公开(公告)号：US09111954B2

公开(公告)日：2015-08-18

申请号：US13180292

申请日：2011-07-11

申请人： Da-Jung Chen ,  Kaipeng Chiang ,  Yu-Chao Fang ,  Yi-Cheng Lin

发明人： Da-Jung Chen ,  Kaipeng Chiang ,  Yu-Chao Fang ,  Yi-Cheng Lin

IPC分类号： H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10 ,  H01L23/64 ,  H01L23/552 ,  H01L25/07 ,  H02M3/155 ,  H02M7/00 ,  H01L23/00

CPC分类号： H01L23/645 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1904 ,  H01L2924/19042 ,  H01L2924/19102 ,  H01L2924/19105 ,  H01L2924/3025 ,  H02M3/155 ,  H02M7/003 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power conversion module includes a circuit carrier board, a semiconductor module and an inductor module. The circuit carrier board has plural bonding pads. The semiconductor module is disposed on a first surface of the circuit carrier board. The inductor module has plural pins. The pins are extended from the inductor module along a first direction and connected with corresponding bonding pads on the circuit carrier board, so that a receptacle is defined between the inductor module and the circuit carrier board for accommodating the semiconductor module.

摘要翻译： 电力转换模块包括电路载板，半导体模块和电感模块。 电路载板具有多个接合焊盘。 半导体模块设置在电路承载板的第一表面上。 电感器模块具有多个引脚。 引脚沿着第一方向从电感器模块延伸并与电路载体板上的对应焊盘连接，使得在电感器模块和电路载体板之间限定容纳半导体模块的插座。

公开(公告)号：US20120069529A1

公开(公告)日：2012-03-22

申请号：US13180292

申请日：2011-07-11

申请人： Da-Jung Chen ,  Kaipeng Chiang ,  Yu-Chao Fang ,  Yi-Cheng Lin

发明人： Da-Jung Chen ,  Kaipeng Chiang ,  Yu-Chao Fang ,  Yi-Cheng Lin

IPC分类号： H05K7/00

CPC分类号： H01L23/645 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1904 ,  H01L2924/19042 ,  H01L2924/19102 ,  H01L2924/19105 ,  H01L2924/3025 ,  H02M3/155 ,  H02M7/003 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power conversion module includes a circuit carrier board, a semiconductor module and an inductor module. The circuit carrier board has plural bonding pads. The semiconductor module is disposed on a first surface of the circuit carrier board. The inductor module has plural pins. The pins are extended from the inductor module along a first direction and connected with corresponding bonding pads on the circuit carrier board, so that a receptacle is defined between the inductor module and the circuit carrier board for accommodating the semiconductor module.

摘要翻译： 电力转换模块包括电路载板，半导体模块和电感模块。 电路载板具有多个接合焊盘。 半导体模块设置在电路承载板的第一表面上。 电感器模块具有多个引脚。 引脚沿着第一方向从电感器模块延伸并与电路载体板上的对应焊盘连接，使得在电感器模块和电路载体板之间限定容纳半导体模块的插座。

公开(公告)号：US09514964B2

公开(公告)日：2016-12-06

申请号：US14821812

申请日：2015-08-10

申请人： Bau-Ru Lu ,  Da-Jung Chen ,  Yi-Cheng Lin

发明人： Bau-Ru Lu ,  Da-Jung Chen ,  Yi-Cheng Lin

IPC分类号： H01L21/00 ,  H01L21/48 ,  H01L23/495 ,  H01L21/768 ,  H01L25/00 ,  H01L25/16 ,  H01L23/00

CPC分类号： H01L21/4825 ,  H01L21/4821 ,  H01L21/76877 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49527 ,  H01L23/49534 ,  H01L23/49558 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/215 ,  H01L2224/24011 ,  H01L2224/24247 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49123 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer on the top surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.

