公开(公告)号：US07508054B2

公开(公告)日：2009-03-24

申请号：US11153359

申请日：2005-06-16

申请人： Fujiaki Nose ,  Hiroshi Kikuchi ,  Satoshi Ueno ,  Norio Nakazato

发明人： Fujiaki Nose ,  Hiroshi Kikuchi ,  Satoshi Ueno ,  Norio Nakazato

IPC分类号： H01L23/495

CPC分类号： H01L23/642 ,  H01L23/3107 ,  H01L23/49551 ,  H01L23/5222 ,  H01L23/66 ,  H01L24/06 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/75 ,  H01L2223/6627 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78701 ,  H01L2224/78755 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/10162 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19033 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： Means for forming a package is disclosed on which is mounted a semiconductor chip with a high-speed LSI formed thereon, using a wire bonding method. The package comprises a semiconductor chip, a die pad smaller than a main surface of the semiconductor chip, a sealing member, plural leads each comprising an outer terminal portion and an inner lead portion, and plural bonding wires for connection between bonding pads formed on the semiconductor chip and the inner lead portions of the leads, each of the inner lead portions being bent in a direction away from a mounting surface of the sealing member, thereby approximating the height of the chip-side bonding pads and that of a bonding position of the inner lead portions to each other, whereby the wire length can be made shorter and it is possible to suppress an increase in inductance of the wire portions and attain impedance matching at various portion of a high-frequency signal input/output transmission path.

摘要翻译： 公开了一种用于形成封装的装置，其中使用引线接合方法在其上安装了形成有高速LSI的半导体芯片。 封装包括半导体芯片，小于半导体芯片的主表面的管芯焊盘，密封构件，多个引线，每个引线包括外部端子部分和内部引线部分，以及多个接合线，用于连接形成在 半导体芯片和引线的内引线部分，每个内引线部分沿着远离密封部件的安装表面的方向弯曲，从而接近芯片侧焊盘的高度和接合位置的接合位置 内部引线部分彼此之间，从而可以缩短导线长度，并且可以抑制线部分的电感增加，并在高频信号输入/输出传输路径的各个部分获得阻抗匹配。

公开(公告)号：US06924549B2

公开(公告)日：2005-08-02

申请号：US10621411

申请日：2003-07-18

申请人： Fujiaki Nose ,  Hiroshi Kikuchi ,  Satoshi Ueno ,  Norio Nakazato

发明人： Fujiaki Nose ,  Hiroshi Kikuchi ,  Satoshi Ueno ,  Norio Nakazato

IPC分类号： H01L23/50 ,  H01L23/31 ,  H01L23/495 ,  H01L23/522 ,  H01L23/64 ,  H01L23/66

CPC分类号： H01L23/642 ,  H01L23/3107 ,  H01L23/49551 ,  H01L23/5222 ,  H01L23/66 ,  H01L24/06 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/75 ,  H01L2223/6627 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78701 ,  H01L2224/78755 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/10162 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19033 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： Means for forming a package is disclosed on which is mounted a semiconductor chip with a high-speed LSI formed thereon, using a wire bonding method. The package comprises a semiconductor chip, a die pad smaller than a main surface of the semiconductor chip, a sealing member, plural leads each comprising an outer terminal portion and an inner lead portion, and plural bonding wires for connection between bonding pads formed on the semiconductor chip and the inner lead portions of the leads, each of the inner lead portions being bent in a direction away from a mounting surface of the sealing member, thereby approximating the height of the chip-side bonding pads and that of a bonding position of the inner lead portions to each other, whereby the wire length can be made shorter and it is possible to suppress an increase in inductance of the wire portions and attain impedance matching at various portion of a high-frequency signal input/output transmission path.

