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1.发明授权Functional member having molecular layer on its surface and method of producing the same 有权其表面具有分子层的功能元件及其制造方法公开(公告)号：US06495247B1
公开(公告)日：2002-12-17
申请号：US09125622
申请日：1998-08-21
申请人： Hiroaki Takezawa , Tadashi Otake , Yasuo Takebe , Hiroshi Onishi , Norihisa Mino , Toru Shiino
发明人： Hiroaki Takezawa , Tadashi Otake , Yasuo Takebe , Hiroshi Onishi , Norihisa Mino , Toru Shiino
IPC分类号： B32B516
CPC分类号： B82Y30/00 , B05D1/185 , B82Y40/00 , Y10T428/268 , Y10T428/269 , Y10T428/31678 , Y10T428/31681
摘要： A functional member having a molecular layer on its surface, wherein the molecular layer is formed through a coordinate bond, and the coordinate bond is a multidentate bond in which at least one molecule is bonded to one metallic atom of the member and two or more ligands of the molecule are coordinated.
摘要翻译： 在其表面具有分子层的功能性构件，其中所述分子层通过配位键形成，所述配位键是多元键，其中至少一个分子与所述成员的一个金属原子键合，以及两个或更多个配体 的分子是协调的。
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公开(公告)号：US06203919B1
公开(公告)日：2001-03-20
申请号：US08980749
申请日：1997-12-01
申请人： Yasuo Takebe , Tadashi Ootake , Norihisa Mino , Hiroaki Takezawa
发明人： Yasuo Takebe , Tadashi Ootake , Norihisa Mino , Hiroaki Takezawa
IPC分类号： B32B1508
CPC分类号： H01B3/30 , Y10T428/31529 , Y10T428/31533 , Y10T428/31536 , Y10T428/31605 , Y10T428/31681 , Y10T428/31692 , Y10T428/31786 , Y10T428/31855 , Y10T428/31909
摘要： An electrically insulating film capable of maintaining a preferable insulating property even with a film thickness of only some &mgr;and a method for preparing the same are disclosed. The insulating film comprises a first layer formed on a surface of a conductor substrate of a transition metal and comprised of molecules fixed on the surface of the conductor substrate through chemical bonds such as transition metal-sulfur bonds or chelate bonds, and a second layer formed on the first layer and comprised of a resin bonded to the molecules of the first layer through covalent bonds.
摘要翻译： 公开了一种甚至即使膜厚仅有一些保持优选绝缘性能的电绝缘膜及其制备方法。 绝缘膜包括形成在过渡金属的导体基板的表面上的第一层，并且由通过诸如过渡金属 - 硫键或螯合键的化学键固定在导体基板的表面上的分子组成，第二层形成 在第一层上并且由通过共价键与第一层的分子键合的树脂组成。
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公开(公告)号：US07468206B1
公开(公告)日：2008-12-23
申请号：US08992049
申请日：1997-12-17
申请人： Tadashi Ootake , Yasuo Takebe , Norihisa Mino , Hiroaki Takezawa
发明人： Tadashi Ootake , Yasuo Takebe , Norihisa Mino , Hiroaki Takezawa
CPC分类号： B82Y30/00 , B05D1/185 , B82Y40/00 , Y10T428/26 , Y10T428/261 , Y10T428/265 , Y10T428/31504
摘要： The present invention provides an organic ultra-thin film firmly fixed to a substrate with the film thickness ranging from tens of nm to hundreds of nm. The organic ultra-thin film comprises polymers fixed on a substrate by M2—O—A— bond in which A represents an Si, Ge, Ti, Sn or Zr atom in the polymer, and M2 represents an atom in the substrate) or by a coordinate bond, the polymers are combined with each other by —A1—O—A1′— bond in which A1 and A1′ are Si, Ge, Ti, Sn, Zr or S or by a coordinate bond.
