SUBSTRATE SUPPORT WITH SWITCHABLE MULTIZONE HEATER
    3.
    发明申请
    SUBSTRATE SUPPORT WITH SWITCHABLE MULTIZONE HEATER 有权
    基座支持与可切换多功能加热器

    公开(公告)号:US20140197151A1

    公开(公告)日:2014-07-17

    申请号:US13742639

    申请日:2013-01-16

    CPC classification number: H05B3/26 H01L21/67103 H05B1/0233

    Abstract: Embodiments of substrate supports with a heater are provided herein. In some embodiments, a substrate support may include a first member to distribute heat to a substrate when present above a first planar surface of the first member, a second member disposed beneath the first member, the second member including a plurality of resistive heating elements, wherein the plurality of resistive heating elements provide local temperature compensation to the first member to heat the substrate when present, a third member disposed beneath the second member, the third member including one or more base heating zones to provide a base temperature profile to the first member, and a fourth member disposed beneath the third member, the fourth member including a first set of electrical conductors coupled to each of the resistive heating elements.

    Abstract translation: 本文提供了具有加热器的基板支撑件的实施例。 在一些实施例中,衬底支撑件可以包括第一构件,用于当存在于第一构件的第一平面表面上方时将热量分配到衬底;第二构件,设置在第一构件下方,第二构件包括多个电阻加热元件, 其中所述多个电阻加热元件在存在时向所述第一构件提供局部温度补偿以加热所述基板,设置在所述第二构件下方的第三构件,所述第三构件包括一个或多个基座加热区以向所述第一构件提供基座温度曲线 以及设置在所述第三构件下方的第四构件,所述第四构件包括耦合到每个所述电阻加热元件的第一组电导体。

    DOORS FOR HIGH VOLUME, LOW COST SYSTEM FOR EPITAXIAL SILICON DEPOSITION
    4.
    发明申请
    DOORS FOR HIGH VOLUME, LOW COST SYSTEM FOR EPITAXIAL SILICON DEPOSITION 审中-公开
    用于外源硅沉积的高体积,低成本体系的门

    公开(公告)号:US20140060435A1

    公开(公告)日:2014-03-06

    申请号:US13721332

    申请日:2012-12-20

    Abstract: Apparatus for use in an inline substrate processing tool are provided herein. In some embodiments, a door for use in an inline substrate processing tool between a first and a second substrate processing module coupled to one another in a linear arrangement may include a reflective body disposed between two cover plates of substantially transparent material, configured to reflect light and heat energy into each of the at first and second substrate processing modules, wherein the door is selectively movable, via an actuator coupled to the door, between an open position that fluidly couples the first and second substrate processing modules to a closed position that isolates the first substrate processing module from the second substrate processing module.

    Abstract translation: 本文提供了用于在线基板处理工具中的装置。 在一些实施例中,在线性布置中彼此耦合的第一和第二基板处理模块之间的在线基板处理工具中使用的门可以包括设置在基本透明材料的两个盖板之间的反射体, 并且将热能分配到每个第一和第二基板处理模块中,其中门可选择性地通过耦合到门的致动器在将第一和第二基板处理模块流体耦合到打开位置之间选择性地移动,该打开位置将隔离 来自第二基板处理模块的第一基板处理模块。

    DUAL LOAD LOCK CHAMBER
    5.
    发明申请

    公开(公告)号:US20200350191A1

    公开(公告)日:2020-11-05

    申请号:US16933391

    申请日:2020-07-20

    Inventor: MICHAEL R. RICE

    Abstract: Dual load lock chambers for use in a multi-chamber processing system are disclosed herein. In some embodiments, a dual load lock chamber, includes a first load lock chamber having a first interior volume and a first substrate support, wherein the first substrate support includes a first plurality of support surfaces vertically spaced apart by a first predetermined distance; at least one heat transfer device disposed within the first substrate support to heat or cool the first plurality of substrates; and a second load lock chamber disposed adjacent to the first load lock chamber and having a second interior volume and a second substrate support, wherein the second substrate support includes a second plurality of support surfaces vertically spaced apart by a second predetermined distance that less than the first predetermined distance.

    DUAL LOAD LOCK CHAMBER
    6.
    发明申请

    公开(公告)号:US20190355600A1

    公开(公告)日:2019-11-21

    申请号:US15983683

    申请日:2018-05-18

    Inventor: MICHAEL R. RICE

    Abstract: Dual load lock chambers for use in a multi-chamber processing system are disclosed herein. In some embodiments, a dual load lock chamber, includes a first load lock chamber having a first interior volume and a first substrate support, wherein the first substrate support includes a first plurality of support surfaces vertically spaced apart by a first predetermined distance; at least one heat transfer device disposed within the first substrate support to heat or cool the first plurality of substrates; and a second load lock chamber disposed adjacent to the first load lock chamber and having a second interior volume and a second substrate support, wherein the second substrate support includes a second plurality of support surfaces vertically spaced apart by a second predetermined distance that less than the first predetermined distance.

    METHODS AND APPARATUS FOR SUBSTRATE EDGE CLEANING
    7.
    发明申请
    METHODS AND APPARATUS FOR SUBSTRATE EDGE CLEANING 审中-公开
    基板边缘清洗方法与装置

    公开(公告)号:US20170018441A1

    公开(公告)日:2017-01-19

    申请号:US15264082

    申请日:2016-09-13

    Abstract: A substrate cleaning apparatus may include a substrate support having a support surface to support a substrate to be cleaned, wherein the substrate support is rotatable about a central axis normal to the support surface; a first nozzle to provide a first cleaning gas to a region of the inner volume corresponding to the position of an edge of the substrate when the substrate is supported by the support surface of the substrate support; a first annular body disposed opposite and spaced apart from the support surface of the substrate support by a gap, the first annular body having a central opening defined by an inner wall shaped to provide a reducing size of the gap between the first annular body and the support surface in a radially outward direction; and a first gas inlet to provide a first gas to the central opening of the first annular body.

    Abstract translation: 基板清洁装置可以包括具有支撑表面以支撑要清洁的基板的基板支撑件,其中基板支撑件可绕垂直于支撑表面的中心轴线旋转; 第一喷嘴,用于当所述基板由所述基板支撑件的支撑表面支撑时,将第一清洁气体提供到所述内部体积的与所述基板的边缘的位置相对应的区域; 第一环形体,其通过间隙与衬底支撑件的支撑表面相对设置并间隔开,第一环形体具有由内壁限定的中心开口,内壁被成形为提供第一环形体和第二环形体之间的间隙的减小尺寸 支撑表面沿径向向外的方向; 以及第一气体入口,用于向第一环形体的中心开口提供第一气体。

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