公开(公告)号：US20100255639A1

公开(公告)日：2010-10-07

申请号：US12817832

申请日：2010-06-17

申请人： Fujio Ito ,  Hiromichi Suzuki ,  Akihiko Kameoka ,  Noriaki Sakamoto

发明人： Fujio Ito ,  Hiromichi Suzuki ,  Akihiko Kameoka ,  Noriaki Sakamoto

IPC分类号： H01L21/60 ,  H01L21/56

CPC分类号： H01L24/85 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/06153 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/78743 ,  H01L2224/85148 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for manufacturing a semiconductor device includes mounting a first chip over a first area of a chip mounting section of a lead frame and mounting a second chip over a second area of the chip mounting section, wherein the second area is adjacent to the first area via the slit. The chip mounting section is disposed on a flat heating jig. First pads of the first chip are connected with second pads of the second chip via first wires, respectively, and the first pads are connected with leads of the lead frame via second wires, respectively, the first chip, the second chip, the first wires and the second wires are sealed with a resin such that a part of each of the leads is exposed from the resin, and each of the leads is then separated from the lead frame.

摘要翻译： 一种制造半导体器件的方法，包括将第一芯片安装在引线框架的芯片安装部分的第一区域上，并将第二芯片安装在芯片安装部分的第二区域上，其中第二区域与第一区域相邻 通过狭缝。 芯片安装部分设置在平坦的加热夹具上。 第一芯片的第一焊盘分别经由第一引线与第二芯片的第二焊盘连接，并且第一焊盘分别经由第二焊丝与引线框架的引线连接，第一芯片，第二芯片，第一焊丝 并且第二导线用树脂密封，使得每个引线的一部分从树脂露出，并且每个引线然后与引线框架分离。

公开(公告)号：US20050230793A1

公开(公告)日：2005-10-20

申请号：US11106678

申请日：2005-04-15

申请人： Fujio Ito ,  Hiromichi Suzuki ,  Akihiko Kameoka ,  Noriaki Sakamoto

发明人： Fujio Ito ,  Hiromichi Suzuki ,  Akihiko Kameoka ,  Noriaki Sakamoto

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L21/607 ,  H01L23/495 ,  H01L23/50

CPC分类号： H01L24/85 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/06153 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/78743 ,  H01L2224/85148 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprises a microcomputer chip, an SDRAM which is disposed alongside the microcomputer chip and is thinner than the microcomputer chip, a tub, a plurality of inner leads and outer leads, first wires that connect pads of the microcomputer chip and pads of the SDRAM, and second wires which connect the pads of the microcomputer chip and the inner leads and which are disposed so as to bridge over the SDRAM and are formed with loops at positions higher than loops of the first wires. An interface circuit for a memory bus is connected only between the chips, without connecting to external terminals, and is closed within a package. Therefore, pins can be utilized for other functions correspondingly and a multi-pin configuration can be achieved. Further, the cost of an SIP (semiconductor device) can be reduced owing to the adoption of a frame type.

摘要翻译： 半导体器件包括微计算机芯片，与微计算机芯片一起设置并且比微计算机芯片薄的SDRAM，多个内引线和外引线，连接微计算机芯片的焊盘和第二引线的第一引线 SDRAM和第二线，其连接微型计算机芯片的焊盘和内部引线，并布置成跨越SDRAM并且在高于第一线的环的位置处形成有环。 用于存储器总线的接口电路仅在芯片之间连接，而不连接到外部端子，并且在封装内封闭。 因此，可以相应地使用引脚用于其他功能，并且可以实现多引脚配置。 此外，由于采用帧类型，可以降低SIP（半导体器件）的成本。

公开(公告)号：US07998795B2

公开(公告)日：2011-08-16

申请号：US12817832

申请日：2010-06-17

申请人： Fujio Ito ,  Hiromichi Suzuki ,  Akihiko Kameoka ,  Noriaki Sakamoto

发明人： Fujio Ito ,  Hiromichi Suzuki ,  Akihiko Kameoka ,  Noriaki Sakamoto

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L24/85 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/06153 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/78743 ,  H01L2224/85148 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for manufacturing a semiconductor device includes mounting a first chip over a first area of a chip mounting section of a lead frame and mounting a second chip over a second area of the chip mounting section, wherein the second area is adjacent to the first area via the slit. The chip mounting section is disposed on a flat heating jig. First pads of the first chip are connected with second pads of the second chip via first wires, respectively, and the first pads are connected with leads of the lead frame via second wires, respectively. the first chip, the second chip, the first wires and the second wires are sealed with a resin such that a part of each of the leads is exposed from the resin, and each of the leads is then separated from the lead frame.

