公开(公告)号：US20110079922A1

公开(公告)日：2011-04-07

申请号：US12575078

申请日：2009-10-07

申请人： Chen-Hua Yu ,  Shin-Puu Jeng ,  Shang-Yun Hou ,  Hao-Yi Tsai ,  Hsien Wei Chen ,  Hsiu-Ping WEI

发明人： Chen-Hua Yu ,  Shin-Puu Jeng ,  Shang-Yun Hou ,  Hao-Yi Tsai ,  Hsien Wei Chen ,  Hsiu-Ping WEI

IPC分类号： H01L23/535 ,  H01L21/768

CPC分类号： H01L23/522 ,  H01L23/585 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2224/05552 ,  H01L2924/00

摘要： A structure includes a semiconductor substrate having semiconductor devices formed on or in the substrate. An interconnecting metallization structure is formed over and connected to the devices. The interconnecting metallization structure including at least one dielectric layer. A passivation layer is deposited over the interconnecting metallization structure and the dielectric layer. At least one metal contact pad and at least one dummy metal structure are provided in the passivation layer. The contact pad is conductively coupled to at least one of the devices. The dummy metal structure is spaced apart from the contact pad and unconnected to the contact pad and the devices.

摘要翻译： 一种结构包括具有形成在衬底上或衬底中的半导体器件的半导体衬底。 互连金属化结构形成在器件上并连接到器件。 互连金属化结构包括至少一个电介质层。 在互连金属化结构和电介质层上沉积钝化层。 在钝化层中提供至少一个金属接触焊盘和至少一个虚拟金属结构。 接触焊盘导电地耦合到至少一个设备。 虚拟金属结构与接触垫间隔开，并且不连接到接触垫和设备。

公开(公告)号：US08030776B2

公开(公告)日：2011-10-04

申请号：US12575078

申请日：2009-10-07

申请人： Chen-Hua Yu ,  Shin-Puu Jeng ,  Shang-Yun Hou ,  Hao-Yi Tsai ,  Hsien Wei Chen ,  Hsiu-Ping Wei

发明人： Chen-Hua Yu ,  Shin-Puu Jeng ,  Shang-Yun Hou ,  Hao-Yi Tsai ,  Hsien Wei Chen ,  Hsiu-Ping Wei

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/053 ,  H01L23/12 ,  H01L27/10 ,  H01L29/74

CPC分类号： H01L23/522 ,  H01L23/585 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2224/05552 ,  H01L2924/00

摘要： A structure includes a semiconductor substrate having semiconductor devices formed on or in the substrate. An interconnecting metallization structure is formed over and connected to the devices. The interconnecting metallization structure including at least one dielectric layer. A passivation layer is deposited over the interconnecting metallization structure and the dielectric layer. At least one metal contact pad and at least one dummy metal structure are provided in the passivation layer. The contact pad is conductively coupled to at least one of the devices. The dummy metal structure is spaced apart from the contact pad and unconnected to the contact pad and the devices.

摘要翻译： 一种结构包括具有形成在衬底上或衬底中的半导体器件的半导体衬底。 互连金属化结构形成在器件上并连接到器件。 互连金属化结构包括至少一个电介质层。 在互连金属化结构和电介质层上沉积钝化层。 在钝化层中提供至少一个金属接触焊盘和至少一个虚拟金属结构。 接触焊盘导电地耦合到至少一个设备。 虚拟金属结构与接触垫间隔开，并且不连接到接触垫和设备。

公开(公告)号：US09859235B2

公开(公告)日：2018-01-02

申请号：US12619503

申请日：2009-11-16

申请人： Yu-Wen Liu ,  Hao-Yi Tsai ,  Hsien-Wei Chen ,  Shin-Puu Jeng ,  Ying-Ju Chen ,  Shang-Yun Hou ,  Pei-Haw Tsao ,  Chen-Hua Yu

