公开(公告)号：US5277725A

公开(公告)日：1994-01-11

申请号：US881448

申请日：1992-05-11

申请人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

发明人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC分类号： H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40 ,  C04B37/00 ,  B05D5/12

CPC分类号： H01L21/4857 ,  C04B41/488 ,  C04B41/4961 ,  H01L23/5383 ,  H05K3/4061 ,  C04B2111/00672 ,  C04B2111/00844 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308

摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

摘要翻译： 在金属的热循环过程中经历的裂纹：电介质半导体封装是由热膨胀系数不匹配引起的。 与这种开裂相关的非气密性可以通过用柔性材料回填可渗透裂缝来解决。 金属和电介质材料之间的均匀间隙可以类似地填充柔性材料，以提供应力消除，体积可压缩性和包装的强度。 此外，可渗透的骨架电介质可以被制造为具有烧结冶金的烧结多层结构，并随后注入柔性的温度稳定的材料以提供气密性和强度。

公开(公告)号：US5139851A

公开(公告)日：1992-08-18

申请号：US503493

申请日：1990-03-30

申请人： John Acocella ,  Arnold I. Baise ,  Richard A. Bates ,  Jon A. Casey ,  David R. Clarke ,  Renuka S. Divakaruni ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Amy T. Matts ,  Robert W. Nufer ,  Srinivasa S. N. Reddy ,  Mark A. Takacs ,  Lovell B. Wiggins

发明人： John Acocella ,  Arnold I. Baise ,  Richard A. Bates ,  Jon A. Casey ,  David R. Clarke ,  Renuka S. Divakaruni ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Amy T. Matts ,  Robert W. Nufer ,  Srinivasa S. N. Reddy ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC分类号： C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/40

CPC分类号： C04B41/4961 ,  C04B41/488 ,  H01L21/4857 ,  H01L23/5383 ,  H05K3/4061 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

公开(公告)号：US5135595A

公开(公告)日：1992-08-04

申请号：US503495

申请日：1990-03-30

申请人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

发明人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC分类号： H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40

CPC分类号： H01L21/4857 ,  C04B41/488 ,  C04B41/4961 ,  H01L23/5383 ,  H05K3/4061 ,  C04B2111/00672 ,  C04B2111/00844 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308

摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addresssed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

公开(公告)号：US5167913A

公开(公告)日：1992-12-01

申请号：US813244

申请日：1991-12-23

申请人： John Acocella ,  Philip L. Flaitz ,  Raj N. Master ,  Chandrasekhar Narayan ,  Sarah H. Knickerbocker ,  Paul H. Palmateer ,  Sampath Purushothaman ,  Srinivasa S. N. Reddy

发明人： John Acocella ,  Philip L. Flaitz ,  Raj N. Master ,  Chandrasekhar Narayan ,  Sarah H. Knickerbocker ,  Paul H. Palmateer ,  Sampath Purushothaman ,  Srinivasa S. N. Reddy

IPC分类号： H01L21/48 ,  H05K1/09 ,  H05K3/12 ,  H05K3/18 ,  H05K3/38 ,  H05K3/46

CPC分类号： H05K3/1291 ,  H01L21/4846 ,  H01L21/486 ,  H05K1/092 ,  H05K2203/1126 ,  H05K3/4629 ,  Y10T428/12528 ,  Y10T428/12611

摘要： A method of forming an adherent layer of metallurgy on a ceramic substrate which includes the steps of obtaining a ceramic material containing a polymeric binder and copper metallurgy patterns within the ceramic body. In one embodiment of the invention, the ceramic body also contains MgO.Thereafter, a surface layer of metallurgy is formed on the surface of the ceramic body. In one embodiment, the surface layer is nickel and in another embodiment, the surface layer is copper or gold.Then, the ceramic body undergoes a sintering cycle which includes the steps of pyrolysis, binder burnoff and, lastly, densification and, in some cases, crystallization. During densification and crystallization, there is a predetermined steam atmosphere which meets the following requirements: a partial pressure of oxygen less than that necessary to satisfy the equilibrium equation 4Cu+O.sub.2 =2Cu.sub.2 O; and a partial pressure of oxygen less than or equal to that necessary to satisfy the equilibrium equation 2Ni+O.sub.2 =2NiO for nickel in said surface metallurgy.

