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1.
公开(公告)号:US4714518A
公开(公告)日:1987-12-22
申请号:US3317
申请日:1987-01-14
IPC分类号: H01L21/283 , H01L21/285 , H01L21/311 , H01L21/314 , H01L21/318 , H01L33/00 , B44C1/22
CPC分类号: H01L21/314 , H01L21/28575 , H01L21/31116 , H01L21/3185
摘要: A method for providing a dual layer diffusion mask or encapsulation coating for use with III-V compound semiconductors, the dual layer coating comprising an inner layer of silicon which closely matches the coefficient of thermal expansion of the III-V compound semiconductor and an outer layer of silicon nitride which is relatively impermeable to subsequent metallization and for thereafter applying metallized contacts to the III-V compound semiconductor through selectively etched openings in the diffusion mask or encapsulation coating.
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公开(公告)号:US4510514A
公开(公告)日:1985-04-09
申请号:US521443
申请日:1983-08-08
申请人: Irfan Camlibel , Aland K. Chin
发明人: Irfan Camlibel , Aland K. Chin
IPC分类号: H01L29/45 , H01L31/0224 , H01L31/10 , H01L33/02 , H01L33/30 , H01L33/38 , H01L33/40 , H01L23/54
CPC分类号: H01L33/40 , H01L24/05 , H01L29/452 , H01L31/022416 , H01L2224/04042 , H01L2224/48463 , H01L33/02 , H01L33/30 , H01L33/38
摘要: Disclosed is an indium-containing semiconductor device which includes an ohmic contact formed by application of successive layers of Au-Sn-Cr-Au. The combination of Sn and Cr layers provides an effective barrier to the diffusion of indium to the surface of the contact so that bonding to the contact is not impeded.
摘要翻译: 公开了含铟半导体器件,其包括通过施加连续的Au-Sn-Cr-Au层形成的欧姆接触。 Sn和Cr层的组合提供了将铟扩散到接触表面的有效屏障,使得不会阻碍与接触的接合。
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公开(公告)号:US5204927A
公开(公告)日:1993-04-20
申请号:US844216
申请日:1992-03-02
申请人: Aland K. Chin , Jeffrey E. Bisberg
发明人: Aland K. Chin , Jeffrey E. Bisberg
CPC分类号: G02B6/4249 , G02B6/3839 , G02B6/4204 , Y10S359/90
摘要: In one embodiment, a process for manufacturing an optical fiber coupler of the invention utilizes a rotating drum that has a sloted portion or stacking slot for receiving multiple lengths of fiber in a stack. A support for the input ends of the fibers is in the form of a block which is secured to the surface of the drum in spaced relation with the slot. The block has a plurality of shallow, parallel spaced apart grooves in parallel alignment with the stacking slot. An end of the fiber is initially threaded preferably into the stacking slot and then sequentially located alternately in vacant grooves in the support. As the drum is rotated, a positioner operates to move the fiber transversely in the direction parallel to the drum axis so as to align the fiber in each respective one of the grooves and the slot for each rotation of the drum. The process continues until all the grooves are all occupied and the stacking slot is filled with a corresponding number of fiber lengths. The stacked output ends of the fibers are secured together by an appropriate adhesive and the input ends of the fibers are likewise secured in the grooves of the block by an appropriate adhesive. The fibers are severed at the input and output ends to allow for removal of one or more devices from the drum. The invention also includes the apparatus for performing the process and the resulting optical fiber coupler.
摘要翻译: 在一个实施例中,本发明的光纤耦合器的制造方法利用旋转滚筒,该旋转滚筒具有用于在堆叠中接收多束纤维的折边部分或堆叠槽。 对于纤维的输入端的支撑件是以与槽成间隔开的方式固定到滚筒表面的块的形式。 该块具有与堆叠槽平行对准的多个浅的,平行的间隔开的槽。 纤维的端部最初被优选地插入到堆叠槽中,然后顺序地定位在支撑件中的空槽中。 当滚筒旋转时,定位器操作以沿着平行于鼓轴线的方向横向移动纤维,以便在滚筒的每个旋转中将纤维对准在每个相应的一个槽和槽中。 该过程一直持续到所有的凹槽全部被占用,并且堆叠槽被填充相应数量的光纤长度。 纤维的堆叠输出端通过适当的粘合剂固定在一起,并且纤维的输入端同样通过适当的粘合剂固定在块的凹槽中。 纤维在输入和输出端被切断,以允许一个或多个装置从滚筒中移出。 本发明还包括用于执行处理的装置和由此产生的光纤耦合器。
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公开(公告)号:US10120151B1
公开(公告)日:2018-11-06
申请号:US14640863
申请日:2015-03-06
申请人: Aland K. Chin , Richard H. Chin , Alan Nelson
发明人: Aland K. Chin , Richard H. Chin , Alan Nelson
摘要: A cooling device includes a thermally conductive object having an opening configured to receive an optical component, the opening being configured such that the optical component is thermally and optically operationally connected to the thermally conductive and electrically conductive object. One or more cooling components, microchannel coolers in one instance, are also thermally operationally connected to the thermally conductive and electrically conductive object. Methods of use are disclosed.