摘要翻译： 本发明提供一种牢固地固定在基板上的有机超薄膜，其膜厚度为数十nm至数百nm。 有机超薄膜包括通过M2-OA-键固定在基材上的聚合物，其中A表示聚合物中的Si，Ge，Ti，Sn或Zr原子，M2表示基材中的原子）或通过坐标 通过-A1-O-A1'-键将聚合物彼此组合，其中A1和A1'是Si，Ge，Ti，Sn，Zr或S或通过配位键。
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公开(公告)号：US5817190A
公开(公告)日：1998-10-06
申请号：US650747
申请日：1996-05-20
申请人： Hiroaki Takezawa , Toru Shiino , Kenichi Nobuta , Hiroshi Onishi
发明人： Hiroaki Takezawa , Toru Shiino , Kenichi Nobuta , Hiroshi Onishi
CPC分类号： B23K35/3612 , B23K35/3618
摘要： A flux for soft soldering is disclosed. It comprises a chelating agent as an activator for facilitating a connection of a conductor metal to a soft solder by removing an oxide film naturally formed on the surface of the conductor metal, and for securing insulating reliability after soft soldering by forming complexes with copper and tin which are insulating substance, and a solvent capable of dissolving the chelating agent and further preferably evaporating at soldering process.
摘要翻译： 公开了用于软焊接的焊剂。 它包括螯合剂作为活化剂，通过去除在导体金属表面上自然形成的氧化膜，并且通过与铜和锡形成络合物来在软焊后确保绝缘可靠性，从而促进导体金属与软焊料的连接 其为绝缘物质，能够溶解螯合剂的溶剂，进一步优选在焊接工序中蒸发。
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公开(公告)号：US06749889B2
公开(公告)日：2004-06-15
申请号：US10409400
申请日：2003-04-07
IPC分类号： B05D512
CPC分类号： H05K3/321 , B32B7/02 , B32B7/12 , H05K2201/09909 , H05K2201/10636 , H05K2201/10984 , H05K2203/0783 , H05K2203/121 , Y02P70/611 , Y10S428/901 , Y10T29/4913 , Y10T29/49147 , Y10T428/24066 , Y10T428/24917 , Y10T428/2495 , Y10T428/24975 , Y10T428/269 , Y10T428/31678 , Y10T428/31681
摘要： In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.
摘要翻译： 在包括通过导电粘合剂彼此电连接的第一电极和第二电极的安装结构中，至少一个电极和导电粘合剂之间的粘合部分的周边被电绝缘层覆盖，由此附着 部分从外围加强。 电绝缘层可以通过将导电粘合剂的粘合剂树脂组分溶解在溶剂中而形成。 这增加了导电粘合剂中的导电填料的浓度，从而也增强了粘合部分的导电性。
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公开(公告)号：US06510059B2
公开(公告)日：2003-01-21
申请号：US09889523
申请日：2001-07-18
IPC分类号： H05K118
CPC分类号： H05K3/321 , C09J9/02 , H01L23/49883 , H01L2924/0002 , H05K3/305 , H05K2201/10636 , H05K2201/10977 , H05K2203/0278 , H05K2203/0783 , Y02P70/611 , Y10S205/925 , Y10T29/4913 , Y10T29/49146 , H01L2924/00
摘要： In mounting an electronic component using a conductive resin, a conductive resin containing a specific diluent component is used as the conductive resin, or a specific diluent component is applied to the conductive resin before being cured. This allows connection in a portion where an electrode (5) of an electronic component (4) and an electrode (2) of a circuit substrate (1) are opposed to each other to be provided via a resin (3a) containing a conductive filler as a main component, and allows connection at a lower surface of the electronic component (4) and connection in vicinities of the electrode (5) to be provided via a resin (3b, 3c) containing a binder resin as a main component that has oozed out of the conductive resin. The resin (3b, 3c) containing the binder resin as the main component increases junction strength.
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7.发明授权Conductive paste, its manufacturing method, and printed wiring board using the same 失效导电糊，其制造方法和使用其的印刷线路板公开(公告)号：US06488869B2
公开(公告)日：2002-12-03
申请号：US09056774
申请日：1998-04-08
IPC分类号： H01B102
CPC分类号： H05K1/095 , H01B1/22 , H05K3/321 , H05K3/4069 , H05K2201/10636 , H05K2203/121 , Y02P70/611 , Y10T428/24917 , Y10T428/3192
摘要： A conductive paste has conductive particles having metal particle surface coated with a complex of same metal of less than 10 nm in thickness and not having spontaneous oxide film on said metal particles, and a binder mainly composed of an insulating resin.