摘要翻译： 一种在陶瓷基板上形成冶金粘附层的方法，包括以下步骤：在陶瓷体内获得含有聚合物粘合剂和铜冶金图案的陶瓷材料。 在本发明的一个实施例中，陶瓷体还含有MgO。 此后，在陶瓷体的表面上形成表面冶金层。 在一个实施方案中，表面层是镍，在另一个实施方案中，表面层是铜或金。 然后，陶瓷体经历烧结循环，其包括热解，粘合剂燃烧的步骤，最后是致密化，在某些情况下，结晶。 在致密化和结晶过程中，有一个预定的蒸气气氛满足以下要求：氧气分压小于满足平衡方程式4Cu + O2 = 2Cu2O所需的氧分压; 以及小于或等于满足所述表面冶金中镍的平衡方程式2Ni + O2 = 2NiO所需的氧分压。

公开(公告)号：US4879156A

公开(公告)日：1989-11-07

申请号：US167607

申请日：1988-03-14

申请人： Lester W. Herron ,  Robert O. Lussow ,  Robert W. Nufer ,  Bernard Schwartz ,  John Acocella ,  Srinivasa N. Reddy

发明人： Lester W. Herron ,  Robert O. Lussow ,  Robert W. Nufer ,  Bernard Schwartz ,  John Acocella ,  Srinivasa N. Reddy

IPC分类号： H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/20 ,  H05K3/46

CPC分类号： H01L21/4857 ,  H01L23/5383 ,  H05K3/20 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K2201/0317 ,  H05K2203/0156 ,  H05K3/4611 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/24942 ,  Y10T428/26

摘要： A multilayered ceramic (MLC) substrate having embedded and exposed conductors suitable for mounting and interconnecting a plurality of electronic devices exterior thereof. The horizontal planar conductors comprise substantially a plurality of solid, non-porous, homogeneous metal patterns, whereas the vertical interplanar connection conductors are substantially porous metal conductors that are formed by methods such as screening. The process to form the MLC substrate involves forming a pattern of solid, nonporous conductors to a backing sheet having a release layer, then transferring the pattern to a ceramic green sheet. Zero X-Y shrinkage sintering processes allow the MLC substrate and solid metal conductors to be densified without distortion of the solid metal patterns or the ceramic.

摘要翻译： 一种多层陶瓷（MLC）衬底，其具有适于安装和互连其外部的多个电子器件的嵌入和暴露的导体。 水平平面导体基本上包括多个固体，非多孔均质的金属图案，而垂直平面连接导体是通过诸如筛选的方法形成的基本上多孔的金属导体。 形成MLC衬底的方法包括将固体，无孔导体的图案形成为具有剥离层的背衬片，然后将图案转移到陶瓷生片。 零X-Y收缩烧结工艺允许MLC衬底和固体金属导体致密化而不会使固体金属图案或陶瓷变形。

公开(公告)号：US4753694A

公开(公告)日：1988-06-28

申请号：US859092

申请日：1986-05-02

申请人： Lester W. Herron ,  Robert O. Lussow ,  Robert W. Nufer ,  Bernard Schwartz ,  John Acocella ,  Srinivasa N. Reddy

发明人： Lester W. Herron ,  Robert O. Lussow ,  Robert W. Nufer ,  Bernard Schwartz ,  John Acocella ,  Srinivasa N. Reddy

IPC分类号： H05K3/46 ,  H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/20 ,  C03B29/00

CPC分类号： H01L23/5383 ,  H01L21/4857 ,  H05K3/20 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K2201/0317 ,  H05K2203/0156 ,  H05K3/4611 ,  H05K3/4629