摘要翻译： 公开了一种形成导电结构的方法，所述方法包括以下步骤：形成具有彼此分离的多个金属部件的金属框架; 在所述多个金属部件的顶表面上形成绝缘层; 以及在所述绝缘层上形成导电图案层，用于与所述多个金属部件的至少一部分进行电连接。

公开(公告)号：US20080179722A1

公开(公告)日：2008-07-31

申请号：US11930183

申请日：2007-10-31

申请人： Da-Jung Chen ,  Chung-Shiun Fang ,  Bau-Ru Lu ,  Yi-Cheng Lin ,  Chau-Chun Wen

发明人： Da-Jung Chen ,  Chung-Shiun Fang ,  Bau-Ru Lu ,  Yi-Cheng Lin ,  Chau-Chun Wen

IPC分类号： H01L23/495

CPC分类号： H05K1/141 ,  H01L23/495 ,  H01L23/49555 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/30107 ,  H05K1/0262 ,  H05K3/284 ,  H05K3/3421 ,  H05K2201/10166 ,  H05K2201/10924 ,  H05K2201/10969 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic package structure including a first carrier, at least one first electronic element, at least one second electronic element, and an encapsulant is provided. The first carrier has a first carrying surface and a second carrying surface opposite to the first carrying surface. The first electronic element is disposed on the first carrying surface and electrically connected to the first carrier. The second electronic element is disposed on the second carrying surface and electrically connected to the first carrier. The encapsulant at least covers the first electronic element, the second electronic element, and a part of the first carrier. The space utilization rate of the first carrier of the electronic package structure is higher.

摘要翻译： 提供了包括第一载体，至少一个第一电子元件，至少一个第二电子元件和密封剂的电子封装结构。 第一载体具有与第一载体表面相对的第一载体表面和第二载体表面。 第一电子元件设置在第一承载表面上并电连接到第一载体。 第二电子元件设置在第二承载表面上并电连接到第一载体。 密封剂至少覆盖第一电子元件，第二电子元件和第一载体的一部分。 电子封装结构的第一载体的空间利用率更高。

公开(公告)号：US20120075808A1

公开(公告)日：2012-03-29

申请号：US13206810

申请日：2011-08-10

申请人： Han-Hsiang LEE ,  Yi-Cheng Lin ,  Pei-Chun Hung ,  Bau-Ru Lu ,  Da-Jung Chen ,  Jeng-Jen Li

发明人： Han-Hsiang LEE ,  Yi-Cheng Lin ,  Pei-Chun Hung ,  Bau-Ru Lu ,  Da-Jung Chen ,  Jeng-Jen Li

IPC分类号： H05K7/20 ,  H05K7/00

CPC分类号： H05K7/1432 ,  H01L23/13 ,  H01L23/49531 ,  H01L23/49541 ,  H01L2224/49175 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H02M3/00 ,  H05K1/021 ,  H05K3/0061 ,  H05K2201/10924 ,  H05K2203/1327 ,  H01L2924/00

摘要： An electronic package structure is provided. The electronic package structure comprises a substrate, a first electronic element, and a second electronic element. The substrate includes a heat-dissipating plate and a circuit board disposed on the heat-dissipating plate. The first electronic element is disposed on the heat-dissipating plate and coupled to the circuit board. The second electronic element is disposed on the circuit board and coupled to the circuit board.