摘要翻译： 一种制造半导体器件的方法，包括将第一芯片安装在引线框架的芯片安装部分的第一区域上，并将第二芯片安装在芯片安装部分的第二区域上，其中第二区域与第一区域相邻 通过狭缝。 芯片安装部分设置在平坦的加热夹具上。 第一芯片的第一焊盘分别经由第一焊盘与第二焊盘的第二焊盘连接，并且第一焊盘分别经由第二焊盘与引线框架的引线连接。 第一芯片，第二芯片，第一线和第二线被树脂密封，使得每个引线的一部分从树脂露出，并且每个引线然后与引线框架分离。

公开(公告)号：US07772044B2

公开(公告)日：2010-08-10

申请号：US12263696

申请日：2008-11-03

申请人： Fujio Ito ,  Hiromichi Suzuki ,  Akihiko Kameoka ,  Noriaki Sakamoto

发明人： Fujio Ito ,  Hiromichi Suzuki ,  Akihiko Kameoka ,  Noriaki Sakamoto

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L24/85 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/06153 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/78743 ,  H01L2224/85148 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for manufacturing a semiconductor device includes mounting a first chip over a first area of a chip mounting section of a lead frame and mounting a second chip over a second area of the chip mounting section, wherein the second area is adjacent to the first area via the slit. The chip mounting section is disposed on a flat heating jig. First pads of the first chip are connected with second pads of the second chip via first wires, respectively, and the first pads are connected with leads of the lead frame via second wires, respectively. the first chip, the second chip, the first wires and the second wires are sealed with a resin such that a part of each of the leads is exposed from the resin, and each of the leads is then separated from the lead frame.

摘要翻译： 一种制造半导体器件的方法，包括将第一芯片安装在引线框架的芯片安装部分的第一区域上，并将第二芯片安装在芯片安装部分的第二区域上，其中第二区域与第一区域相邻 通过狭缝。 芯片安装部分设置在平坦的加热夹具上。 第一芯片的第一焊盘分别经由第一焊盘与第二焊盘的第二焊盘连接，并且第一焊盘分别经由第二焊盘与引线框架的引线连接。 第一芯片，第二芯片，第一线和第二线被树脂密封，使得每个引线的一部分从树脂露出，并且每个引线然后与引线框架分离。

公开(公告)号：US20070035017A1

公开(公告)日：2007-02-15

申请号：US11580904

申请日：2006-10-16

申请人： Fujio Ito ,  Hiromichi Suzuki ,  Akihiko Kameoka ,  Noriaki Sakamoto

发明人： Fujio Ito ,  Hiromichi Suzuki ,  Akihiko Kameoka ,  Noriaki Sakamoto

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： H01L24/85 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/06153 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/78743 ,  H01L2224/85148 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprises a microcomputer chip, an SDRAM which is disposed alongside the microcomputer chip and is thinner than the microcomputer chip, a tub, a plurality of inner leads and outer leads, first wires that connect pads of the microcomputer chip and pads of the SDRAM, and second wires which connect the pads of the microcomputer chip and the inner leads and which are disposed so as to bridge over the SDRAM and are formed with loops at positions higher than loops of the first wires. An interface circuit for a memory bus is connected only between the chips, without connecting to external terminals, and is closed within a package. Therefore, pins can be utilized for other functions correspondingly and a multi-pin configuration can be achieved. Further, the cost of an SIP (semiconductor device) can be reduced owing to the adoption of a frame type.

