利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

22 条记录 (耗时 0.022 秒)

    Tray for ball grid array devices
    5.
    发明授权
    Tray for ball grid array devices 有权
    球栅阵列装置托盘

    公开(公告)号：US6116427A

    公开(公告)日：2000-09-12

    申请号：US494891

    申请日：2000-01-31

    申请人： Chung-Ju Wu ,  Wei-Feng Lin ,  Chen-Wen Tsai

    发明人： Chung-Ju Wu ,  Wei-Feng Lin ,  Chen-Wen Tsai

    IPC分类号： H01L21/673 ,  H05K13/00 ,  B65D73/02

    CPC分类号： H01L21/67333 ,  H05K13/0084

    摘要： A tray is adapted to receive a plurality of ball grid array devices therein, and includes a base plate having a device-receiving portion and a peripheral portion around the device-receiving portion. The device-receiving portion has a top side formed with a device-receiving recess. The top side of the device-receiving portion is further formed with a partition unit in the device-receiving recess for dividing the device-receiving recess into a plurality of cavities adapted for receiving the ball grid array devices respectively therein. The device-receiving portion further has a bottom side formed with a plurality of openings. Each of the openings is aligned with a corresponding one of the cavities and is adapted to receive an array of ball contacts formed on a bottom side of the ball grid array device that is disposed in the corresponding one of the cavities therein. The openings are grouped into a set of first openings remote from the peripheral portion and a set of second openings surrounding the first openings and adjacent to the peripheral portion. Guard strips are formed on the bottom side of the device-receiving portion and are disposed solely and respectively in the second openings.

    摘要翻译： 托盘适于在其中容纳多个球栅阵列器件，并且包括具有器件接收部分和围绕器件接收部分的周边部分的基板。 装置接收部分具有形成有装置容纳凹部的顶侧。 装置接收部分的顶侧还在装置容纳凹槽中形成有分隔单元，用于将装置容纳凹槽分成适于分别容纳球栅阵列装置的多个空腔。 装置接收部还具有形成有多个开口的底侧。 每个开口与相应的一个空腔对准，并且适于接收形成在球栅阵列器件的底侧上的球形触点阵列，其布置在其中的相应的一个空腔中。 开口被分组成远离周边部分的一组第一开口和围绕第一开口并且邻近周边部分的一组第二开口。 保护条形成在装置接收部分的底侧上，并且分别单独设置在第二开口中。

    Chip-packaging substrate
    6.
    发明授权
    Chip-packaging substrate 失效
    芯片封装基板

    公开(公告)号：US06838756B2

    公开(公告)日：2005-01-04

    申请号：US10227266

    申请日：2002-08-26

    申请人： Wei-Feng Lin ,  Chung-Ju Wu ,  Chen-Wen Tsai

    发明人： Wei-Feng Lin ,  Chung-Ju Wu ,  Chen-Wen Tsai

    IPC分类号： H01L23/13 ,  H01L23/495

    CPC分类号： H01L23/13 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A chip-packaging substrate. The substrate is capable of reducing damage during packaging, shrinking its connecting portions so that the length of any of the gap slots between the packaging portion and the frame portion of the substrate is increased. Furthermore, a dummy layer is provided to one surface of the frame portion to flush the surface on the frame portion with that of the packaging portion as much as possible.

    摘要翻译： 芯片封装基板。 该基板能够减少封装期间的损坏，使其连接部分收缩，使得封装部分和基板的框架部分之间的任何间隙的长度增加。 此外，在框架部分的一个表面上设置虚拟层，以尽可能多地将框架部分的表面与包装部分的表面齐平。

    Thermal dissipating element of a chip
    8.
    发明申请
    Thermal dissipating element of a chip 审中-公开
    芯片的散热元件

    公开(公告)号：US20050093136A1

    公开(公告)日：2005-05-05

    申请号：US10698476

    申请日：2003-11-03

    申请人： Wei-Chi Liu ,  Wei-Feng Lin ,  Chung-Ju Wu

    发明人： Wei-Chi Liu ,  Wei-Feng Lin ,  Chung-Ju Wu

    IPC分类号： H01L23/10 ,  H01L23/433

    CPC分类号： H01L23/4334 ,  H01L2224/49175 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00012

    摘要： The present invention relates to a thermal dissipating element of a chip to dissipate heat producing by operating the chip. The thermal dissipating element includes a cover and a lump. The cover includes a top plate and a side plate, wherein the top plate curves and extendedly connects to the side plate. The lump is fastened between the chip and the top plate of the cover.