发明人： Yu-Wen Liu ,  Hao-Yi Tsai ,  Hsien-Wei Chen ,  Shin-Puu Jeng ,  Ying-Ju Chen ,  Shang-Yun Hou ,  Pei-Haw Tsao ,  Chen-Hua Yu

IPC分类号： H01L23/488 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L24/05 ,  H01L23/3157 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02125 ,  H01L2224/0215 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05018 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05096 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05541 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05566 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/13005 ,  H01L2224/13007 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/2064 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599

摘要： A system and method for forming an underbump metallization (UBM) is presented. A preferred embodiment includes a raised UBM which extends through a passivation layer so as to make contact with a contact pad while retaining enough of the passivation layer between the contact pad and the UBM to adequately handle the peeling and shear stress that results from CTE mismatch and subsequent thermal processing. The UBM contact is preferably formed in either an octagonal ring shape or an array of contacts.

公开(公告)号：US08368180B2

公开(公告)日：2013-02-05

申请号：US12619464

申请日：2009-11-16

申请人： Chen-Hua Yu ,  Shin-Puu Jeng ,  Hao-Yi Tsai ,  Shang-Yun Hou ,  Hsien-Wei Chen ,  Ming-Yen Chiu

发明人： Chen-Hua Yu ,  Shin-Puu Jeng ,  Hao-Yi Tsai ,  Shang-Yun Hou ,  Hsien-Wei Chen ,  Ming-Yen Chiu

IPC分类号： H01L23/544

CPC分类号： H01L21/78

摘要： A system and method for preventing defaults during singulation is presented. An embodiment comprises a dummy metal structure located in the scribe region. The dummy metal structure comprises a series of alternating dummy lines that are connected through dummy vias. The dummy lines are offset from dummy lines in adjacent metal layers. Additionally, the dummy lines and dummy vias in the upper layers of the scribe line may be formed with larger dimensions than the dummy lines and dummy vias located in the lower layers.

摘要翻译： 提出了一种在分割过程中防止违约的系统和方法。 一个实施例包括位于划线区域中的虚拟金属结构。 虚拟金属结构包括通过虚拟通孔连接的一系列交替虚拟线。 伪线与相邻金属层中的虚拟线偏移。 此外，划线的上层中的虚拟线和虚拟通路可以形成为具有比位于下层中的虚拟线和虚拟通孔更大的尺寸。

公开(公告)号：US20100123219A1

公开(公告)日：2010-05-20

申请号：US12347184

申请日：2008-12-31

申请人： Hsien-Wei Chen ,  Yu-Wen Liu ,  Jyh-Cherng Sheu ,  Hao-Yi Tsai ,  Shin-Puu Jeng ,  Chen-Hua Yu ,  Shang-Yun Hou

发明人： Hsien-Wei Chen ,  Yu-Wen Liu ,  Jyh-Cherng Sheu ,  Hao-Yi Tsai ,  Shin-Puu Jeng ,  Chen-Hua Yu ,  Shang-Yun Hou

IPC分类号： H01L23/544

CPC分类号： H01L23/3677 ,  B23K26/364 ,  B23K26/40 ,  B23K2103/172 ,  H01L21/78 ,  H01L22/34 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated circuit structure includes a first chip including a first edge; and a second chip having a second edge facing the first edge. A scribe line is between and adjoining the first edge and the second edge. A heat spreader includes a portion in the scribe line, wherein the heat spreader includes a plurality of vias and a plurality of metal lines. The portion of the heat spreader in the scribe line has a second length at least close to, or greater than, a first length of the first edge.