摘要翻译： 公开了一种用于形成封装的装置，其中使用引线接合方法在其上安装了形成有高速LSI的半导体芯片。 封装包括半导体芯片，小于半导体芯片的主表面的管芯焊盘，密封构件，多个引线，每个引线包括外部端子部分和内部引线部分，以及多个接合线，用于连接形成在 半导体芯片和引线的内引线部分，每个内引线部分沿着远离密封部件的安装表面的方向弯曲，从而接近芯片侧焊盘的高度和接合位置的接合位置 内部引线部分彼此之间，从而可以缩短导线长度，并且可以抑制线部分的电感增加，并在高频信号输入/输出传输路径的各个部分获得阻抗匹配。

公开(公告)号：US06911734B2

公开(公告)日：2005-06-28

申请号：US10391746

申请日：2003-03-20

申请人： Hiroshi Kikuchi ,  Norio Nakazato ,  Hideko Ando ,  Takashi Suga ,  Satoru Isomura ,  Takashi Kubo ,  Hiroyasu Sasaki ,  Masanori Fukuhara ,  Naotaka Tanaka ,  Fujiaki Nose

发明人： Hiroshi Kikuchi ,  Norio Nakazato ,  Hideko Ando ,  Takashi Suga ,  Satoru Isomura ,  Takashi Kubo ,  Hiroyasu Sasaki ,  Masanori Fukuhara ,  Naotaka Tanaka ,  Fujiaki Nose

IPC分类号： H01L23/66 ,  H05K1/02 ,  H05K3/36 ,  H01L23/34

CPC分类号： H05K1/0243 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1903 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K3/361 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10659 ,  H05K2201/10681 ,  H05K2201/10734 ,  H01L2924/00014 ,  H01L2924/00

摘要： A high-frequency signal from a tape-shaped line section having a surface layer signal lead and surface layer GND lead disposed on both sides thereof is directly inputted to a semiconductor chip via a signal surface layer wiring of a package substrate and through solder bump electrodes. Alternatively, a high-frequency signal from the semiconductor chip is outputted to the outside via the tape-shaped line section in reverse. Owing to the transmission of the high-frequency signal by only a microstrip line at the whole surface layer of the package substrate, the high-frequency signal can be transmitted by only the microstrip line at the surface layer without through vias or the like. Accordingly, the high-frequency signal can be transmitted without a loss in frequency characteristic, and a high-quality high-frequency signal can be transmitted with a reduction in loss at high-frequency transmission.

公开(公告)号：US20100052149A1

公开(公告)日：2010-03-04

申请号：US12545465

申请日：2009-08-21

申请人： Fujiaki Nose ,  Hiroshi Kikuchi ,  Norio Nakazato

发明人： Fujiaki Nose ,  Hiroshi Kikuchi ,  Norio Nakazato

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49503 ,  H01L23/49513 ,  H01L23/49582 ,  H01L24/27 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01026 ,  H01L2924/3512

摘要： A semiconductor device includes: a die pad having a top surface; a plurality of leads arranged around the die pad; a semiconductor chip having a main surface, a back surface, and a plurality of pads formed to the main surface, and having the back surface fixedly adhered in opposing contact with the top surface of the die pad; a plurality of wires electrically connecting the plurality of pads of the semiconductor chip and the plurality of leads, respectively; and a sealing body sealing the semiconductor chip and the plurality of wires. In addition, a plurality of groove portions are formed to a chip-mounting region opposing the back surface of the semiconductor chip in the top surface of the die pad, and an adhesive for fixedly adhering the semiconductor chip to the top surface of the die pad is buried in the plurality of groove portions.