摘要： A multilayered ceramic (MLC) substrate having embedded and exposed conductors suitable for mounting and interconnecting a plurality of electronic devices exterior thereof. The horizontal planar conductors comprise substantially a plurality of solid, non-porous, homogeneous metal patterns, whereas the vertical interplanar connection conductors are substantially porous metal conductors that are formed by methods such as screening. The process to form the MLC substrate involves forming a pattern of solid, nonporous conductors to a backing sheet having a release layer, then transferring the pattern to a ceramic green sheet. Zero X-Y shrinkage sintering processes allow the MLC substrate and solid metal conductors to be densified without distortion of the solid metal patterns or the ceramic.

摘要翻译： 一种多层陶瓷（MLC）衬底，其具有适于安装和互连其外部的多个电子器件的嵌入和暴露的导体。 水平平面导体基本上包括多个固体，非多孔均质的金属图案，而垂直平面连接导体是通过诸如筛选的方法形成的基本上多孔的金属导体。 形成MLC衬底的方法包括将固体，无孔导体的图案形成为具有剥离层的背衬片，然后将图案转移到陶瓷生片。 零X-Y收缩烧结工艺允许MLC衬底和固体金属导体致密化而不会使固体金属图案或陶瓷变形。

公开(公告)号：US5338900A

公开(公告)日：1994-08-16

申请号：US996367

申请日：1992-12-23

申请人： Mark S. Schneider ,  John Acocella ,  Lester W. Herron ,  Mark R. Kordus ,  Louis H. Wirtz

发明人： Mark S. Schneider ,  John Acocella ,  Lester W. Herron ,  Mark R. Kordus ,  Louis H. Wirtz

IPC分类号： H01L21/68 ,  H01L23/498 ,  H05K1/00

CPC分类号： H01L21/6835 ,  H01L23/49827 ,  H01L2221/68377 ,  H01L2924/0002 ,  H01L2924/09701

摘要： The present invention relates generally to new structures for decals, and more particularly to electrically conductive decals filled with inorganic insulator material. Various methods and processes that are used to make these electrically conductive decals filled with inorganic dielectric material are disclosed.

摘要翻译： 本发明一般涉及用于贴花的新结构，更具体地说，涉及填充有无机绝缘体材料的导电贴花。 公开了用于制造充满无机介电材料的这些导电贴花的各种方法和工艺。

公开(公告)号：US5031029A

公开(公告)日：1991-07-09

申请号：US504496

申请日：1990-04-04

申请人： John Acocella ,  Nanik Bakhru ,  Alfred Grill ,  Egidio Marotta ,  Bernard S. Meyerson ,  Vishnubhai V. Patel

发明人： John Acocella ,  Nanik Bakhru ,  Alfred Grill ,  Egidio Marotta ,  Bernard S. Meyerson ,  Vishnubhai V. Patel

IPC分类号： H01L23/373

CPC分类号： H01L23/3735 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/04941 ,  Y10S165/905

摘要： A device that contains a copper substrate; a rigidizing layer and/or a metal layer, and a non-graphitic hard carbon layer deposited on the rigidizing layer; and use as a heat sink or piston for electronic components.

公开(公告)号：US5591941A

公开(公告)日：1997-01-07

申请号：US144981

申请日：1993-10-28

申请人： John Acocella ,  Donald R. Banks ,  Joseph A. Benenati ,  Thomas Caulfield ,  Karl G. Hoebener ,  David P. Watson ,  John S. Corbin, Jr.

发明人： John Acocella ,  Donald R. Banks ,  Joseph A. Benenati ,  Thomas Caulfield ,  Karl G. Hoebener ,  David P. Watson ,  John S. Corbin, Jr.

