公开(公告)号：US08666456B2

公开(公告)日：2014-03-04

申请号：US13585840

申请日：2012-08-15

Applicant: Cheng-Hsi Liu ,  Pi-Lin Lo ,  Jih-Jonq Shiue ,  Chung-Ju Wu

Inventor： Cheng-Hsi Liu ,  Pi-Lin Lo ,  Jih-Jonq Shiue ,  Chung-Ju Wu

IPC: H04M1/00 ,  G06F3/041 ,  H04M1/725

CPC classification number: H04M1/72519 ,  G06F1/1626 ,  G06F1/1637 ,  G06F1/169 ,  G06F3/04886 ,  G06F2203/0339 ,  H04M1/22 ,  H04M2250/22

Abstract: A handheld electronic apparatus including a casing, a cover, a motherboard, an in-cell touch display module, a light guide member, and a touch module is provided. The cover covers a casing opening, and constitutes an accommodation space with the casing. The cover has a first area and a second area having a light transmissive icon. The motherboard is electrically connected with the in-cell touch display module and the touch module. The in-cell touch display module has a display area disposed beneath the first area. The light guide member is disposed within the accommodation space, and capable of guiding a light generated from a light emitting element to the light transmissive icon. The light guide member has a sheet-shaped portion disposed beneath the second area by corresponding to the light transmissive icon. The touch module is disposed within the accommodation space and beneath the second area.

Abstract translation: 提供了一种手持电子设备，包括壳体，盖子，主板，单元内触摸显示模块，导光构件和触摸模块。 盖罩盖壳体开口，并与壳体构成容纳空间。 盖具有第一区域和具有透光图标的第二区域。 主板与单元内触摸显示模块和触摸模块电连接。 单元内触摸显示模块具有设置在第一区域下方的显示区域。 导光构件设置在容纳空间内，并且能够将从发光元件产生的光引导到透光图标。 导光构件具有通过对应于透光图标而设置在第二区域下方的片状部分。 触摸模块设置在容纳空间内并在第二区域下方。

公开(公告)号：US20050093136A1

公开(公告)日：2005-05-05

申请号：US10698476

申请日：2003-11-03

Applicant: Wei-Chi Liu ,  Wei-Feng Lin ,  Chung-Ju Wu

Inventor： Wei-Chi Liu ,  Wei-Feng Lin ,  Chung-Ju Wu

IPC: H01L23/10 ,  H01L23/433

CPC classification number: H01L23/4334 ,  H01L2224/49175 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00012

Abstract: The present invention relates to a thermal dissipating element of a chip to dissipate heat producing by operating the chip. The thermal dissipating element includes a cover and a lump. The cover includes a top plate and a side plate, wherein the top plate curves and extendedly connects to the side plate. The lump is fastened between the chip and the top plate of the cover.

Abstract translation: 本发明涉及一种芯片的散热元件，用于散发通过操作芯片产生的热量。 散热元件包括盖和块。 该盖包括顶板和侧板，其中顶板弯曲并且延伸地连接到侧板。 该块被固定在芯片和盖板的顶板之间。

公开(公告)号：US20060226534A1

公开(公告)日：2006-10-12

申请号：US11378283

申请日：2006-03-20

Applicant: Kuei-Chen Liang ,  Chung-Ju Wu ,  Chung-Yin Fang

Inventor： Kuei-Chen Liang ,  Chung-Ju Wu ,  Chung-Yin Fang

IPC: H01L23/04 ,  H01L21/44

CPC classification number: H01L24/29 ,  H01L23/3128 ,  H01L23/50 ,  H01L23/552 ,  H01L23/60 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/8592 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/43

Abstract: A packaging structure and an assembly method are disclosed. A packaging structure includes a substrate, a die, conductive wires, and conductively filled material. The substrate includes a conductive structure, and the conductive wires are insulator-coated. The die is mounted on the substrate, and the conductive wires are connected between the die and the conductive structure. The conductively filled material is formed among the conductive wires. In the assembly method, the die is firstly mounted on the substrate, followed by connecting the conductive wires between the die and the conductive structure, and finally forming the conductively filled material among the conductive wires.