摘要翻译： 半导体器件包括：具有顶表面的管芯焊盘; 围绕芯片焊盘布置的多个引线; 半导体芯片，具有主表面，背面和形成在主表面上的多个焊盘，并且其背面固定地与芯片焊盘的顶表面相接触地粘附; 分别电连接半导体芯片的多个焊盘和多个引线的多个引线; 以及密封半导体芯片和多根导线的密封体。 此外，在与芯片安装区域相对的芯片安装区域形成多个槽部，该芯片安装区域与芯片的上表面的半导体芯片的背面相对，并且将用于将半导体芯片固定地粘附到芯片焊盘的顶面的粘合剂 被埋在多个槽部中。

公开(公告)号：US20050233501A1

公开(公告)日：2005-10-20

申请号：US11153359

申请日：2005-06-16

申请人： Fujiaki Nose ,  Hiroshi Kikuchi ,  Satoshi Ueno ,  Norio Nakazato

发明人： Fujiaki Nose ,  Hiroshi Kikuchi ,  Satoshi Ueno ,  Norio Nakazato

IPC分类号： H01L23/50 ,  H01L23/31 ,  H01L23/495 ,  H01L23/522 ,  H01L23/64 ,  H01L23/66 ,  H01L21/44

CPC分类号： H01L23/642 ,  H01L23/3107 ,  H01L23/49551 ,  H01L23/5222 ,  H01L23/66 ,  H01L24/06 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/75 ,  H01L2223/6627 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78701 ,  H01L2224/78755 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/10162 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19033 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： Means for forming a package is disclosed on which is mounted a semiconductor chip with a high-speed LSI formed thereon, using a wire bonding method. The package comprises a semiconductor chip, a die pad smaller than a main surface of the semiconductor chip, a sealing member, plural leads each comprising an outer terminal portion and an inner lead portion, and plural bonding wires for connection between bonding pads formed on the semiconductor chip and the inner lead portions of the leads, each of the inner lead portions being bent in a direction away from a mounting surface of the sealing member, thereby approximating the height of the chip-side bonding pads and that of a bonding position of the inner lead portions to each other, whereby the wire length can be made shorter and it is possible to suppress an increase in inductance of the wire portions and attain impedance matching at various portion of a high-frequency signal input/output transmission path.

公开(公告)号：US06911733B2

公开(公告)日：2005-06-28

申请号：US10372898

申请日：2003-02-26

申请人： Hiroshi Kikuchi ,  Norio Nakazato ,  Hideko Ando ,  Takashi Suga ,  Satoru Isomura ,  Takashi Kubo ,  Hiroyasu Sasaki ,  Masanori Fukuhara ,  Naotaka Tanaka ,  Fujiaki Nose

发明人： Hiroshi Kikuchi ,  Norio Nakazato ,  Hideko Ando ,  Takashi Suga ,  Satoru Isomura ,  Takashi Kubo ,  Hiroyasu Sasaki ,  Masanori Fukuhara ,  Naotaka Tanaka ,  Fujiaki Nose

IPC分类号： H01L23/66 ,  H05K1/02 ,  H05K3/36 ,  H01L23/34

CPC分类号： H05K1/0243 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1903 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K3/361 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10659 ,  H05K2201/10681 ,  H05K2201/10734 ,  H01L2924/00014 ,  H01L2924/00

摘要： A high-frequency signal from a tape-shaped line section having a surface layer signal lead and surface layer GND lead disposed on both sides thereof is directly inputted to a semiconductor chip via a signal surface layer wiring of a package substrate and through solder bump electrodes. Alternatively, a high-frequency signal from the semiconductor chip is outputted to the outside via the tape-shaped line section in reverse. Owing to the transmission of the high-frequency signal by only a microstrip line at the whole surface layer of the package substrate, the high-frequency signal can be transmitted by only the microstrip line at the surface layer without through vias or the like. Accordingly, the high-frequency signal can be transmitted without a loss in frequency characteristic, and a high-quality high-frequency signal can be transmitted with a reduction in loss at high-frequency transmission.

