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    METHOD FOR PRODUCING STRUCTURED ELECTRICALLY CONDUCTIVE SURFACES
    6.
    发明申请
    METHOD FOR PRODUCING STRUCTURED ELECTRICALLY CONDUCTIVE SURFACES 审中-公开
    生产结构化电导体表面的方法

    公开(公告)号：US20090321123A1

    公开(公告)日：2009-12-31

    申请号：US12375702

    申请日：2007-07-31

    申请人： Rene Lochtman ,  Jürgen Kaczun ,  Norbert Schneider ,  Jürgen Pfister ,  Norbert Wagner ,  Dieter Hentschel

    发明人： Rene Lochtman ,  Jürgen Kaczun ,  Norbert Schneider ,  Jürgen Pfister ,  Norbert Wagner ,  Dieter Hentschel

    IPC分类号： H05K1/11 ,  C25D5/02 ,  H01B13/00 ,  B05D5/12

    CPC分类号： H05K3/4685 ,  H05K3/1241 ,  H05K3/246 ,  H05K3/4664 ,  H05K2201/0347 ,  H05K2203/0796

    摘要： The invention relates to a method for producing structured, electrically-conductive surfaces (3, 11) on an electrically nonconductive support (1), in which the structured and/or full-area electrically-conductive surfaces (3) of a first plane are applied onto the support (1) in a first step, an insulating layer (9) is applied in a second step at the positions where structured and/or full-area electrically-conductive surfaces (11) of a second plane cross the structured and/or full-area electrically-conductive surfaces (3) of the first plane and no electrical contact is intended to take place between the structured and/or full-area electrically-conductive surfaces of the first plane (3) and of the second plane (11), in a third step the structured and/or full-area electrically-conductive surfaces (11) of the second plane are applied according to the first step, and the second and third steps are optionally repeated.

    摘要翻译： 本发明涉及一种用于在不导电支撑件（1）上制造结构化的导电表面（3,11）的方法，其中第一平面的结构化和/或全区域导电表面（3） 在第一步骤中施加到支撑件（1）上，在第二步骤中，在第二平面的结构化和/或全区域导电表面（11）穿过结构化和/或 /或第一平面的全区域导电表面（3），并且不会在第一平面（3）和第二平面（3）的结构化和/或全区域导电表面之间发生电接触， （11），在第三步骤中，根据第一步骤施加第二平面的结构化和/或全区域导电表面（11），并且可选地重复第二和第三步骤。

    ELECTROPLATING DEVICE AND METHOD
    8.
    发明申请
    ELECTROPLATING DEVICE AND METHOD 审中-公开
    电镀设备和方法

    公开(公告)号：US20090101511A1

    公开(公告)日：2009-04-23

    申请号：US12297864

    申请日：2007-04-17

    申请人： Rene Lochtman ,  Juergen Kaczun ,  Norbert Schneider ,  Juergen Pfister ,  Gert Pohl ,  Norbert Wagner

    发明人： Rene Lochtman ,  Juergen Kaczun ,  Norbert Schneider ,  Juergen Pfister ,  Gert Pohl ,  Norbert Wagner

    IPC分类号： C25D17/28 ,  C25D5/00

    CPC分类号： C25D17/14 ,  C25D5/06 ,  C25D5/54 ,  C25D7/0621 ,  C25D17/005 ,  C25D17/12 ,  H05K3/241

    摘要： The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate (8) or a structured or full-surface electrically conductive surface on a nonconductive substrate (8), which comprises at least one bath, one anode and one cathode (1), the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the surface to be coated of the substrate and the substrate is transported through the bath. The cathode comprises at least one band (2) having at least one electrically conductive section (12), which is guided around at least two rotatable shafts (3). The invention furthermore relates to a method for the electrolytic coating of at least substrate, which is carried out in a device according to the invention, the band resting on the substrate for the coating and being circulated with a circulation speed which corresponds to the speed with which the substrate is guided through the bath. Lastly, the invention also relates to a use of the device according to the invention for the electrolytic coating of electrically conductive structures on an electrically nonconductive support.

    摘要翻译： 本发明涉及一种用于至少一个导电基板（8）或非导电基板（8）上的结构化或全表面导电表面的电解涂层的装置，其包括至少一个槽，一个阳极和一个阴极 （1），所述浴含有含有至少一种金属盐的电解质溶液，金属离子沉积在基板的导电表面上以形成金属层，同时使阴极与待涂覆的表面接触 衬底和衬底被输送通过浴。 阴极包括至少一个具有至少一个导电部分（12）的带（2），该导电部分围绕至少两个可旋转的轴（3）被引导。 本发明还涉及至少一种基材的电解涂覆方法，该方法是在根据本发明的装置中进行的，该带在基材上被放置并涂覆并循环，循环速度对应于与 衬底被引导通过浴。 最后，本发明还涉及根据本发明的装置在不导电支撑件上的导电结构的电解涂层的用途。

    ELECTROPLATING DEVICE AND METHOD
    10.
    发明申请
    ELECTROPLATING DEVICE AND METHOD 审中-公开
    电镀设备和方法

    公开(公告)号：US20090178930A1

    公开(公告)日：2009-07-16

    申请号：US12297330

    申请日：2007-04-05

    申请人： Rene Lochtman ,  Jürgen Kaczun ,  Norbert Schneider ,  Jürgen Pfister ,  Gert Pohl ,  Norbert Wagner

    发明人： Rene Lochtman ,  Jürgen Kaczun ,  Norbert Schneider ,  Jürgen Pfister ,  Gert Pohl ,  Norbert Wagner

    IPC分类号： C25D5/00 ,  C25D17/00

    CPC分类号： C25D17/12 ,  C25D7/0657 ,  C25D17/005 ,  C25D17/06 ,  C25D17/28

    摘要： The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a nonconductive substrate, which comprises at least one bath, one anode and one cathode, the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the substrate's surface to be coated and the substrate is transported through the bath, wherein the cathode comprises at least two disks (2, 4, 10) mounted on a respective shaft (1, 5, 14) so that they can rotate, the disks (2, 4, 10) engaging in one another. The invention furthermore relates to a method for the electrolytic coating of at least one substrate, which is carried out in a device according to the invention. Lastly, the invention also relates to a use of the device according to the invention for the electrolytic coating of electrically conductive structures on an electrically nonconductive support.

    摘要翻译： 本发明涉及一种用于至少一个导电基底或非导电基底上的结构化或全表面导电表面的电解涂层的装置，其包括至少一个浴，一个阳极和一个阴极，该浴含有电解质 含有至少一种金属盐的溶液，金属离子沉积在基材的导电表面上以形成金属层，同时使阴极与待涂覆的基底表面接触，并且将基底输送通过浴，其中 阴极包括安装在相应的轴（1,5,14）上的至少两个盘（2,4,10），使得它们可以旋转，盘（2,4,10）彼此接合。 本发明还涉及一种在根据本发明的装置中进行的至少一种基底的电解涂覆的方法。 最后，本发明还涉及根据本发明的装置在不导电支撑件上的导电结构的电解涂层的用途。