摘要翻译： 提供电子封装结构。 电子封装结构包括基板，第一电子元件和第二电子元件。 基板包括散热板和布置在散热板上的电路板。 第一电子元件设置在散热板上并耦合到电路板。 第二电子元件设置在电路板上并且耦合到电路板。

公开(公告)号：US09142426B2

公开(公告)日：2015-09-22

申请号：US13163770

申请日：2011-06-20

申请人： Bau-Ru Lu ,  Da-Jung Chen ,  Yi-Cheng Lin

发明人： Bau-Ru Lu ,  Da-Jung Chen ,  Yi-Cheng Lin

IPC分类号： H01L23/12 ,  H01L21/48 ,  H01L23/495 ,  H01L23/00

CPC分类号： H01L21/4825 ,  H01L21/4821 ,  H01L21/76877 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49527 ,  H01L23/49534 ,  H01L23/49558 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/215 ,  H01L2224/24011 ,  H01L2224/24247 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49123 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of forming a conductive pattern on a metallic frame for manufacturing a stack frame for electrical connections is disclosed. In one embodiment, a recess is formed in the metallic frame and a conductive element is bonded in the recess to make a stack frame for electrical connections. In another embodiment, the process can be performed on both top surface and bottom surface of metallic frame to make another stack frame for electrical connections. In yet another embodiment, a package structure and a manufacturing method of forming a conductive pattern on a lead frame for electrical connections are disclosed.

摘要翻译： 公开了一种在用于制造用于电连接的堆叠框架的金属框架上形成导电图案的方法。 在一个实施例中，在金属框架中形成凹部，并且导电元件接合在凹部中以形成用于电连接的堆叠框架。 在另一个实施例中，该过程可以在金属框架的顶表面和底表面上进行以制造用于电连接的另一个堆叠框架。 在另一个实施例中，公开了一种在用于电连接的引线框架上形成导电图案的封装结构和制造方法。

公开(公告)号：US20120313229A1

公开(公告)日：2012-12-13

申请号：US13590197

申请日：2012-08-21

申请人： Han-Hsiang Lee ,  Yi-Cheng Lin ,  Da-Jung Chen

发明人： Han-Hsiang Lee ,  Yi-Cheng Lin ,  Da-Jung Chen

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49568 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49589 ,  H01L23/552 ,  H01L24/73 ,  H01L25/072 ,  H01L25/165 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00

摘要： The invention discloses a package structure for better heat-dissipation or EMI performance. A first conductive element and a second conductive element are both disposed between the top lead frame and the bottom lead frame. The first terminal of the first conductive element is electrically connected to the bottom lead frame, and the second terminal of the first conductive element is electrically connected to the top lead frame. The third terminal of the second conductive element is electrically connected to the bottom lead frame, and the fourth terminal of the second conductive element is electrically connected to the top lead frame. In one embodiment, a heat dissipation device is disposed on the top lead frame. In one embodiment, the molding compound is provided such that the outer leads of the top lead frame are exposed outside the molding compound.

摘要翻译： 本发明公开了一种用于更好散热或EMI性能的封装结构。 第一导电元件和第二导电元件都设置在顶部引线框架和底部引线框架之间。 第一导电元件的第一端子电连接到底部引线框架，并且第一导电元件的第二端子电连接到顶部引线框架。 第二导电元件的第三端子电连接到底部引线框架，并且第二导电元件的第四端子电连接到顶部引线框架。 在一个实施例中，散热装置设置在顶部引线框架上。 在一个实施方案中，模塑料被设置成使得顶部引线框架的外部引线暴露在模塑料外部。

公开(公告)号：US08269330B1

公开(公告)日：2012-09-18

申请号：US13092163

申请日：2011-04-22

申请人： Han-Hsiang Lee ,  Yi-Cheng Lin ,  Da-Jung Chen

发明人： Han-Hsiang Lee ,  Yi-Cheng Lin ,  Da-Jung Chen

IPC分类号： H01L23/02

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49562 ,  H01L23/49589 ,  H01L2224/0401 ,  H01L2224/06181 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/00

摘要： A MOSFET pair with a stack capacitor is disclosed herein. It can regulate the input voltage and optimize a short EMI loop. It has a bottom lead frame and an up lead frame, which can simultaneously dissipate the heat generated by two MOSFETs to achieve excellent thermal-dissipation. It can adopt solder, Ag epoxy, or gold balls to implement the electrical bonding of two MOSFETs with the bottom lead frame and the up lead frame to achieve excellent structural flexibility. A device, such as an IGBT, a diode, an inductor, a choke, and a heat sink, can be stacked above the up lead frame to form a powerful SiP module. A corresponding method of manufacturing the MOSFET pair with a stack capacitor is also disclosed herein, which is simple, time-saving, flexible, cost-effective, and facile.