摘要翻译： 来自具有布置在其两侧的表面层信号引线和表面层GND引线的带状线段的高频信号经由封装衬底的信号表面层布线直接输入到半导体芯片，并通过焊料凸块电极 。 或者，来自半导体芯片的高频信号经由带状线路部分反向输出到外部。 由于仅在封装衬底的整个表面层处的微带线传输高频信号，所以高频信号可以仅通过表层的微带线传输，而不需要通过通孔等。 因此，可以不损失频率特性来发送高频信号，并且可以在高频率传输时以低损耗的方式发送高质量的高频信号。

公开(公告)号：US06896405B2

公开(公告)日：2005-05-24

申请号：US10265129

申请日：2002-10-07

申请人： Yasuo Osone ,  Norio Nakazato ,  Takashi Kubo ,  Masaki Asagai ,  Hiroshi Kikuchi

发明人： Yasuo Osone ,  Norio Nakazato ,  Takashi Kubo ,  Masaki Asagai ,  Hiroshi Kikuchi

IPC分类号： G01N25/18 ,  G01N25/00

CPC分类号： G01N25/18

摘要： A method of measuring a thermal resistance of laminated resin sandwiched by a first member and a second member according to the present invention includes measuring, as thermal resistance of resin, a sum of thermal resistance of an interface between the resin and the first member, thermal restistance of an interface between the resin and the second member, and thermal resistance caused by conduction of heat through the resin.

摘要翻译： 根据本发明的测量由第一构件和第二构件夹持的层叠树脂的耐热性的方法包括测量作为树脂的热阻的树脂与第一构件之间的界面的热阻之和，热 树脂和第二构件之间的界面的恢复性以及由于通过树脂的热传导引起的热阻。

公开(公告)号：US5674956A

公开(公告)日：1997-10-07

申请号：US445102

申请日：1995-05-19

申请人： Hidekazu Nakamoto ,  Chikao Oda ,  Norio Nakazato ,  Morihisa Maruko ,  Kazuo Ihara ,  Takatoshi Kinoshita ,  Tokinobu Furukawa ,  Kenichi Watanabe

发明人： Hidekazu Nakamoto ,  Chikao Oda ,  Norio Nakazato ,  Morihisa Maruko ,  Kazuo Ihara ,  Takatoshi Kinoshita ,  Tokinobu Furukawa ,  Kenichi Watanabe

IPC分类号： B01F7/00 ,  B01F7/16 ,  B01F15/00 ,  B01F15/02 ,  B01F15/06 ,  B01J19/18 ,  C08F2/02

CPC分类号： B01F7/00175 ,  B01F15/00201 ,  B01F15/00376 ,  B01F15/028 ,  B01F15/0289 ,  B01F15/065 ,  B01F15/068 ,  B01F7/00391 ,  B01F7/16 ,  B01F7/166 ,  B01J19/18 ,  B01F7/0025 ,  B01F7/00441 ,  B01F7/00583 ,  B01J2219/00094 ,  B01J2219/00168 ,  B01J2219/185 ,  B01J2219/1946

摘要： Agitator blades formed by connecting a plurality of frame members are provided in a cylindrical or conical container to realize the agitator blade structure without rotary shaft. Therefore, less liquids being treated adhere onto the rotary shaft or the agitator blades and less residue of the liquids is formed, making it possible to obtain a final high viscosity polymer using the same agitator vessel preventing the quality from being deteriorated.

摘要翻译： 通过连接多个框架构件形成的搅拌器叶片设置在圆柱形或锥形容器中，以实现没有旋转轴的搅拌器叶片结构。 因此，处理较少的液体粘附在旋转轴或搅拌器叶片上，并且形成较少的液体残留物，使得可以使用相同的搅拌器容器获得最终的高粘度聚合物，从而防止质量劣化。

公开(公告)号：US4565601A

公开(公告)日：1986-01-21

申请号：US675863

申请日：1984-11-28

申请人： Yutaka Kakehi ,  Norio Nakazato ,  Yoshimasa Fukushima ,  Kousai Hiratsuka ,  Fumio Shibata ,  Noriaki Yamamoto ,  Tsunehiko Tsubone

发明人： Yutaka Kakehi ,  Norio Nakazato ,  Yoshimasa Fukushima ,  Kousai Hiratsuka ,  Fumio Shibata ,  Noriaki Yamamoto ,  Tsunehiko Tsubone

