPC分类号： H01L24/97 ,  H01L23/047 ,  H01L23/10 ,  H01L23/36 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L25/18 ,  H01L2223/6644 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/167 ,  H01L2924/16787 ,  H01L2924/1679 ,  H01L2924/181 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/2075

摘要： The invention relates to a radiofrequency power semiconductor module having a cavity housing constructed from three modules, a 1st module, which has an upwardly and downwardly open housing frame with horizontally arranged flat conductors, a 2nd module, which has the chip island as a heat sink with at least one radiofrequency semiconductor component, the 2nd module forming the bottom of the cavity housing, and a 3rd module, which has the housing cover.

摘要翻译： 本发明涉及一种具有由三个模块构成的空腔壳体的射频功率半导体模块，第一模块具有水平布置的扁平导体的向上和向下开放的壳体框架，第二模块具有芯片岛作为散热器 具有至少一个射频半导体部件，形成腔壳体底部的第二模块和具有壳体盖的第三模块。

公开(公告)号：US20060012016A1

公开(公告)日：2006-01-19

申请号：US10515236

申请日：2003-05-22

申请人： Bernd Betz ,  Jochen Dangelmaier ,  Rudolf Lehner ,  Stefan Paulus

发明人： Bernd Betz ,  Jochen Dangelmaier ,  Rudolf Lehner ,  Stefan Paulus

IPC分类号： H01L23/02

CPC分类号： H01L24/97 ,  H01L23/047 ,  H01L23/10 ,  H01L23/36 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L25/18 ,  H01L2223/6644 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/167 ,  H01L2924/16787 ,  H01L2924/1679 ,  H01L2924/181 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/2075

摘要： The invention relates to a radiofrequency power semiconductor module having a cavity housing constructed from three modules, a 1st module, which has an upwardly and downwardly open housing frame with horizontally arranged flat conductors, a 2nd module, which has the chip island as a heat sink with at least one radiofrequency semiconductor components, the 2nd module forming the bottom of the cavity housing, and a 3rd module, which has the housing cover.

摘要翻译： 本发明涉及一种具有由三个模块构成的空腔壳体的射频功率半导体模块，第一模块具有水平布置的扁平导体的向上和向下开放的壳体框架，第二模块具有芯片岛作为散热器 具有至少一个射频半导体部件，形成空腔壳体的底部的第二模块和具有壳体盖的第三模块。

公开(公告)号：US06895731B2

公开(公告)日：2005-05-24

申请号：US10739488

申请日：2003-12-18

申请人： Rudolf Lehner ,  Stefan Paulus

发明人： Rudolf Lehner ,  Stefan Paulus

IPC分类号： B65B9/04 ,  B65B15/04 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  B65B47/04

CPC分类号： H01L21/67126 ,  B65B9/045 ,  B65B15/04 ,  B65B47/10 ,  H01L21/67098 ,  H01L21/67144 ,  H05K13/0417 ,  H05K13/0452 ,  H05K13/08

摘要： An apparatus and a method for populating transport tapes with electronic components includes a mold support having at least one recess over which a flat plastic strip is disposed. A heater heats the mold support and/or the plastic strip in an area of the recesses. An embossing tool, which has the electronic component in its embossing area, together with the electronic component, is embossed into the plastic strip in the direction of the recess into the mold support to form a tape pocket.

摘要翻译： 用于用电子部件填充输送带的装置和方法包括具有至少一个凹部的模具支撑件，扁平塑料条设置在该凹部上。 加热器在凹部的区域中加热模具支撑件和/或塑料条。 将压电工具（其在其压花区域中的电子部件）与电子部件一起在凹进方向上压印到塑料条中以形成带状袋。

公开(公告)号：US06694707B2

公开(公告)日：2004-02-24

申请号：US10358953

申请日：2003-02-04

申请人： Rudolf Lehner ,  Stefan Paulus

发明人： Rudolf Lehner ,  Stefan Paulus

IPC分类号： B65B4702

CPC分类号： H01L21/67126 ,  B65B9/045 ,  B65B15/04 ,  B65B47/10 ,  H01L21/67098 ,  H01L21/67144 ,  H05K13/0417 ,  H05K13/0452 ,  H05K13/08

摘要： An apparatus and a method for populating transport tapes with electronic components includes a mold support having at least one recess over which a flat plastic strip is disposed. A heater heats the mold support and/or the plastic strip in an area of the recesses. An embossing tool, which has the electronic component in its embossing area, together with the electronic component, is embossed into the plastic strip in the direction of the recess into the mold support to form a tape pocket.