Abstract translation: 公开了一种包装结构和装配方法。 封装结构包括基片，裸片，导线和导电填充材料。 衬底包括导电结构，并且导电线被绝缘体涂覆。 芯片安装在基板上，并且导线连接在管芯和导电结构之间。 导电填充材料形成在导线之间。 在组装方法中，首先将模具安装在基板上，然后将导线连接在管芯和导电结构之间，最后在导线之间形成导电填充材料。

公开(公告)号：US06744128B2

公开(公告)日：2004-06-01

申请号：US10262958

申请日：2002-10-03

Applicant: Chung-Ju Wu ,  Kuei-Chen Liang ,  Wei-Feng Lin

Inventor： Chung-Ju Wu ,  Kuei-Chen Liang ,  Wei-Feng Lin

IPC: H01L2302

CPC classification number: H01L23/49833 ,  H01L23/642 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/00

Abstract: An integrated circuit package capable of improving signal quality is disclosed. The integrated circuit package comprises a first substrate, an integrated circuit chip attached on the first surface of the first substrate. This integrated circuit package further comprises a plurality of external terminals mounted on the first substrate and a plurality of first bonding pads mounted on the edge portion of the first surface of the first substrate and respectively connected to the corresponding external terminals. Also, the integrated circuit package further comprises a second substrate and a plurality of second bonding pads mounted on the second surface of the second substrate and connected to the first bonding pads formed on the first substrate. Furthermore, this integrated circuit package further comprises a plurality of passive components disposed on the second substrate.

Abstract translation: 公开了能够提高信号质量的集成电路封装。 集成电路封装包括第一衬底，附接在第一衬底的第一表面上的集成电路芯片。 该集成电路封装还包括安装在第一基板上的多个外部端子和安装在第一基板的第一表面的边缘部分上并分别连接到相应的外部端子的多个第一接合焊盘。 此外，集成电路封装还包括第二衬底和安装在第二衬底的第二表面上并连接到形成在第一衬底上的第一焊盘的多个第二焊盘。 此外，该集成电路封装还包括设置在第二基板上的多个无源部件。

公开(公告)号：US06509646B1

公开(公告)日：2003-01-21

申请号：US09575637

申请日：2000-05-22

Applicant: Wei-Feng Lin ,  Chung-Ju Wu ,  Chen-Wen Tsai

Inventor： Wei-Feng Lin ,  Chung-Ju Wu ,  Chen-Wen Tsai

IPC: H01L21302

CPC classification number: H01L23/50 ,  H01L23/49816 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K3/321 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

Abstract: An apparatus for reducing an electrical noise inside a ball grid array package is disclosed. The apparatus mainly comprises a substrate, a plurality of solder balls and a plurality of inside-connected capacitors. The substrate includes a contact layer, a power plane and a ground plane. The plurality of solder balls are fixed on the contact layer. The plurality of inside-connected capacitors are fixed on the contact layer, and a conductive glue is used to electrically connect the capacitors to the power plane and ground plane to reduce the electrical noise between the power plane and ground plane.

Abstract translation: 公开了一种用于减小球栅阵列封装内的电噪声的装置。 该装置主要包括基板，多个焊球和多个内部连接的电容器。 基板包括接触层，电源平面和接地平面。 多个焊球固定在接触层上。 多个内部连接的电容器固定在接触层上，并且使用导电胶将电容器电连接到电源平面和接地平面，以减小电力平面和接地面之间的电气噪声。

公开(公告)号：US07307844B2

公开(公告)日：2007-12-11

申请号：US11056533

申请日：2005-02-11

Applicant: Chung-Ju Wu

Inventor： Chung-Ju Wu

IPC: H05K7/20

CPC classification number: H05K7/20445 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: This disclosure presents a heat dissipation mechanism, which conducts generated heat of a thermal device to the housing of an electronic apparatus by a metal piece fastened between the thermal device and electronic apparatus, and then dissipates heat into the air through multiple holes opened over an apparatus shell. Besides, the presented mechanism is also suitable to mini-size, portable electronic apparatus to solve the thermal dissipation technique thereof.

Abstract translation: 本公开提供了一种散热机构，其通过紧固在热装置和电子装置之间的金属片将热装置的发热传导到电子装置的壳体，然后通过在装置上打开的多个孔将热量散发到空气中 贝壳。 此外，所提出的机构也适用于微型尺寸的便携式电子设备来解决其散热技术。

公开(公告)号：US20070057351A1

公开(公告)日：2007-03-15

申请号：US11449744

申请日：2006-06-09

Applicant: Chih-Tai Hsu ,  Chung-Ju Wu

Inventor： Chih-Tai Hsu ,  Chung-Ju Wu

IPC: H01L23/495 ,  H01L23/48

CPC classification number: H01L23/295 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/552 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/43826 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45686 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/4569 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A structure of IC packaging and a method forming the same are disclosed in the present invention. This structure of IC packaging comprises a substrate, a chip, and a plurality of copper connecting wires. At least a conductive structure is made on the substrate and an isolating material is coated on the copper connecting wires. The chip is fastened on the substrate and electrically connected with the conductive structure by the copper conductive wires coated with isolating material.