摘要翻译： 导电糊具有金属颗粒表面涂覆有厚度小于10nm且在所述金属颗粒上不具有自发氧化膜的相同金属的复合物的导电颗粒和主要由绝缘树脂构成的粘合剂。
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公开(公告)号：US06376051B1
公开(公告)日：2002-04-23
申请号：US09519984
申请日：2000-03-07
IPC分类号： B32B300
CPC分类号： H05K3/321 , B32B7/02 , B32B7/12 , H05K2201/09909 , H05K2201/10636 , H05K2201/10984 , H05K2203/0783 , H05K2203/121 , Y02P70/611 , Y10S428/901 , Y10T29/4913 , Y10T29/49147 , Y10T428/24066 , Y10T428/24917 , Y10T428/2495 , Y10T428/24975 , Y10T428/269 , Y10T428/31678 , Y10T428/31681
摘要： In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.
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9.发明授权公开(公告)号：US06916433B2
公开(公告)日：2005-07-12
申请号：US10030235
申请日：2001-02-27
CPC分类号： H05K3/321 , C09J9/02 , H05K2201/0245 , H05K2201/0272 , H05K2201/10636 , H05K2203/0278 , H05K2203/0307 , Y02P70/611 , Y10T428/2982
摘要： A conductive adhesive comprises main components of a conductive filler and a binder resin, and a content of the conductive filler is in a range from 20 wt % to 70 wt %. It is preferable that at least a part of the conductive filler has protrusions. A dendrite metal filler is especially preferred. When this adhesive is compressed, the resin component is squeezed out, while the conductive filler component remains inside. As a result, the concentration of the conductive filler component is raised inside, and this is useful in connecting the electrodes by scratching the surfaces of the electrodes. No solder is required in forming a conductive adhesive 3 on a substrate electrode 2 of a circuit substrate 1 and also for packaging an electronic element 4. Provided also are a package of an electronic element using the conductive adhesive with improved initial and long-term reliability, and a method of packaging the same.
摘要翻译： 导电粘合剂包括导电填料和粘合剂树脂的主要组分，并且导电填料的含量在20重量％至70重量％的范围内。 导电填料的至少一部分优选具有突起。 特别优选枝晶金属填料。 当该粘合剂被压缩时，树脂组分被挤出，而导电填料组分保留在内部。 结果，导电填料组分的浓度升高到内部，并且这通过划伤电极的表面来连接电极是有用的。 在电路基板1的基板电极2上形成导电性粘接剂3也需要焊料，也可以包装电子元件4。 还提供了使用导电粘合剂的电子元件的包装，其具有改善的初始和长期可靠性，以及包装该电子元件的方法。
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10.发明申请公开(公告)号：US20050098338A1
公开(公告)日：2005-05-12
申请号：US11009045
申请日：2004-12-13
IPC分类号： H01L21/60 , H01L23/485 , H05K3/32 , H02G3/08
CPC分类号： H01L24/10 , H01L24/13 , H01L24/29 , H01L24/83 , H01L2224/13 , H01L2224/13099 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29318 , H01L2224/29339 , H01L2224/29344 , H01L2224/29355 , H01L2224/29364 , H01L2224/29369 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/19041 , H05K3/321 , H05K2201/10636 , H05K2201/10689 , H05K2201/10909 , H05K2203/0307 , H05K2203/1446 , Y02P70/611 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board 1 through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode 3 as a connecting element. Further, surface roughness (Ra) of an external electrode 3 of an electronic part is set to 0.1 μm or more and to 10.0 μm or less and preferably to 1.0 μm or more and to 5.0 μm or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.
摘要翻译： 电子部件4的外部电极3的表面形成有含有树脂成分的涂层。 因此，通过导电粘合剂的介质将电子部件安装到电路板1上可以显着改善粘附强度和可靠性。 此外，通过利用形成作为连接元件的外部电极3的导电粘合剂，能够将电子部件安装到要安装的元件上。 此外，电子部件的外部电极3的表面粗糙度（R a1 a）设定为0.1μm以上至10.0μm以下，优选为1.0μm以上且5.0μm以下 。 因此，与传统的电子部件相比，与导电粘合剂的粘附强度可以显着提高。
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