公开(公告)号：US08598768B2

公开(公告)日：2013-12-03

申请号：US13316590

申请日：2011-12-12

申请人： Chi Hoon Jun ,  Sang Choon Ko ,  Jong Tae Moon

发明人： Chi Hoon Jun ,  Sang Choon Ko ,  Jong Tae Moon

IPC分类号： H01L41/08

CPC分类号： H01L41/29 ,  H01L41/1136 ,  H01L41/31 ,  H01L41/316 ,  H01L41/317 ,  H01L41/318 ,  H02N2/188 ,  Y10T29/42

摘要： Disclosed is a piezoelectric micro energy harvester and manufacturing method thereof, the method including: forming an insulation film on a substrate; patterning the insulation film and forming an electrode pad pattern, a center electrode pattern, and a side electrode pattern; forming an open cavity at an inside of the substrate for suspension of the center electrode pattern and the side electrode pattern; disposing a conductive film on the electrode pad pattern, the center electrode pattern, and the side electrode pattern and forming electrode pads, a center electrode, and a side electrode; and forming a piezoelectric film so as to cover a space between the center electrode and the side electrode and upper surfaces of the center electrode and the side electrode.

摘要翻译： 公开了一种压电微能量收集器及其制造方法，该方法包括：在基板上形成绝缘膜; 图案化绝缘膜并形成电极焊盘图案，中心电极图案和侧面电极图案; 在所述基板的内部形成开放空腔，以悬浮所述中心电极图案和所述侧面电极图案; 在电极焊盘图形，中心电极图案和侧面电极图案上设置导电膜，形成电极焊盘，中心电极和侧面电极; 以及形成压电膜以覆盖中心电极和侧电极之间的空间以及中心电极和侧电极的上表面。

公开(公告)号：US20110018670A1

公开(公告)日：2011-01-27

申请号：US12648117

申请日：2009-12-28

申请人： Hyun-Cheol BAE ,  Kwang-Seong Choi ,  Yong Sung Eom ,  Jong Tae Moon ,  Moo Jung Chu ,  Jong-Hyun Lee

发明人： Hyun-Cheol BAE ,  Kwang-Seong Choi ,  Yong Sung Eom ,  Jong Tae Moon ,  Moo Jung Chu ,  Jong-Hyun Lee

IPC分类号： H01F5/00

CPC分类号： H01F17/0013 ,  H01F2017/002 ,  H01L2224/48091 ,  H01L2224/73257 ,  H01L2924/19107 ,  H01L2924/00014

摘要： Provided is an electronic device that includes an LTCC inductor including a first sheet disposed on a substrate and including a first conductive pattern, a second sheet disposed on the first sheet and including a second conductive pattern, and a via electrically connecting the first conductive pattern to the second conductive pattern, and a spacer disposed on a lower surface of the first sheet to provide an air gap between the substrate and the first sheet, wherein the first conductive pattern is exposed out of the lower surface of the first sheet.

摘要翻译： 提供一种电子设备，其包括LTCC电感器，其包括设置在基板上的第一片，并且包括第一导电图案，设置在第一片上并包括第二导电图案的第二片，以及将第一导电图案电连接到 第二导电图案和设置在第一片的下表面上的间隔件，以在基片和第一片之间提供气隙，其中第一导电图案从第一片的下表面露出。

公开(公告)号：US20100320596A1

公开(公告)日：2010-12-23

申请号：US12565171

申请日：2009-09-23

申请人： Yong Sung Eom ,  Kwang-Seong Choi ,  Hyun-Cheol Bae ,  Jong-Hyun Lee ,  Jong Tae Moon

发明人： Yong Sung Eom ,  Kwang-Seong Choi ,  Hyun-Cheol Bae ,  Jong-Hyun Lee ,  Jong Tae Moon

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L24/81 ,  H01L21/486 ,  H01L21/563 ,  H01L23/29 ,  H01L23/293 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/1134 ,  H01L2224/1152 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/81192 ,  H01L2224/818 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Provided is a method for fabricating semiconductor package and a semiconductor package fabricated using the same. The method for fabricating semiconductor package dopes a mixture including the polymer material and the solder particle on the substrate in which the terminal is formed and applies heat, and thus the solder particle flows (or diffuses) toward the terminal in the heated polymer resin to adhere to the exposed surface of the terminal, i.e., the side surface and upper surface of the terminal, thereby forming the solder layer. The solder layer improves the adhesive strength between the terminal of the semiconductor chip and the terminal of the substrate in the subsequent flip chip bonding process.