Abstract translation: 在本发明中公开了IC封装的结构及其形成方法。 IC封装的这种结构包括基板，芯片和多个铜连接线。 在基板上至少形成导电结构，并且在铜连接线上涂覆绝缘材料。 芯片紧固在基板上，并通过涂覆隔离材料的铜导电线与导电结构电连接。

公开(公告)号：US20050117296A1

公开(公告)日：2005-06-02

申请号：US10724891

申请日：2003-12-02

Applicant: Chung-Ju Wu ,  Wei-Feng Lin

Inventor： Chung-Ju Wu ,  Wei-Feng Lin

IPC: H01L23/40 ,  H05K7/20

CPC classification number: H01L23/4093 ,  H01L2924/15311 ,  H01L2924/16152

Abstract: The present invention provides the heat sink device for the ball grid array package to improve the heat dissipation. The heat sink device includes a first part of heat sink assembly that comprises a heat dissipating element above the heat sink body and is used to increase the heat dissipating area; and at least two conductive pillars on the backsides of the heat sink body, which is used to fix the heat sink assembly with PC board and also conducting the heat flux from thermal source to heat dissipation element; a conductive protruding block on the backside of the heat sink body, wherein the conductive protruding block used to associate with the cavity of the ball grid array package to increase the heat conductivity. In addition, the second part of the heat sink assembly comprises a bottom plate that used to contact with the backside of the PC board, so as to increase the heat dissipation to remove the heat that is generated from the PC board, and to join the at least two conductive pillars of the heat sink body to fix the heat sink assembly on the PC board.

Abstract translation: 本发明提供了一种用于球栅阵列封装的散热装置，以改善散热。 散热装置包括散热器组件的第一部分，其包括散热体上方的散热元件，并用于增加散热面积; 以及用于将散热器组件与PC板固定并且还将热源从热源传导到散热元件的散热体本体的背面上的至少两个导电柱; 在散热体本体背面的导电突出块，其中用于与球栅阵列封装的空腔相关联的导电突出块以增加热导率。 此外，散热器组件的第二部分包括用于与PC板的背面接触的底板，以便增加散热以去除由PC板产生的热量，并且加入 至少两个散热体主体的导电柱，以将散热器组件固定在PC板上。

公开(公告)号：US06653574B2

公开(公告)日：2003-11-25

申请号：US09935913

申请日：2001-08-23

Applicant: Chen-Wen Tsai ,  Chung-Ju Wu ,  Wei-Feng Lin

Inventor： Chen-Wen Tsai ,  Chung-Ju Wu ,  Wei-Feng Lin

IPC: H05K116

CPC classification number: H05K1/162 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0347 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A multi-layered substrate having built-in capacitors is disclosed. The substrate comprises at least one high permittivity of dielectric material filled in the through holes between the power plane and the ground plane so as to form capacitors. The built in capacitors are to decouple high frequency noise due to the voltage fluctuation.

公开(公告)号：US06395996B1

公开(公告)日：2002-05-28

申请号：US09571242

申请日：2000-05-16

Applicant: Chen-Wen Tsai ,  Chung-Ju Wu ,  Wei-Feng Lin

Inventor： Chen-Wen Tsai ,  Chung-Ju Wu ,  Wei-Feng Lin

IPC: H05K116

CPC classification number: H05K1/162 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0347 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A multi-layered substrate having built-in capacitors is used to decouple high frequency noise generated by voltage fluctuations between a power plane and a ground plane of a multi-layered substrate. At least one kind of dielectric material, which is filled in through holes between the power plane and the ground plane, with high dielectric constant is used to form the built-in capacitors.

Abstract translation: 使用具有内置电容器的多层基板来分离由多层基板的功率平面和接地平面之间的电压波动产生的高频噪声。 使用以介电常数填充在功率面和接地面之间的通孔中的至少一种介电材料来形成内置的电容器。