IPC分类号： B61D19/02 ,  C23C14/54 ,  G05D23/19 ,  H01J37/20 ,  B44C1/22 ,  C03C15/00 ,  C03C25/06 ,  C23F1/02

CPC分类号： G05D23/1919 ,  C23C14/541 ,  H01J37/20

摘要： This invention relates to a method and apparatus for controlling temperature of a sample and is intended to prevent a sample from being deformed by the pressure of a heat transmission gas by mounting and fixing the sample being mounted and processed in a vacuum on and to the sample stand and supplying the heat transmission gas to the gap between the under surface of the sample thus fixed and the sample stand; effectively control the temperature of the sample being processed in a vacuum by limiting the size of the gap between the under surface of the sample and the sample stand; and make the heat transmission gas least affect the process by limiting the flow of the heat transmission gas in the vacuum process chamber.

摘要翻译： 本发明涉及一种用于控制样品温度的方法和装置，旨在通过将真空中安装和处理的样品安装并固定到样品上来防止样品被传热气体的压力变形 将传热气体放置并供给到如此固定的样品的下表面与样品台之间的间隙; 通过限制样品的下表面和样品台之间的间隙的大小，有效地控制在真空中正在处理的样品的温度; 并且通过限制真空处理室中的传热气体的流动使得传热气体对该过程最不重要。

公开(公告)号：US4208199A

公开(公告)日：1980-06-17

申请号：US951974

申请日：1978-10-16

申请人： Norio Nakazato ,  Norihide Saho ,  Sachihiro Yoshimatsu ,  Michimasa Okabe

发明人： Norio Nakazato ,  Norihide Saho ,  Sachihiro Yoshimatsu ,  Michimasa Okabe

IPC分类号： F25J3/04

CPC分类号： F25J3/04878 ,  F25J3/04303 ,  F25J3/04424 ,  F25J3/04872 ,  F25J2290/10

摘要： In a process of and a system for liquefying air to separate its components employing a so-called compound fractionating column, the system includes a fractionating medium pressure column into which a part of feed air is introduced to flow therethrough as an upwardly flowing gas for contact with a returning liquid, so as to obtain nitrogen gas at the top thereof and change the returning liquid to liquefied air as it reaches the bottom thereof, a first condenser adapted for a heat exchange between a liquefied air of a reduced pressure, which has been obtained by allowing an expansion of the liquefied air available at the bottom of the medium pressure column, and the nitrogen gas obtained at the top of the medium pressure column, so as to liquefy the nitrogen gas to make use of it as the returning liquid for the medium pressure column, a second condenser adapted for a heat exchange between the remainder part of feed air and liquefied oxygen to evaporate the oxygen, and a fractionating low pressure column through which the evaporated oxygen is made to flow as an upwardly flowing gas adapted to be contacted by a returning liquid coming down from the top of the low pressure column for a fractionation, whereby an impure gas is obtained at the top of the low pressure column, while the returning liquid is changed to liquefied oxygen as it reaches the bottom of the low pressure column.

摘要翻译： 在使用所谓的化合物分馏塔分离其组分的过程和用于液化空气的系统的过程中，该系统包括分馏中压塔，一部分进料空气被引入其中，作为向上流动的气体用于接触 返回液体，以便在其顶部获得氮气，并且当返回液体到达其底部时将返回液体改变为液化空气，第一冷凝器适于在已经被减压的液化空气之间进行热交换 通过允许在中压塔底部可获得的液化气体的膨胀和在中压塔顶部获得的氮气而膨胀，以使氮气液化以利用其作为返回液体 中压塔，第二冷凝器，适于在进料空气的剩余部分和液化氧之间进行热交换以蒸发氧气，以及分馏低 使蒸发的氧气通过该压力塔作为向上流动的气体流动，该气体适于与从低压塔的顶部下来的回流液体接触，以进行分馏，由此在低温的顶部获得不纯的气体 压力塔，同时返回的液体在达到低压塔的底部时变为液化的氧气。