摘要翻译： 提供一种制造半导体封装的方法和使用其制造的半导体封装。 制造半导体封装的方法在形成端子的基板上涂覆包括聚合物材料和焊料颗粒的混合物，并施加热量，从而焊料颗粒向加热的聚合物树脂中的端子流动（或扩散）以粘附 到端子的暴露表面，即端子的侧表面和上表面，从而形成焊料层。 焊料层在随后的倒装芯片接合工艺中提高了半导体芯片的端子和衬底的端子之间的粘合强度。

公开(公告)号：US20080297299A1

公开(公告)日：2008-12-04

申请号：US12053716

申请日：2008-03-24

申请人： Ho Gyeong Yun ,  Kwang Seong Choi ,  Jong Tae Moon

发明人： Ho Gyeong Yun ,  Kwang Seong Choi ,  Jong Tae Moon

IPC分类号： H01F5/00

CPC分类号： H01F17/0013 ,  H01F17/0033 ,  H01F27/34 ,  H01F2017/002

摘要： Provided are an inductor, which is vertically formed, and an electronic device having the inductor, and more particularly, an inductor capable of minimizing loss of a surface area and accomplishing high efficiency impedance by vertically forming the inductor in a plurality of insulating layers, and an electronic device having the same. The inductor includes a plurality of conductive lines disposed in the insulating layers; and vias vertically formed in the insulating layers to electrically connect the plurality of conductive lines. When a board or an electronic device including an inductor proposed by the present invention is manufactured, the inductor can occupy a minimum area in the electronic device or board while providing high inductance. In particular, the surface area of the electronic device or board occupied by the inductor can be remarkably decreased to reduce manufacturing costs.

摘要翻译： 提供了一种垂直形成的电感器，以及具有电感器的电子器件，更具体地说，一种电感器，其能够通过在多个绝缘层中垂直形成电感器来最小化表面积的损失并实现高效率阻抗，以及 具有该电子设备的电子设备。 电感器包括布置在绝缘层中的多条导线; 以及在绝缘层中垂直形成的通孔，以电连接多条导线。 当制造包括由本发明提出的电感器的电路板或电子设备时，电感器可以在提供高电感的同时占据电子设备或电路板中的最小面积。 特别地，电感器占用的电子设备或板的表面积可以显着降低，从而降低制造成本。

公开(公告)号：US07298933B2

公开(公告)日：2007-11-20

申请号：US11148906

申请日：2005-06-09

申请人： Kwang Seong Choi ,  Jong Hyun Lee ,  Yong Duck Chung ,  Young Shik Kang ,  Jong Tae Moon ,  Je Ha Kim

发明人： Kwang Seong Choi ,  Jong Hyun Lee ,  Yong Duck Chung ,  Young Shik Kang ,  Jong Tae Moon ,  Je Ha Kim

IPC分类号： G02F1/01 ,  G02F1/35

CPC分类号： G02F1/0356

摘要： Provided is an optical module including a microstrip line, a traveling wave type optical device positioned in the end of the microstrip line, and at least one balanced open stub connected to the microstrip line for the impedance matching at a specific frequency such as 40 GHz and 60 GHz. For the fine tuning, laser trimming can be applied to the stub. A transition region is formed between the optical device and the microstrip line. A termination resistor is formed to face the microstrip line with the optical device therebetween. A bandwidth can be controlled at a specific frequency by adjusting a number of the stubs or a value of the termination resistor.

