公开(公告)号：US06486551B1

公开(公告)日：2002-11-26

申请号：US09340672

申请日：1999-06-29

申请人： Kazuhisa Sato ,  Hiroyuki Hashimoto

发明人： Kazuhisa Sato ,  Hiroyuki Hashimoto

IPC分类号： A01L2348

CPC分类号： H05K3/246 ,  H01L23/49811 ,  H01L23/538 ,  H01L24/02 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/30107 ,  H05K1/092 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A wired board comprises a plurality of bonding pads for connection to connecting terminals of an electronic part, and a plurality of external connection terminals for connection to connecting terminals of an external circuit board such as a motherboard. Each of the bonding pads has a metallized layer, and further has a Ni—B-plated layer, a Ni—P-plated layer and a Au-plated layer which are formed in this order on the metallized layer. The Au-plated layer has the thickness ranging from 1.2 to 3.5 &mgr;m. Each of the external connection terminals has a metallized layer, and further has a Ni—B-plated layer and a Au-plated layer which are formed in this order on the metallized layer of each of the external connection terminals. The Au-plated layer of each of the external connection terminals has the thickness ranging from 0.01 to 1 &mgr;m. A method of producing the wired board is also provided.

摘要翻译： 布线板包括用于连接到电子部件的连接端子的多个接合焊盘和用于连接到诸如主板的外部电路板的连接端子的多个外部连接端子。 每个接合焊盘具有金属化层，并且还具有在金属化层上依次形成的Ni-B镀层，Ni-P镀层和Au镀层。 镀金层的厚度范围为1.2-3.5μm。 每个外部连接端子具有金属化层，并且还具有在每个外部连接端子的金属化层上依次形成的Ni-B镀层和Au镀层。 每个外部连接端子的镀覆层的厚度范围为0.01至1μm。 还提供了生产该布线板的方法。

公开(公告)号：US06225569B1

公开(公告)日：2001-05-01

申请号：US08970501

申请日：1997-11-14

申请人： Hiroyuki Hashimoto ,  Kazuhisa Sato

发明人： Hiroyuki Hashimoto ,  Kazuhisa Sato

IPC分类号： H05K116

CPC分类号： H05K3/246 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092 ,  H01L2924/00

摘要： A wiring substrate to which an IC chip is connected through soldering is formed from ceramic having electrode pads formed of a metallization layer. At least one nickel layer is formed on the electrode pads. The nickel layer has a thickness in the range of 2.5 &mgr;m to 8 &mgr;m. The nickel layer is preferably composed of a plurality of plated layers, and the outermost layer thereof is preferably formed through Ni-B plating. A gold plating layer is preferably formed on the outermost nickel layer. Further, heating is advantageously performed at least one time during the formation of the plurality of nickel layers.

摘要翻译： 通过焊接连接IC芯片的布线基板由具有由金属化层形成的电极焊盘的陶瓷形成。 在电极焊盘上形成至少一层镍层。 镍层的厚度在2.5μm到8μm的范围内。 镍层优选由多个镀层构成，其最外层优选通过Ni-B镀层形成。 优选在最外层的镍层上形成镀金层。 此外，在形成多个镍层期间有利地进行加热至少一次。

公开(公告)号：US06495211B2

公开(公告)日：2002-12-17

申请号：US09882016

申请日：2001-06-18

申请人： Masahiro Iba ,  Hisashi Wakako ,  Kazuhisa Sato ,  Hiroyuki Hashimoto ,  Yasuo Doi

发明人： Masahiro Iba ,  Hisashi Wakako ,  Kazuhisa Sato ,  Hiroyuki Hashimoto ,  Yasuo Doi

IPC分类号： B05D310

CPC分类号： H05K3/187 ,  H01L21/288 ,  H01L21/67028 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/244 ,  H01L2924/00

摘要： A process for producing a substrate 1 having a base-metal plating layer, which includes an immersion step for immersing the substrate 1 in a plating solution contained in a plating tank 33, to thereby form a base-metal plating layer; a washing step for removing the substrate 1 from the plating tank 33, transferring the substrate 1 to a washing tank, and washing the substrate 1; and a cooling step for applying a cooling liquid to the substrate 1 during at least a portion of the period during which the substrate is transferred to a position where the washing step is carried out after completing the immersion step, to thereby cool the substrate 1. An apparatus for carrying out the above process is also disclosed.

摘要翻译： 一种具有基底金属镀层的基板1的制造方法，其包括将基板1浸渍在镀槽33中所含的镀液中的浸渍工序，从而形成基底金属镀层; 洗涤步骤，用于从电镀槽33去除衬底1，将衬底1转移到洗涤槽中，并洗涤衬底1; 以及在完成浸渍步骤之后将衬底转移到进行洗涤步骤的位置的至少一部分时间内将冷却液施加到衬底1从而冷却衬底1的冷却步骤。 还公开了一种用于执行上述过程的装置。

公开(公告)号：USD689387S1

公开(公告)日：2013-09-10

申请号：US29426374

申请日：2012-07-05

申请人： Hiroshi Muraoka ,  Kazuhisa Sato

设计人： Hiroshi Muraoka ,  Kazuhisa Sato

公开(公告)号：US20050155789A1

公开(公告)日：2005-07-21

申请号：US11078063

申请日：2005-03-11

申请人： Tomoe Suzuki ,  Shinji Yuri ,  Kazuhisa Sato ,  Kozo Yamasaki

发明人： Tomoe Suzuki ,  Shinji Yuri ,  Kazuhisa Sato ,  Kozo Yamasaki

IPC分类号： B32B15/08 ,  B32B27/38 ,  H05K1/05 ,  H05K3/00 ,  H05K3/44 ,  H05K1/03 ,  H05K1/11

CPC分类号： H05K1/056 ,  B32B15/08 ,  B32B27/38 ,  H05K3/0052 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/0909 ,  H05K2201/09709 ,  H05K2201/09745 ,  H05K2203/0369 ,  H05K2203/1572 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49165 ,  Y10T83/0333 ,  Y10T83/0341 ,  Y10T83/0581 ,  Y10T428/12 ,  Y10T428/12361 ,  Y10T428/15 ,  Y10T428/24298 ,  Y10T428/24314 ,  Y10T428/24917