摘要翻译： 用于用电子部件填充输送带的装置和方法包括具有至少一个凹部的模具支撑件，扁平塑料条设置在该凹部上。 加热器在凹部的区域中加热模具支撑件和/或塑料条。 将压电工具（其在其压花区域中的电子部件）与电子部件一起在凹进方向上压印到塑料条中以形成带状袋。

公开(公告)号：US20060065967A1

公开(公告)日：2006-03-30

申请号：US11245440

申请日：2005-10-07

申请人： Rudolf Lehner

发明人： Rudolf Lehner

IPC分类号： H01L23/04

CPC分类号： H01L24/92 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/45 ,  H01L24/48 ,  H01L24/75 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/85001 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/9222 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2224/83205

摘要： An apparatus for singulating and bonding semiconductor chips includes a singulating station and a mounting station. In the singulating station, a semiconductor chip is provided with a bonding wire by a bonding tool and lifted off a carrier film. Then, in the mounting station, the semiconductor chip is placed on a chip mounting surface and fixed in place. The bonding wire is guided to a contact-connection surface of the circuit carrier and bonded to this surface.

摘要翻译： 用于单片化和键合半导体芯片的装置包括单工站和安装站。 在分割台中，半导体芯片通过接合工具设置有接合线，并从载体膜上提起。 然后，在安装台中，将半导体芯片放置在芯片安装面上并固定就位。 接合线被引导到电路载体的接触连接表面并结合到该表面。

公开(公告)号：US07754009B2

公开(公告)日：2010-07-13

申请号：US11528861

申请日：2006-09-28

申请人： Wolfgang Hensel ,  Rudolf Lehner ,  Helmut Schwenk

发明人： Wolfgang Hensel ,  Rudolf Lehner ,  Helmut Schwenk

IPC分类号： H01L21/302

CPC分类号： C30B29/06 ,  C30B33/00

摘要： Unpolished semiconductor wafers are produced by: (a) pulling a single crystal of a semiconductor material, (b) grinding the single crystal round, (c) separating a semiconductor wafer from this crystal, (d) rounding the edge of the semiconductor wafer, (e) surface-grinding at least one side of the semiconductor wafer, (f) treating the semiconductor wafer with an etchant, and (g) cleaning the semiconductor wafer. The unpolished semiconductor wafers have, on at least the front side, a reflectivity of 95% or more, a surface roughness of 3 nm or less, have a thickness of 80-2500 μm, an overall planarity value GBIR of 5 μm or less with an edge exclusion of 3 mm and a photolithographic resolution of at least 0.8 μm, and which furthermore contain a native oxide layer with a thickness of 0.5-3 nm on both sides.

摘要翻译： 未抛光的半导体晶片通过以下方法制造：（a）拉制半导体材料的单晶，（b）研磨单晶圆，（c）从该晶体分离半导体晶片，（d）使半导体晶片的边缘倒圆， （e）对所述半导体晶片的至少一侧进行表面研磨，（f）用蚀刻剂处理所述半导体晶片，以及（g）清洁所述半导体晶片。 未抛光的半导体晶片至少在前侧具有95％以上的反射率，3nm以下的表面粗糙度，其厚度为80〜2500μm，总平面度GBIR为5μm以下， 边缘排除为3mm，光刻分辨率为至少0.8μm，并且还包含两侧厚度为0.5-3nm的天然氧化物层。

公开(公告)号：US07245026B2

公开(公告)日：2007-07-17

申请号：US10174057

申请日：2002-06-17

申请人： Rudolf Lehner

发明人： Rudolf Lehner

IPC分类号： H01L23/48

CPC分类号： H01L24/744 ,  B23K2101/40 ,  H01L24/37 ,  H01L24/40 ,  H01L24/77 ,  H01L24/84 ,  H01L2224/37124 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19042

摘要： A configuration and method for contacting a circuit is described. A carrier is disposed adjacent a circuit, and a setting element at which an electrical connection formed of a conductive material is disposed, so that the electrical connection connects the circuit to the carrier in a bonding process. In this manner an efficient and cost effective method for connecting the circuit to carrier is performed.

摘要翻译： 描述用于接触电路的配置和方法。 载体邻近电路设置，并且设置由导电材料形成的电连接的设置元件，使得电连接在接合过程中将电路连接到载体。 以这种方式，执行用于将电路连接到载体的有效且成本有效的方法。

公开(公告)号：US06906428B2

公开(公告)日：2005-06-14

申请号：US10698081

申请日：2003-10-30

申请人： Rudolf Lehner

发明人： Rudolf Lehner

IPC分类号： H01L21/60 ,  H01L21/68 ,  H01L23/00 ,  H05K13/02 ,  H01L23/48

CPC分类号： H01L21/6835 ,  H01L23/562 ,  H01L24/81 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/11002 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2224/94 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01068 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19043 ,  H01L2224/11 ,  H01L2924/00

摘要： An electronic component and a method for populating a circuit carrier during the production of the electronic component includes providing the semiconductor chip with at least one buffer body on its active top side, which buffer body, during the populating method, protects the semiconductor component structures—disposed under the buffer body—of the active top side of the semiconductor chip against mechanical damage and has a protective layer of a mechanically damping material.

摘要翻译： 在制造电子部件期间，电子部件和填充电路载体的方法包括：在填充方法期间，半导体芯片在其有源顶侧提供至少一个缓冲体，保护半导体部件结构， 设置在半导体芯片的有源顶侧的缓冲体下面抵抗机械损伤并具有机械阻尼材料的保护层。