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公开(公告)号：US08508034B2
公开(公告)日：2013-08-13
申请号：US13362644
申请日：2012-01-31
CPC分类号： H01L23/28 , B33Y80/00 , H01L21/4803 , H01L21/481 , H01L21/50 , H01L23/055 , H01L23/10 , H01L23/48 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L27/14618 , H01L27/14683 , H01L2224/0401 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/00011 , H01L2224/45099 , H01L2924/00
摘要： Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
摘要翻译： 公开了用于防潮图像传感器封装结构和组装方法的模制工具的各种实施例。 本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的外壳结构和透明盖。 壳体结构可以覆盖基本上所有的插入器芯片表面。 在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。 壳体结构还可以覆盖基本上所有的插入件附接表面。 图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。 壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。
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公开(公告)号：US06518654B1
公开(公告)日：2003-02-11
申请号：US09834415
申请日：2001-04-13
IPC分类号： H01L2302
CPC分类号： H01L21/561 , H01L21/565 , H01L23/3107 , H01L24/32 , H01L24/48 , H01L24/97 , H01L2224/05599 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/30107 , H05K3/303 , H05K3/305 , H05K3/3436 , H05K2201/10568 , H05K2201/10734 , H05K2201/10977 , H05K2201/2036 , Y02P70/613 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A ball grid array assembly includes a package cover that encapsulates a die and a portion of a substrate to which the die is attached, including an edge of the substrate. Encapsulation of the substrate edge by the cover reduces penetration of moisture or other contaminants into the substrate. The cover includes a rib that extends to contact a circuit board to which the ball grid array assembly is connected. With such a rib, planarity between the circuit board and the substrate is maintained during soldering.
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公开(公告)号：US07026548B2
公开(公告)日：2006-04-11
申请号：US11180493
申请日：2005-07-13
IPC分类号： H01L23/28
CPC分类号： H01L23/28 , B33Y80/00 , H01L21/4803 , H01L21/481 , H01L21/50 , H01L23/055 , H01L23/10 , H01L23/48 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L27/14618 , H01L27/14683 , H01L2224/0401 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/00011 , H01L2224/45099 , H01L2924/00
摘要： Various embodiments for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
摘要翻译： 公开了用于防潮图像传感器封装结构和组装方法的各种实施例。 本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的外壳结构和透明盖。 壳体结构可以覆盖基本上所有的插入器芯片表面。 在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。 壳体结构还可以覆盖基本上所有的插入件附接表面。 图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。 壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。
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公开(公告)号：US08716849B2
公开(公告)日：2014-05-06
申请号：US13438306
申请日：2012-04-03
IPC分类号： H01L23/495
CPC分类号： H01L23/3121 , H01L21/565 , H01L23/16 , H01L23/3107 , H01L23/49558 , H01L24/32 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. A stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.
摘要翻译： 提供了模制到诸如引线框架的半导体衬底的加强件以及将加强件模制到基底的方法。 加强件被模制到基底上以为基底提供刚性和支撑。 加强材料可以包括通过模制技术（例如传递模塑，注模和喷射模塑）或使用封装材料模制到基底上的聚合物材料。 可以在衬底上设置一个或多个管芯，芯片或其它半导体或微电子器件以形成管芯组件。 加强件可以模制到包括一个或多个管芯的基底上，在其上可以施加封装材料以制造半导体管芯封装。
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公开(公告)号：US20120187552A1
公开(公告)日：2012-07-26
申请号：US13438306
申请日：2012-04-03
IPC分类号： H01L23/31
CPC分类号： H01L23/3121 , H01L21/565 , H01L23/16 , H01L23/3107 , H01L23/49558 , H01L24/32 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.