摘要翻译： 集成电路结构包括：第一芯片，包括第一边缘; 以及具有面向第一边缘的第二边缘的第二芯片。 划线在第一边缘和第二边缘之间并相邻。 散热器包括划线中的一部分，其中散热器包括多个通孔和多个金属线。 散热器在划线中的部分具有至少接近或大于第一边缘的第一长度的第二长度。

公开(公告)号：US20110127648A1

公开(公告)日：2011-06-02

申请号：US13023151

申请日：2011-02-08

申请人： Hsien-Wei Chen ,  Yu-Wen Liu ,  Jyh-Cherng Sheu ,  Hao-Yi Tsai ,  Shin-Puu Jeng ,  Chen-Hua Yu ,  Shang-Yun Hou

发明人： Hsien-Wei Chen ,  Yu-Wen Liu ,  Jyh-Cherng Sheu ,  Hao-Yi Tsai ,  Shin-Puu Jeng ,  Chen-Hua Yu ,  Shang-Yun Hou

IPC分类号： H01L23/544 ,  H01L23/34

CPC分类号： H01L23/3677 ,  B23K26/364 ,  B23K26/40 ,  B23K2103/172 ,  H01L21/78 ,  H01L22/34 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated circuit structure includes a first chip including a first edge; and a second chip having a second edge facing the first edge. A scribe line is between and adjoining the first edge and the second edge. A heat spreader includes a portion in the scribe line, wherein the heat spreader includes a plurality of vias and a plurality of metal lines. The portion of the heat spreader in the scribe line has a second length at least close to, or greater than, a first length of the first edge.

摘要翻译： 集成电路结构包括：第一芯片，包括第一边缘; 以及具有面向第一边缘的第二边缘的第二芯片。 划线在第一边缘和第二边缘之间并相邻。 散热器包括划线中的一部分，其中散热器包括多个通孔和多个金属线。 散热器在划线中的部分具有至少接近或大于第一边缘的第一长度的第二长度。

公开(公告)号：US07906836B2

公开(公告)日：2011-03-15

申请号：US12347184

申请日：2008-12-31

申请人： Hsien-Wei Chen ,  Yu-Wen Liu ,  Jyh-Cherng Sheu ,  Hao-Yi Tsai ,  Shin-Puu Jeng ,  Chen-Hua Yu ,  Shang-Yun Hou

发明人： Hsien-Wei Chen ,  Yu-Wen Liu ,  Jyh-Cherng Sheu ,  Hao-Yi Tsai ,  Shin-Puu Jeng ,  Chen-Hua Yu ,  Shang-Yun Hou

IPC分类号： H01L23/34

CPC分类号： H01L23/3677 ,  B23K26/364 ,  B23K26/40 ,  B23K2103/172 ,  H01L21/78 ,  H01L22/34 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated circuit structure includes a first chip including a first edge; and a second chip having a second edge facing the first edge. A scribe line is between and adjoining the first edge and the second edge. A heat spreader includes a portion in the scribe line, wherein the heat spreader includes a plurality of vias and a plurality of metal lines. The portion of the heat spreader in the scribe line has a second length at least close to, or greater than, a first length of the first edge.

摘要翻译： 集成电路结构包括：第一芯片，包括第一边缘; 以及具有面向第一边缘的第二边缘的第二芯片。 划线在第一边缘和第二边缘之间并相邻。 散热器包括划线中的一部分，其中散热器包括多个通孔和多个金属线。 散热器在划线中的部分具有至少接近或大于第一边缘的第一长度的第二长度。

公开(公告)号：US20100187687A1

公开(公告)日：2010-07-29

申请号：US12619503

申请日：2009-11-16

申请人： Yu-Wen Liu ,  Hao-Yi Tsai ,  Hsien-Wei Chen ,  Shin-Puu Jeng ,  Ying-Ju Chen ,  Shang-Yun Hou ,  Pei-Haw Tsao ,  Chen-Hua Yu

发明人： Yu-Wen Liu ,  Hao-Yi Tsai ,  Hsien-Wei Chen ,  Shin-Puu Jeng ,  Ying-Ju Chen ,  Shang-Yun Hou ,  Pei-Haw Tsao ,  Chen-Hua Yu

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L24/05 ,  H01L23/3157 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02125 ,  H01L2224/0215 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05018 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05096 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05541 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05566 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/13005 ,  H01L2224/13007 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/2064 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599

摘要： A system and method for forming an underbump metallization (UBM) is presented. A preferred embodiment includes a raised UBM which extends through a passivation layer so as to make contact with a contact pad while retaining enough of the passivation layer between the contact pad and the UBM to adequately handle the peeling and shear stress that results from CTE mismatch and subsequent thermal processing. The UBM contact is preferably formed in either an octagonal ring shape or an array of contacts.