    摘要翻译： 本发明涉及一种芯片的散热元件，用于散发通过操作芯片产生的热量。 散热元件包括盖和块。 该盖包括顶板和侧板，其中顶板弯曲并且延伸地连接到侧板。 该块被固定在芯片和盖板的顶板之间。

    Integrated circuit package capable of improving signal quality
    9.
    发明授权
    Integrated circuit package capable of improving signal quality 有权
    集成电路封装，能够提高信号质量

    公开(公告)号：US06744128B2

    公开(公告)日：2004-06-01

    申请号：US10262958

    申请日：2002-10-03

    申请人： Chung-Ju Wu ,  Kuei-Chen Liang ,  Wei-Feng Lin

    发明人： Chung-Ju Wu ,  Kuei-Chen Liang ,  Wei-Feng Lin

    IPC分类号： H01L2302

    CPC分类号： H01L23/49833 ,  H01L23/642 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/00

    摘要： An integrated circuit package capable of improving signal quality is disclosed. The integrated circuit package comprises a first substrate, an integrated circuit chip attached on the first surface of the first substrate. This integrated circuit package further comprises a plurality of external terminals mounted on the first substrate and a plurality of first bonding pads mounted on the edge portion of the first surface of the first substrate and respectively connected to the corresponding external terminals. Also, the integrated circuit package further comprises a second substrate and a plurality of second bonding pads mounted on the second surface of the second substrate and connected to the first bonding pads formed on the first substrate. Furthermore, this integrated circuit package further comprises a plurality of passive components disposed on the second substrate.

    摘要翻译： 公开了能够提高信号质量的集成电路封装。 集成电路封装包括第一衬底，附接在第一衬底的第一表面上的集成电路芯片。 该集成电路封装还包括安装在第一基板上的多个外部端子和安装在第一基板的第一表面的边缘部分上并分别连接到相应的外部端子的多个第一接合焊盘。 此外，集成电路封装还包括第二衬底和安装在第二衬底的第二表面上并连接到形成在第一衬底上的第一焊盘的多个第二焊盘。 此外，该集成电路封装还包括设置在第二基板上的多个无源部件。

    Ball grid array package with heat sink device
    10.
    发明申请
    Ball grid array package with heat sink device 有权
    具有散热装置的球栅阵列封装

    公开(公告)号：US20050117296A1

    公开(公告)日：2005-06-02

    申请号：US10724891

    申请日：2003-12-02

    申请人： Chung-Ju Wu ,  Wei-Feng Lin

    发明人： Chung-Ju Wu ,  Wei-Feng Lin

    IPC分类号： H01L23/40 ,  H05K7/20

    CPC分类号： H01L23/4093 ,  H01L2924/15311 ,  H01L2924/16152

    摘要： The present invention provides the heat sink device for the ball grid array package to improve the heat dissipation. The heat sink device includes a first part of heat sink assembly that comprises a heat dissipating element above the heat sink body and is used to increase the heat dissipating area; and at least two conductive pillars on the backsides of the heat sink body, which is used to fix the heat sink assembly with PC board and also conducting the heat flux from thermal source to heat dissipation element; a conductive protruding block on the backside of the heat sink body, wherein the conductive protruding block used to associate with the cavity of the ball grid array package to increase the heat conductivity. In addition, the second part of the heat sink assembly comprises a bottom plate that used to contact with the backside of the PC board, so as to increase the heat dissipation to remove the heat that is generated from the PC board, and to join the at least two conductive pillars of the heat sink body to fix the heat sink assembly on the PC board.

    摘要翻译： 本发明提供了一种用于球栅阵列封装的散热装置，以改善散热。 散热装置包括散热器组件的第一部分，其包括散热体上方的散热元件，并用于增加散热面积; 以及用于将散热器组件与PC板固定并且还将热源从热源传导到散热元件的散热体本体的背面上的至少两个导电柱; 在散热体本体背面的导电突出块，其中用于与球栅阵列封装的空腔相关联的导电突出块以增加热导率。 此外，散热器组件的第二部分包括用于与PC板的背面接触的底板，以便增加散热以去除由PC板产生的热量，并且加入 至少两个散热体主体的导电柱，以将散热器组件固定在PC板上。