摘要:
Methods and devices for forming a vertically-oriented multilayer laminates, for example, a vertically-oriented multilayer laminates, are provided. The laminates may be fabricated by hardenable fluids, for example, polymers that are directed along flow paths to divide, repossession, and combine streams to provide the desired laminated structure. The flow divisions and recombination may be practiced repeatedly wherein laminates have tens or even tens of thousands of individual layers may be produced. The polymers used may have comparable viscosities, for example, having viscosity ratios of less than 3. Though aspects of the invention may be used packaging, aspects of the invention may be applied to any field where laminated structures are desired.
摘要:
Wireless strain and displacement sensors wirelessly monitor structural health and integrity, and are made by printing inductor-interdigital capacitor sensing circuits on a variety of substrates, including ceramic substrates, with thermally processable conductive inks. Sensors of the invention can be employed to detect strain and displacement of civil structures, such as bridges and buildings. The sensors include sensing elements that are mounted or printed on stiff, inflexible substrates, which prevent the sensing elements from bending, stretching, or otherwise warping when the sensor is strained. An interlayer between the sensing elements allows the sensing elements to move with respect to each other during application of strain. Thus, strain causes the sensing elements to move but not to deform, causing changes in sensor resonance that can be detected through wireless radio-frequency interrogation. Because the sensing elements do not change shape when under strain, the sensor can undergo millions of measurement cycles before breaking.
摘要:
Wireless strain and displacement sensors wirelessly monitor structural health and integrity, and are made by printing inductor-interdigital capacitor sensing circuits on a variety of substrates, including ceramic substrates, with thermally processable conductive inks. Sensors of the invention can be employed to detect strain and displacement of civil structures, such as bridges and buildings. The sensors include sensing elements that are mounted or printed on stiff, inflexible substrates, which prevent the sensing elements from bending, stretching, or otherwise warping when the sensor is strained. An interlayer between the sensing elements allows the sensing elements to move with respect to each other during application of strain. Thus, strain causes the sensing elements to move but not to deform, causing changes in sensor resonance that can be detected through wireless radio-frequency interrogation. Because the sensing elements do not change shape when under strain, the sensor can undergo millions of measurement cycles before breaking.
摘要:
Metal flakes, an organic metal precursor, an organic solvent and either no binder, or a volatile or a thermally decomposable binder are combined to form a paste. The paste is deposited in a circuit pattern on a substrate and the circuit pattern is cured. While curing, the organic metal precursor decomposes to leave an electrically conductive path, and the printed circuit is thus formed. A precursor to an electrically conductive circuit material includes an organic metal precursor, metal microparticles, and an organic solvent. The method can be employed to form printed circuits, for a variety of electrical, electronic and sensing application, such as crack detection in ceramic, plastics, concrete, wood, fabric, leather, rubber or paper and composite materials.
摘要:
An object has a superhydrophic, self-cleaning, and icephohic coating includes a substrate and a layer disposed on the substrate, the layer resulting from coating with a formulation having an effective amount of microstructuring microparticles, liquid silane having one or more groups configured to graft to a microstructuring microparticle and at least another group that results in hydrophobicity. The microstructuring microparticles are dispersed in the liquid silane. Another effective amount of synthetic adhesive, selected from thermosetting adhesives, moisture curing adhesives or polymers that form a strong interaction with a surface, is in solution with a solvent. Upon curing, the layer has a contact angle greater than 90″ and a sliding angle of less than 10° and less than 5% of an area of the layer is removed in a Tape test.
摘要:
Metal flakes, an organic metal precursor, an organic solvent and either no binder, or a volatile or a thermally decomposable binder are combined to form a paste. The paste is deposited in a circuit pattern on a substrate and the circuit pattern is cured. While curing, the organic metal precursor decomposes to leave an electrically conductive path, and the printed circuit is thus formed. A precursor to an electrically conductive circuit material includes an organic metal precursor, metal microparticles, and an organic solvent. The method can be employed to form printed circuits, for a variety of electrical, electronic and sensing application, such as crack detection in ceramic, plastics, concrete, wood, fabric, leather, rubber or paper and composite materials.