摘要翻译： 提供了模制到诸如引线框架的半导体衬底的加强件以及将加强件模制到基底的方法。 加强件被模制到基底上以为基底提供刚性和支撑。 加强材料可以包括通过模制技术（例如传递模塑，注模和喷射模制）或使用封装材料模制到基底上的聚合物材料。 可以在衬底上设置一个或多个管芯，芯片或其它半导体或微电子器件以形成管芯组件。 加强件可以模制到包括一个或多个管芯的基底上，在其上可以施加封装材料以制造半导体管芯封装。
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公开(公告)号：US08115296B2
公开(公告)日：2012-02-14
申请号：US12579187
申请日：2009-10-14
CPC分类号： H01L23/28 , B33Y80/00 , H01L21/4803 , H01L21/481 , H01L21/50 , H01L23/055 , H01L23/10 , H01L23/48 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L27/14618 , H01L27/14683 , H01L2224/0401 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/00011 , H01L2224/45099 , H01L2924/00
摘要： Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
摘要翻译： 公开了用于防潮图像传感器封装结构和组装方法的模制工具的各种实施例。 本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的外壳结构和透明盖。 壳体结构可以覆盖基本上所有的插入器芯片表面。 在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。 壳体结构还可以覆盖基本上所有的插入件附接表面。 图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。 壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。
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公开(公告)号：US20100264532A1
公开(公告)日：2010-10-21
申请号：US12579187
申请日：2009-10-14
IPC分类号： H01L23/10
CPC分类号： H01L23/28 , B33Y80/00 , H01L21/4803 , H01L21/481 , H01L21/50 , H01L23/055 , H01L23/10 , H01L23/48 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L27/14618 , H01L27/14683 , H01L2224/0401 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/00011 , H01L2224/45099 , H01L2924/00
摘要： Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
摘要翻译： 公开了用于防潮图像传感器封装结构和组装方法的模制工具的各种实施例。 本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的壳体结构和透明盖。 壳体结构可以覆盖基本上所有的插入器芯片表面。 在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。 壳体结构还可以覆盖基本上所有的插入件附接表面。 图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。 壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。
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公开(公告)号：US08148803B2
公开(公告)日：2012-04-03
申请号：US10077554
申请日：2002-02-15
IPC分类号： H01L23/495
CPC分类号： H01L23/3121 , H01L21/565 , H01L23/16 , H01L23/3107 , H01L23/49558 , H01L24/32 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.
摘要翻译： 提供了模制到诸如引线框架的半导体衬底的加强件以及将加强件模制到基底的方法。 加强件被模制到基底上以为基底提供刚性和支撑。 加强材料可以包括通过模制技术（例如传递模塑，注模和喷射模制）或使用封装材料模制到基底上的聚合物材料。 可以在衬底上设置一个或多个管芯，芯片或其它半导体或微电子器件以形成管芯组件。 加强件可以模制到包括一个或多个管芯的基底上，在其上可以施加封装材料以制造半导体管芯封装。
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公开(公告)号：US07459773B2
公开(公告)日：2008-12-02
申请号：US11268095
申请日：2005-11-07
IPC分类号： H01L23/02
CPC分类号： H05K3/303 , H01L25/105 , H01L25/18 , H01L2225/1023 , H01L2225/1058 , H01L2225/1082 , H01L2924/0002 , H01L2924/15311 , H01L2924/3011 , H05K2201/10515 , H05K2201/10734 , H05K2203/167 , Y02P70/613 , H01L2924/00
摘要： A memory package having a plurality of vertically stacked ball grid arrays. Each of the vertically stacked ball grid arrays has a memory chip coupled thereto. Further, each of the plurality of ball grid arrays includes non-metal mateable alignment features. Each of the plurality of ball grid arrays is coupled to another of the plurality of ball grid arrays to from the vertically stacked memory package.
摘要翻译： 一种具有多个垂直堆叠的球栅阵列的存储器封装。 每个垂直堆叠的球栅阵列具有与其耦合的存储芯片。 此外，多个球栅阵列中的每一个包括非金属可对准的对准特征。 多个球栅阵列中的每一个耦合到多个球栅阵列中的另一个，以从垂直堆叠的存储器封装。
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公开(公告)号：US06953891B2
公开(公告)日：2005-10-11
申请号：US10663959
申请日：2003-09-16
IPC分类号： H01G4/00 , H01L21/48 , H01L23/055 , H01L23/28 , H01L27/146 , H05K5/06
CPC分类号： H01L23/28 , B33Y80/00 , H01L21/4803 , H01L21/481 , H01L21/50 , H01L23/055 , H01L23/10 , H01L23/48 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L27/14618 , H01L27/14683 , H01L2224/0401 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/00011 , H01L2224/45099 , H01L2924/00
摘要： Various embodiments for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
摘要翻译： 公开了用于防潮图像传感器封装结构和组装方法的各种实施例。 本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的壳体结构和透明盖。 壳体结构可以覆盖基本上所有的插入器芯片表面。 在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。 壳体结构还可以覆盖基本上所有的插入件附接表面。 图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。 壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。
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