摘要翻译： 提供了一种光学模块，其包括微带线，位于微带线的端部的行波型光学器件和连接到微带线的至少一个平衡的开路短路，用于在特定频率例如40GHz的阻抗匹配，以及 60 GHz。 对于微调，激光修剪可以应用于存根。 在光学器件和微带线之间形成过渡区域。 形成终端电阻器，以便在其间具有光学器件来面对微带线。 可以通过调整短路的数量或终端电阻的值来控制带宽在特定频率。

公开(公告)号：US08524571B2

公开(公告)日：2013-09-03

申请号：US13309582

申请日：2011-12-02

申请人： Jong Tae Moon ,  Yong Sung Eom ,  Hyun-Cheol Bae

发明人： Jong Tae Moon ,  Yong Sung Eom ,  Hyun-Cheol Bae

IPC分类号： H01L21/30 ,  H01L21/46 ,  H01L41/00

CPC分类号： B81C1/00293 ,  B81C2203/0145 ,  B81C2203/035 ,  H01L21/50 ,  H01L23/10 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/291 ,  H01L2224/81815 ,  H01L2224/83815 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/05552

摘要： Disclosed is a vacuum wafer level packaging method for a micro electro mechanical system device, including: forming a plurality of via holes on an upper wafer for protecting a micro electro mechanical system (MEMS) wafer; forming at least one metal layer on inner walls of the plurality of via holes and regions extended from the plurality of via holes; arranging and bonding the upper wafer and the MEMS wafer at atmospheric pressure; applying solder paste to the regions extended from the plurality of via holes; filling a solder in the plurality of via holes by increasing the temperature of a high-vacuum chamber to melt the solder paste; and changing the solder in the plurality of via holes to a solid state by lowering the temperature of the high-vacuum chamber.

摘要翻译： 公开了一种用于微机电系统装置的真空晶片级封装方法，包括：在上晶片上形成多个通孔，用于保护微机电系统（MEMS）晶片; 在所述多个通孔的内壁和从所述多个通孔延伸的区域中形成至少一个金属层; 在大气压下布置和粘合上晶片和MEMS晶片; 将焊膏施加到从所述多个通孔延伸的区域; 通过增加高真空室的温度来熔化焊膏，在多个通孔中填充焊料; 并且通过降低高真空室的温度将多个通孔中的焊料改变为固态。

公开(公告)号：US20120288983A1

公开(公告)日：2012-11-15

申请号：US13459560

申请日：2012-04-30

申请人： Moo Jung Chu ,  Ju Mi Kim ,  Yong Sung Eom ,  Ah Ram Jeon ,  Jong Tae Moon

发明人： Moo Jung Chu ,  Ju Mi Kim ,  Yong Sung Eom ,  Ah Ram Jeon ,  Jong Tae Moon

IPC分类号： H01L31/18

CPC分类号： H01G9/2081 ,  Y02E10/542 ,  Y02P70/521

摘要： Disclosed is a method for manufacturing a dye sensitized solar cell module. The method includes putting at least one or more heating-wires on an upper portion of an electrode of each solar cell sub-module; applying a metal paste on the upper portion of the electrode including at least one or more heating-wires; and heating and curing the metal paste by after overlapping the electrodes of a plurality of solar cell sub-modules each other, allowing a current to flow to at least one or more heating-wires.

摘要翻译： 公开了一种染料敏化太阳能电池模块的制造方法。 该方法包括在每个太阳能电池子模块的电极的上部放置至少一根或多根加热线; 在包括至少一个或多个加热丝的电极的上部上施加金属膏; 并且通过在多个太阳能电池子模块的电极彼此重叠之后加热和固化金属浆料，允许电流流向至少一个或多个加热线。

公开(公告)号：US20120154072A1

公开(公告)日：2012-06-21

申请号：US13294204

申请日：2011-11-11

申请人： Hyun-Cheol Bae ,  Jong Tae Moon

发明人： Hyun-Cheol Bae ,  Jong Tae Moon

IPC分类号： H03H9/70 ,  H01F41/00

CPC分类号： H03H9/706 ,  H03H9/0557 ,  H03H9/0561 ,  H03H9/0571 ,  Y10T29/4902

摘要： Disclosed is a fabrication method for miniaturizing a film bulk acoustic wave resonator (FBAR) duplexer module including two FBAR filters, a tuning inductor, and a phase shifter. An exemplary embodiment of the present disclosure provides a method of miniaturizing a FBAR duplexer module, including forming a tuning inductor in a multilayer printed circuit board (PCB), forming a phase shifter in the multilayer PCB, and forming at least one of a transmitting FBAR filter and a receiving FBAR filter in the multilayer PCB.

