CARRIER FOR TEST, BURN-IN, AND FIRST LEVEL PACKAGING
    1.
    发明申请
    CARRIER FOR TEST, BURN-IN, AND FIRST LEVEL PACKAGING 失效
    承运人进行测试,打入和第一级包装

    公开(公告)号:US20070001708A1

    公开(公告)日:2007-01-04

    申请号:US11531140

    申请日:2006-09-12

    IPC分类号: G01R31/26

    摘要: A plurality of semiconductor devices are provided on a carrier for testing or burning-in. The carrier is then cut up to provide single chip-on-carrier components or multi-chip-on-carrier components. The carrier is used as a first level package for each chip. Thus, the carrier serves a dual purpose for test and burn-in and for packaging. A lead reduction mechanism, such as a built-in self-test engine, can be provided on each chip or on the carrier and is connected to contacts of the carrier for the testing and burn-in steps. The final package after cutting includes at least one known good die and may include an array of chips on the carrier, such as a SIMM or a DIMM. The final package can also be a stack of chips each mounted on a separate carrier. The carriers of the stack are connected to each other through a substrate mounted along a side face of the stack that is electrically connected to a line of pads along an edge of each carrier.

    摘要翻译: 在载体上提供多个半导体器件用于测试或烧录。 然后将载体切割以提供单个芯片上载波部件或多芯片载波部件。 载体用作每个芯片的第一级封装。 因此,载体用于测试和烧录和包装的双重目的。 可以在每个芯片或载体上提供诸如内置自检引擎的引线减少机构,并且连接到载体的触点用于测试和老化步骤。 切割后的最终包装包括至少一个已知的良好的模具,并且可以包括载体上的芯片阵列,例如SIMM或DIMM。 最终的包装也可以是一堆芯片,每个芯片都安装在单独的载体上。 堆叠的载体通过沿着堆叠的侧面安装的基板彼此连接,该基板沿着每个载体的边缘电连接到焊盘一排。