IPC分类号： B23K1/00 ,  H01L21/48 ,  H01L23/488 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H05K3/36 ,  H05K3/42 ,  H06K1/14

CPC分类号： B23K1/0008 ,  B23K1/0016 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/3478 ,  B23K2201/36 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/00013 ,  H01L2924/09701 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0455 ,  H05K2203/082 ,  H05K3/3452 ,  H05K3/42 ,  H05K3/429 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144

摘要： High melting temperature Pb/Sn 95/5 solder balls are connected to copper pads on the bottom of a ceramic chip carrier substrate by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic solder and raising its melting temperature. Then the module is placed on a fiberglass-epoxy circuit board with the solder balls on eutectic Pb/Sn solder bumps on copper pads of the board. The structure is reflowed to simultaneously melt the solder on both sides of the balls to allow each ball to center between the carrier pad and circuit board pad to form a more symmetric joint. This process results in structure that are more reliable under high temperature cycling. Also, to further improve reliability, the balls are made as large as the I/O spacing allows without bridging beam on balls; the two pads are about the same size with more solder on the smaller pad; the pads are at least 75% of the ball diameter; and the eutectic joints are made as large as possible without bridging between pads. For reliability at even higher temperature cycles or larger substrate sizes columns are used instead of balls.

摘要翻译： 高熔点温度Pb / Sn 95/5焊球通过低熔点共晶Pb / Sn焊料连接到陶瓷芯片载体衬底底部的铜焊盘上。 通过快速回流进行连接，以防止将Pb溶解到共晶焊料中并提高其熔融温度。 然后将模块放置在玻璃纤维 - 环氧树脂电路板上，焊锡球焊接在电路板铜焊盘上的共晶Pb / Sn焊料凸块上。 该结构被回流以同时熔化球的两侧的焊料，以允许每个球在载体垫和电路板垫之间居中以形成更对称的接头。 该过程导致在高温循环下更可靠的结构。 此外，为了进一步提高可靠性，将球制成为尽可能大的I / O间距，而不会在球上桥接梁; 两个焊盘的尺寸大致相同，较小的焊盘上焊料更多; 垫片至少为球直径的75％; 并且使共晶接头制成尽可能大，而不会在焊盘之间桥接。 为了在更高的温度循环或更大的基板尺寸下的可靠性，使用色谱柱代替球。

公开(公告)号：US5294830A

公开(公告)日：1994-03-15

申请号：US703614

申请日：1991-05-21

申请人： Steven P. Young ,  John Acocella ,  Albert J. Fahey ,  Gaetano P. Messina ,  Seaho Song

发明人： Steven P. Young ,  John Acocella ,  Albert J. Fahey ,  Gaetano P. Messina ,  Seaho Song

IPC分类号： H01L23/433 ,  H01L23/473 ,  H01L23/02 ,  H01L25/04

CPC分类号： H01L23/4735 ,  H01L23/4338 ,  H01L2224/16225 ,  H01L2924/15312

摘要： An integrated circuit thermal conduction module comprises a substrate having a chip-carrying surface and at least one integrated circuit chip on the substrate. A deformable, liquid-impermeable, thermally conductive film or foil extends over an upper surface of the chip. A piston has a lower surface which urges and conforms the film against the chip upper surface and which contains at least one open channel permitting coolant passage and contact with the film for conveying heat from the chip without direct contact between the coolant and chip. Preferably, the piston has a central passageway extending along the longitudinal axis for channeling the coolant through the piston, and has a plurality of channels extending radially outwardly from the central passageway along the lower face for directing coolant beneath the piston.

摘要翻译： 集成电路热传导模块包括具有芯片承载表面的衬底和在衬底上的至少一个集成电路芯片。 可变形的液体不可渗透的导热膜或箔在芯片的上表面上延伸。 活塞具有下表面，该下表面促使薄膜抵靠芯片上表面，并且其包含至少一个敞开的通道，允许冷却剂通过并与薄膜接触，用于从芯片传送热量，而不会直接接触冷却剂和芯片。 优选地，活塞具有沿着纵向轴线延伸的中心通道，用于将冷却剂引导通过活塞，并且具有沿着下表面从中心通道径向向外延伸的多个通道，用于将冷却剂引导到活塞下方。