摘要翻译： 半导体器件包括微计算机芯片，与微计算机芯片一起设置并且比微计算机芯片薄的SDRAM，多个内引线和外引线，连接微计算机芯片的焊盘和第二引线的第一引线 SDRAM和第二线，其连接微型计算机芯片的焊盘和内部引线，并布置成跨越SDRAM并且在高于第一线的环的位置处形成有环。 用于存储器总线的接口电路仅在芯片之间连接，而不连接到外部端子，并且在封装内封闭。 因此，可以相应地使用引脚用于其他功能，并且可以实现多引脚配置。 此外，由于采用帧类型，可以降低SIP（半导体器件）的成本。

公开(公告)号：US07466024B2

公开(公告)日：2008-12-16

申请号：US11580904

申请日：2006-10-16

申请人： Fujio Ito ,  Hiromichi Suzuki ,  Akihiko Kameoka ,  Noriaki Sakamoto

发明人： Fujio Ito ,  Hiromichi Suzuki ,  Akihiko Kameoka ,  Noriaki Sakamoto

IPC分类号： H01L23/495

CPC分类号： H01L24/85 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/06153 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/78743 ,  H01L2224/85148 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprises a microcomputer chip, an SDRAM which is disposed alongside the microcomputer chip and is thinner than the microcomputer chip, a tub, a plurality of inner leads and outer leads, first wires that connect pads of the microcomputer chip and pads of the SDRAM, and second wires which connect the pads of the microcomputer chip and the inner leads and which are disposed so as to bridge over the SDRAM and are formed with loops at positions higher than loops of the first wires. An interface circuit for a memory bus is connected only between the chips, without connecting to external terminals, and is closed within a package. Therefore, pins can be utilized for other functions correspondingly and a multi-pin configuration can be achieved. Further, the cost of an SIP (semiconductor device) can be reduced owing to the adoption of a frame type.

摘要翻译： 半导体器件包括微计算机芯片，与微计算机芯片一起设置并且比微计算机芯片薄的SDRAM，多个内引线和外引线，连接微计算机芯片的焊盘和第二引线的第一引线 SDRAM和第二线，其连接微型计算机芯片的焊盘和内部引线，并布置成跨越SDRAM并且在高于第一线的环的位置处形成有环。 用于存储器总线的接口电路仅在芯片之间连接，而不连接到外部端子，并且在封装内封闭。 因此，可以相应地使用引脚用于其他功能，并且可以实现多引脚配置。 此外，由于采用帧类型，可以降低SIP（半导体器件）的成本。

公开(公告)号：US07374973B2

公开(公告)日：2008-05-20

申请号：US11181929

申请日：2005-07-15

申请人： Fujio Ito ,  Hiromichi Suzuki ,  Akihiko Kameoka ,  Junpei Kusukawa ,  Yoshitaka Takezawa

发明人： Fujio Ito ,  Hiromichi Suzuki ,  Akihiko Kameoka ,  Junpei Kusukawa ,  Yoshitaka Takezawa

IPC分类号： H01L21/00

CPC分类号： H01L21/56 ,  H01L21/4821 ,  H01L23/3107 ,  H01L23/49558 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： Improvement in the reliability of a semiconductor device is aimed at. By heating a lead frame, after preparing a lead frame with a tape, until a resin molding is performed, at the temperature 160 to 300° C. (preferably 180 to 300° C.) for a total of more than 2 minutes in the atmosphere which has oxygen, crosslinkage density becoming high in resin of adhesives, a low molecular compound volatilizes and jumps out outside, therefore as a result, since a low molecular compound does not remain in resin of adhesives, the generation of copper migration can be prevented.

摘要翻译： 旨在提高半导体器件的可靠性。 通过加热引线框架，在用带子制备引线框架之后，直到进行树脂模制，在160-300℃（优选180-300℃）的温度下，总共超过2分钟 具有氧的气氛，粘合剂树脂中的交联密度变高，低分子化合物挥发并跳出外部，因此，由于低分子化合物不会残留在粘合剂的树脂中，所以可以防止铜迁移的产生 。

公开(公告)号：US07247576B2

公开(公告)日：2007-07-24

申请号：US11260182

申请日：2005-10-28

申请人： Yoshinori Miyaki ,  Hiromichi Suzuki ,  Kazunari Suzuki ,  Takafumi Nishita ,  Fujio Ito ,  Kunihiro Tsubosaki ,  Akihiko Kameoka ,  Kunihiko Nishi

发明人： Yoshinori Miyaki ,  Hiromichi Suzuki ,  Kazunari Suzuki ,  Takafumi Nishita ,  Fujio Ito ,  Kunihiro Tsubosaki ,  Akihiko Kameoka ,  Kunihiko Nishi

IPC分类号： H01L21/302

CPC分类号： H01L24/27 ,  H01L21/56 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/562 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/02166 ,  H01L2224/274 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

摘要： The occurrence of a package crack in the back vicinity of a die pad is restrained by making the outward appearance of the die pad of a lead frame smaller than that of a semiconductor chip which is mounted on it, and also the occurrence of a package crack in the main surface vicinity of the semiconductor chip is restrained by forming a layer of organic material with good adhesion property with the resin that constitutes the package body on the final passivation film (final passivation film) that covers the top layer of conductive wirings of the semiconductor chip.