摘要翻译： 本文公开了具有堆叠电容器的MOSFET对。 它可以调节输入电压并优化短路电流环路。 它具有底部引线框架和引脚框架，可以同时消散两个MOSFET产生的热量，从而实现出色的散热。 它可以采用焊料，Ag环氧树脂或金球，以实现两个MOSFET与底部引线框架和上引线框架的电连接，以实现优异的结构灵活性。 诸如IGBT，二极管，电感器，扼流器和散热器的器件可以堆叠在引导框架上方以形成强大的SiP模块。 本文还公开了制造具有堆叠电容器的MOSFET对的相应方法，其简单，省时，灵活，成本有效且容易。

公开(公告)号：US07551455B2

公开(公告)日：2009-06-23

申请号：US11482370

申请日：2006-07-07

申请人： Da-Jung Chen ,  Yi-Cheng Lin ,  Bau-Ru Lu ,  Yi-Min Fang ,  Chau-Chun Wen ,  Chun-Tiao Liu

发明人： Da-Jung Chen ,  Yi-Cheng Lin ,  Bau-Ru Lu ,  Yi-Min Fang ,  Chau-Chun Wen ,  Chun-Tiao Liu

IPC分类号： H05K7/00

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A package structure including a first carrier, a second carrier, at least a first electronic component and at least a second electronic component is provided. The second carrier is electrically connected to the first carrier. The first electronic component is disposed on the first carrier and electrically connected to the first carrier. The second electronic component is disposed on the second carrier and electrically connected to the second carrier.

摘要翻译： 提供包括第一载体，第二载体，至少第一电子部件和至少第二电子部件的封装结构。 第二载体电连接到第一载体。 第一电子部件设置在第一载体上并电连接到第一载体。 第二电子部件设置在第二载体上并电连接到第二载体。

公开(公告)号：US09000576B2

公开(公告)日：2015-04-07

申请号：US13590197

申请日：2012-08-21

申请人： Han-Hsiang Lee ,  Yi-Cheng Lin ,  Da-Jung Chen

发明人： Han-Hsiang Lee ,  Yi-Cheng Lin ,  Da-Jung Chen

IPC分类号： H01L23/02 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L23/49568 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49589 ,  H01L23/552 ,  H01L24/73 ,  H01L25/072 ,  H01L25/165 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00

摘要： The invention discloses a package structure for better heat-dissipation or EMI performance. A first conductive element and a second conductive element are both disposed between the top lead frame and the bottom lead frame. The first terminal of the first conductive element is electrically connected to the bottom lead frame, and the second terminal of the first conductive element is electrically connected to the top lead frame. The third terminal of the second conductive element is electrically connected to the bottom lead frame, and the fourth terminal of the second conductive element is electrically connected to the top lead frame. In one embodiment, a heat dissipation device is disposed on the top lead frame. In one embodiment, the molding compound is provided such that the outer leads of the top lead frame are exposed outside the molding compound.

摘要翻译： 本发明公开了一种用于更好散热或EMI性能的封装结构。 第一导电元件和第二导电元件都设置在顶部引线框架和底部引线框架之间。 第一导电元件的第一端子电连接到底部引线框架，并且第一导电元件的第二端子电连接到顶部引线框架。 第二导电元件的第三端子电连接到底部引线框架，并且第二导电元件的第四端子电连接到顶部引线框架。 在一个实施例中，散热装置设置在顶部引线框架上。 在一个实施方案中，模塑料被设置成使得顶部引线框架的外部引线暴露在模塑料外部。