摘要翻译： 公开了一种用于使包括两个FBAR滤波器，调谐电感器和移相器的薄膜压电谐振器（FBAR）双工器模块小型化的制造方法。 本公开的示例性实施例提供了一种使FBAR双工器模块小型化的方法，包括在多层印刷电路板（PCB）中形成调谐电感器，在多层PCB中形成移相器，以及形成传输FBAR 过滤器和多层PCB中的接收FBAR滤波器。

公开(公告)号：US20100142115A1

公开(公告)日：2010-06-10

申请号：US12499762

申请日：2009-07-08

申请人： Hyun-Cheol Bae ,  Kwang-Seong Choi ,  Ju Yeon Hong ,  Jong Tae Moon ,  Yong il Jun

发明人： Hyun-Cheol Bae ,  Kwang-Seong Choi ,  Ju Yeon Hong ,  Jong Tae Moon ,  Yong il Jun

IPC分类号： H01G5/00 ,  H01G7/00 ,  B32B38/04

CPC分类号： H01G4/30 ,  H01G4/232 ,  H01G4/38 ,  H01G4/40 ,  H05K1/0206 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/4629 ,  H05K2201/0187 ,  H05K2201/09672 ,  H05K2201/0969 ,  H05K2203/171 ,  Y10T29/43 ,  Y10T156/1056

摘要： Provided are a buried capacitor, a method of manufacturing the same, and a method of changing a capacitance thereof. The buried capacitor includes an upper electrode including at least one first hole, a lower electrode including at least one second hole, and a dielectric interposed between the upper electrode and the lower electrode.

摘要翻译： 提供一种埋电容器，其制造方法和改变其电容的方法。 掩埋电容器包括上电极，其包括至少一个第一孔，包括至少一个第二孔的下电极和介于上电极和下电极之间的电介质。

公开(公告)号：US20080285978A1

公开(公告)日：2008-11-20

申请号：US12053694

申请日：2008-03-24

申请人： Kwang Seong Choi ,  Yong Duck Chung ,  Jae Sik Sim ,  Jong Tae Moon ,  Hyun Kyu Yu ,  Je Ha Kim

发明人： Kwang Seong Choi ,  Yong Duck Chung ,  Jae Sik Sim ,  Jong Tae Moon ,  Hyun Kyu Yu ,  Je Ha Kim

IPC分类号： H04B10/00

CPC分类号： H04B10/25752 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2924/00014

摘要： Provided is an optical hybrid module in which an optical device, a filter, an amplifier and an antenna are hybrid-integrated, which includes: a silicon optical bench disposed on a substrate and having an optical fiber and an optical device; an amplifier disposed on the substrate and connected to the optical device disposed on the silicon optical bench to amplify a signal transmitted from the optical device; and an antenna disposed on the substrate to be connected to the amplifier and transmitting a signal amplified by the amplifier. Thus, a foot-print module may be embodied by disposing an antenna and a filter on a single- or multi-layer substrate and providing a bias required for the optical device and the amplifier through a solder ball. Also, due to the antenna and filter disposed on the substrate, an expensive connector is not needed, and thus a production costs can be reduced.

摘要翻译： 提供了一种光混合模块，其中光学装置，滤波器，放大器和天线是混合集成的，其包括：设置在基板上并具有光纤和光学装置的硅光学台; 放大器，设置在所述基板上并连接到设置在所述硅光学台上的所述光学装置，以放大从所述光学装置发送的信号; 以及设置在所述基板上以连接到所述放大器并且发射由所述放大器放大的信号的天线。 因此，可以通过在单层或多层衬底上设置天线和滤波器并通过焊球提供光学器件和放大器所需的偏置来实现脚印模块。 此外，由于设置在基板上的天线和滤波器，不需要昂贵的连接器，因此可以降低生产成本。