摘要翻译： 提出了一种用于形成底部金属化（UBM）的系统和方法。 优选实施例包括凸起的UBM，其延伸穿过钝化层以便与接触焊盘接触，同时在接触焊盘和UBM之间保留足够的钝化层以充分地处理由CTE失配引起的剥离和剪切应力， 后续热处理。 UBM触点优选地形成为八边形环形或触点阵列。

公开(公告)号：US20100207251A1

公开(公告)日：2010-08-19

申请号：US12619464

申请日：2009-11-16

申请人： Chen-Hua Yu ,  Shin-Puu Jeng ,  Hao-Yi Tsai ,  Shang-Yun Hou ,  Hsien-Wei Chen ,  Ming-Yen Chiu

发明人： Chen-Hua Yu ,  Shin-Puu Jeng ,  Hao-Yi Tsai ,  Shang-Yun Hou ,  Hsien-Wei Chen ,  Ming-Yen Chiu

IPC分类号： H01L23/544 ,  H01L21/00

CPC分类号： H01L21/78

摘要： A system and method for preventing defaults during singulation is presented. An embodiment comprises a dummy metal structure located in the scribe region. The dummy metal structure comprises a series of alternating dummy lines that are connected through dummy vias. The dummy lines are offset from dummy lines in adjacent metal layers. Additionally, the dummy lines and dummy vias in the upper layers of the scribe line may be formed with larger dimensions than the dummy lines and dummy vias located in the lower layers.

摘要翻译： 提出了一种在分割过程中防止违约的系统和方法。 一个实施例包括位于划线区域中的虚拟金属结构。 虚拟金属结构包括通过虚拟通孔连接的一系列交替虚拟线。 伪线与相邻金属层中的虚拟线偏移。 此外，划线的上层中的虚线和虚拟通路可以形成为具有比位于下层中的虚拟线和虚拟通孔更大的尺寸。

公开(公告)号：US08860208B2

公开(公告)日：2014-10-14

申请号：US13023151

申请日：2011-02-08

申请人： Hsien-Wei Chen ,  Yu-Wen Liu ,  Jyh-Cherng Sheu ,  Hao-Yi Tsai ,  Shin-Puu Jeng ,  Chen-Hua Yu ,  Shang-Yun Hou

发明人： Hsien-Wei Chen ,  Yu-Wen Liu ,  Jyh-Cherng Sheu ,  Hao-Yi Tsai ,  Shin-Puu Jeng ,  Chen-Hua Yu ,  Shang-Yun Hou

IPC分类号： H01L23/34 ,  H01L23/58 ,  H01L21/78 ,  H01L23/367 ,  B23K26/36 ,  B23K26/40 ,  H01L21/66

CPC分类号： H01L23/3677 ,  B23K26/364 ,  B23K26/40 ,  B23K2103/172 ,  H01L21/78 ,  H01L22/34 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated circuit structure includes a first chip including a first edge; and a second chip having a second edge facing the first edge. A scribe line is between and adjoining the first edge and the second edge. A heat spreader includes a portion in the scribe line, wherein the heat spreader includes a plurality of vias and a plurality of metal lines. The portion of the heat spreader in the scribe line has a second length at least close to, or greater than, a first length of the first edge.

摘要翻译： 集成电路结构包括：第一芯片，包括第一边缘; 以及具有面向第一边缘的第二边缘的第二芯片。 划线在第一边缘和第二边缘之间并相邻。 散热器包括划线中的一部分，其中散热器包括多个通孔和多个金属线。 散热器在划线中的部分具有至少接近或大于第一边缘的第一长度的第二长度。