摘要翻译： 通过使引线框架的管芯焊盘的外观比安装在其上的半导体芯片的外观更小，从而抑制芯片焊盘背面附近的封装裂缝的发生，并且还发生封装裂纹 通过在最终钝化膜（最终钝化膜）上形成覆盖顶层导电布线的最终钝化膜（最终钝化膜）的与构成封装体的树脂具有良好粘附性的有机材料层来抑制半导体芯片附近的主表面。 半导体芯片

公开(公告)号：US20060199302A1

公开(公告)日：2006-09-07

申请号：US11367297

申请日：2006-03-06

申请人： Fujio Ito ,  Hiromichi Suzuki ,  Akihiko Kameoka ,  Yoshitaka Takezawa ,  Junpei Kusukawa

发明人： Fujio Ito ,  Hiromichi Suzuki ,  Akihiko Kameoka ,  Yoshitaka Takezawa ,  Junpei Kusukawa

IPC分类号： H01L21/00

CPC分类号： H01L23/49503 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/49506 ,  H01L23/49548 ,  H01L23/49558 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L24/86 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A semiconductor device is manufactured by adhering a fixing tape to plural leads of a lead frame comprising a copper alloy, mounting a semiconductor chip on a tab of the lead frame, electrically connecting the leads to electrodes a of the semiconductor chip via bonding wires, forming a sealing resin portion that seals the semiconductor chip, the tab, the bonding wires, the leads and the fixing tape, and cutting the lead frame. A binder layer of the fixing tape includes at least % by weight of an amine-curable epoxy resin as its main component, and does not include a phenol resin. The binder layer of the fixing tape further includes no more than % by weight of acrylonitrile butadiene rubber. By using this material for the binder layer of the fixing tape, migration of the copper in the leads is suppressed even when a degradation test with strict environmental degradation conditions is conducted.

摘要翻译： 半导体器件通过将固定带粘附到包括铜合金的引线框架的多个引线上，将引线框架的突片上安装半导体芯片，通过接合线将引线电连接到半导体芯片的电极a，形成 密封半导体芯片，突片，接合线，引线和固定带的密封树脂部分，以及切割引线框架。 固定带的粘合剂层至少包含以胺可固化的环氧树脂为主要成分的重量百分比，不包括酚醛树脂。 定影带的粘合剂层还包括不超过重量％的丙烯腈丁二烯橡胶。 通过将该材料用于固定带的粘合剂层，即使进行严格的环境退化条件的劣化试验，也能抑制引线中铜的迁移。

公开(公告)号：US07199469B2

公开(公告)日：2007-04-03

申请号：US09964484

申请日：2001-09-28

申请人： Toru Ishida ,  Tetsuharu Urawa ,  Fujio Ito ,  Tomoo Matsuzawa ,  Kazunari Suzuki ,  Akihiko Kameoka ,  Hiromichi Suzuki ,  Takuji Ide

发明人： Toru Ishida ,  Tetsuharu Urawa ,  Fujio Ito ,  Tomoo Matsuzawa ,  Kazunari Suzuki ,  Akihiko Kameoka ,  Hiromichi Suzuki ,  Takuji Ide

IPC分类号： H01L23/48 ,  H01L23/495 ,  H01L23/50 ,  H01L25/18 ,  H01L25/065

CPC分类号： H01L24/06 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012

摘要： The cost of a semiconductor device is to be reduced. An electrical connection between a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip is made through an inner lead portion of a lead disposed at a position around the first semiconductor chip and two bonding wires.

摘要翻译： 降低半导体器件的成本。 通过布置在第一半导体芯片周围的引线的引线的内部引线部分和两个接合线来制造堆叠在第一半导体芯片上的第一半导体芯片和第二半导体芯片之间的电连接。