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公开(公告)号:US4847119A
公开(公告)日:1989-07-11
申请号:US79583
申请日:1987-07-30
IPC分类号: B05C13/02 , G03F7/16 , H01L21/687
CPC分类号: G03F7/16 , B05C13/02 , H01L21/68707 , Y10T29/49998
摘要: There is disclosed a method and apparatus for easily mounting, holding and facilitating the coating of preselected areas of very thin semiconductor samples. The apparatus includes a base adapted for placement in a coating chamber. The base includes a pair of spaced apart supporting arms onto which a plurality of stacked samples can be loaded. A cover is then slidably positioned over the stacked samples to hold the stacked samples in position during coating. The cover in conjunction with the supporting arms define an open sided cavity to enable the samples to be coated. The apparatus also can be used to hold only one sample.
摘要翻译: 公开了一种用于容易地安装,保持和促进非常薄的半导体样品的预选区域的涂覆的方法和装置。 该装置包括适于放置在涂布室中的底座。 底座包括一对间隔开的支撑臂,多个堆叠的样品可以在其上装载。 然后将覆盖物可滑动地定位在堆叠的样品之上,以在涂覆期间将堆叠的样品保持在适当的位置。 与支撑臂结合的盖限定了敞开的侧面空腔,以使样品能够被涂覆。 该装置也可用于仅容纳一个样品。
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公开(公告)号:US4749255A
公开(公告)日:1988-06-07
申请号:US806492
申请日:1985-12-09
申请人: Utpal K. Chakrabarti , Aland K. Chin , George J. Przybylek , LeGrand G. Van Uitert , George J. Zydzik
发明人: Utpal K. Chakrabarti , Aland K. Chin , George J. Przybylek , LeGrand G. Van Uitert , George J. Zydzik
IPC分类号: H01L31/0264 , C23C14/08 , C23C14/30 , G02B1/11 , H01L21/314 , H01L21/316 , H01L31/04 , H01L33/00 , H01S5/00 , H01S5/028 , G02B1/10
CPC分类号: H01S5/028 , C23C14/083 , C23C14/30 , G02B1/113
摘要: Disclosed is a device including a surface coating for passivation or anti-reflection, and a method of manufacture. The coating comprises ZrO.sub.2 doped with yttrium, magnesium or calcium. The doped ZrO.sub.2 is preferably deposited on the device surface by electron-beam evaporation from a single crystal source of ZrO.sub.2 and Y.sub.2 O.sub.3, MgO or CaO.
摘要翻译: 公开了一种包括用于钝化或抗反射的表面涂层的装置及其制造方法。 该涂层包含掺杂有钇,镁或钙的ZrO 2。 掺杂的ZrO 2优选通过从ZrO 2和Y 2 O 3,MgO或CaO的单晶源的电子束蒸发沉积在器件表面上。
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公开(公告)号:US4605942A
公开(公告)日:1986-08-12
申请号:US658568
申请日:1984-10-09
申请人: Irfan Camlibel , Aland K. Chin , Brymer H. Chin
发明人: Irfan Camlibel , Aland K. Chin , Brymer H. Chin
CPC分类号: H01L33/0016 , G02B6/423 , G02B6/4249 , H01L25/0756 , H01L27/15 , H01L2924/0002
摘要: Presented is a dual wavelength structure wherein two edge-emitting devices are bonded with p-regions adjacent. The bonding medium is a conductive compound that forms a common electrode between the devices. Each device is separately addressable. Efficient coupling of emitted light into a single fiber is accomplished by restricting the vertical and horizontal separation of the light emitting stripes.
摘要翻译: 提出了双波长结构,其中两个边缘发射器件与邻近的p-区结合。 接合介质是在器件之间形成公共电极的导电化合物。 每个设备可单独寻址。 通过限制发光条纹的垂直和水平间隔来实现将发射的光有效地耦合到单个光纤中。
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公开(公告)号:US4443809A
公开(公告)日:1984-04-17
申请号:US402921
申请日:1982-07-29
申请人: Aland K. Chin , Bulusu V. Dutt
发明人: Aland K. Chin , Bulusu V. Dutt
IPC分类号: H01L31/0304 , H01L31/105 , H01L29/161
CPC分类号: H01L31/0304 , H01L31/105 , Y02E10/544
摘要: Photodiodes (10) are fabricated in a single step diffusion process which exploits the characteristic of certain acceptors to form an anomalous diffusion profile (VI) including shallow and deep fronts (VIa and b) joined by an upwardly concave segment (VIc). By performing this type of diffusion into a low-doped n.sup.- -type body (12) with a carrier concentration (VII) below that of the concave segment, a p.sup.+ -p.sup.- junction (15) is formed at the depth of the concave segment and a p.sup.- -n.sup.- junction (17) is formed at a greater depth. The zone (16) between the junctions is at least partially depleted and forms the active region of a p.sup.+ -p.sup.- -n.sup.- photodiode. Specifically described are InP:Cd photodiodes.
摘要翻译: 光电二极管(10)以单步扩散工艺制造,其利用某些受体的特性形成包括通过向上凹的段(VIc)连接的浅和深的前部(VIa和b)的异常扩散分布(VI)。 通过将这种类型的扩散进行到具有低于凹形段的载流子浓度(VII)的低掺杂n型体(12)中,在凹部的深度处形成p + - - 结(15) 段和p-n-结(17)形成在更大的深度。 结之间的区域(16)至少部分耗尽并形成p + -p-n-光电二极管的有源区。 具体描述了InP:Cd光电二极管。
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9.
公开(公告)号:US09496675B1
公开(公告)日:2016-11-15
申请号:US14324737
申请日:2014-07-07
申请人: William T. Plummer , Aland K. Chin
发明人: William T. Plummer , Aland K. Chin
CPC分类号: H01S3/094 , H01S3/067 , H01S3/06754 , H01S3/094007 , H01S3/094053 , H01S3/09408 , H01S3/09415 , H01S5/4025
摘要: Systems and methods that accept the emitted radiant power from such a combined diode laser structure (laser bar stack) and efficiently direct essentially all of it into the pump cladding of a double-clad fiber amplifier, such that the radiant power will then be absorbed by a rare-earth doped core in the active fiber.
摘要翻译: 接受来自这种组合二极管激光器结构(激光棒堆叠)的辐射功率的系统和方法,并且有效地将其全部引导到双包层光纤放大器的泵浦包层中,使得辐射功率将被 有源光纤中的稀土掺杂核心。
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10.
公开(公告)号:US08787414B1
公开(公告)日:2014-07-22
申请号:US13606733
申请日:2012-09-07
申请人: Aland K. Chin , Richard H. Chin
发明人: Aland K. Chin , Richard H. Chin
IPC分类号: H01S3/04
CPC分类号: H01S5/4025 , H01L23/44 , H01L23/473 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H01L2224/49175 , H01L2224/49431 , H01L2224/73265 , H01L2924/3011 , H01S5/02236 , H01S5/02276 , H01S5/02423 , H01S5/4018 , H01L2924/00014 , H01L2924/00
摘要: Systems and methods for providing a low stress electrode connection capable of carrying a high electrical current to an edge-emitting device, such as a laser diode are described. Systems and methods for providing mechanisms to allow precise adjustment of the relative position of one heat-sink for an optical edge emitting device relative to an adjacent heat-sink in a stack of heat-sinks are also provided herein.
摘要翻译: 描述了用于提供能够向诸如激光二极管的边缘发射装置承载高电流的低应力电极连接的系统和方法。 本文还提供了用于提供机构以允许精确调整光学边缘发射装置的一个散热器相对于散热片堆叠中的相邻散热器的相对位置的系统和方法。
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