摘要： The invention provides a method for manufacturing printed wiring substrates which can manufacture printed wiring substrates each having resin dielectric layers of uniform thickness and excellent surface flatness while maintaining favorable cutting performance in a dicing step. A multi-printed wiring-substrate panel is manufactured which includes a metal plate having a first main surface and a second main surface, and resin dielectric layers disposed on the first and second main surfaces. The metal plate has first depression portions and second depression portions. The first depression portions are opened at the first main surface and arranged discontinuously along predetermined cutting lines. The second depression portions are opened at the second main surface and arranged discontinuously along the predetermined cutting lines. The multi-printed wiring-substrate panel is cut along the predetermined cutting lines into a plurality of printed wiring substrates.

公开(公告)号：US06872436B2

公开(公告)日：2005-03-29

申请号：US10340031

申请日：2003-01-10

申请人： Tomoe Suzuki ,  Shinji Yuri ,  Kazuhisa Sato ,  Kozo Yamasaki

发明人： Tomoe Suzuki ,  Shinji Yuri ,  Kazuhisa Sato ,  Kozo Yamasaki

IPC分类号： B32B15/08 ,  B32B27/38 ,  H05K1/05 ,  H05K3/00 ,  H05K3/44 ,  B23B3/10

CPC分类号： H05K1/056 ,  B32B15/08 ,  B32B27/38 ,  H05K3/0052 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/0909 ,  H05K2201/09709 ,  H05K2201/09745 ,  H05K2203/0369 ,  H05K2203/1572 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49165 ,  Y10T83/0333 ,  Y10T83/0341 ,  Y10T83/0581 ,  Y10T428/12 ,  Y10T428/12361 ,  Y10T428/15 ,  Y10T428/24298 ,  Y10T428/24314 ,  Y10T428/24917

摘要： The invention provides a method for manufacturing printed wiring substrates which can manufacture printed wiring substrates each having resin dielectric layers of uniform thickness and excellent surface flatness while maintaining favorable cutting performance in a dicing step. A multi-printed wiring-substrate panel is manufactured which includes a metal plate having a first main surface and a second main surface, and resin dielectric layers disposed on the first and second main surfaces. The metal plate has first depression portions and second depression portions. The first depression portions are opened at the first main surface and arranged discontinuously along predetermined cutting lines. The second depression portions are opened at the second main surface and arranged discontinuously along the predetermined cutting lines. The multi-printed wiring-substrate panel is cut along the predetermined cutting lines into a plurality of printed wiring substrates.

公开(公告)号：US06216739B1

公开(公告)日：2001-04-17

申请号：US09556434

申请日：2000-04-24

申请人： Yoshitomo Fukushima ,  Kazuhisa Sato

发明人： Yoshitomo Fukushima ,  Kazuhisa Sato

IPC分类号： F16K1110

CPC分类号： F16K27/003 ,  F17D1/04 ,  Y10T137/87885 ,  Y10T137/87917

摘要： A plurality of connecting blocks are mounted on a base plate. Each block has a base body and a vertical cylindrical portion formed on the base body, and has a vertical hole. The base body has a horizontal hole opened at both sides thereof and communicated with the vertical hole in the cylindrical portion. A plurality of intermediate blocks, each having a fixed portion and a pair of horizontal cylindrical inserting portions formed on both sides of the fixed portion are mounted on the base plate. The intermediate block has a horizontal gas passage having a pair of openings opened at upper surfaces on both sides of the fixed portion. The horizontal hole of each of the connecting blocks is engaged with the corresponding inserting portion of the intermediate block. A cylindrical connecting member having an inlet gas passage and an outlet gas passage is secured in the vertical hole of each connecting block. The outlet gas passage of the inlet side connecting member is communicated with the inlet gas passage of the outlet side connecting member. A gas control unit is secured to the connecting member.

摘要翻译： 多个连接块安装在基板上。 每个块体具有形成在基体上的基体和垂直圆筒部，并且具有垂直孔。 基体具有在其两侧开口的水平孔，并与圆筒部的垂直孔连通。 在基板上安装有多个中间块，每个中间块具有形成在固定部的两侧上的固定部分和一对水平圆柱形插入部分。 中间块具有水平的气体通道，其具有在固定部的两侧的上表面开口的一对开口。 每个连接块的水平孔与中间块的相应的插入部分接合。 具有入口气体通道和出口气体通道的圆柱形连接构件固定在每个连接块的垂直孔中。 入口侧连接构件的出口气体通道与出口侧连接构件的入口气体通道连通。 气体控制单元固定到连接构件。

公开(公告)号：US5583379A

公开(公告)日：1996-12-10

申请号：US514838

申请日：1995-08-14

申请人： Kazuhisa Sato ,  Kazuo Kimura

发明人： Kazuhisa Sato ,  Kazuo Kimura

IPC分类号： H01H1/04 ,  H01L23/495 ,  H01L23/48

CPC分类号： H01L23/49582 ,  H01L2924/00014 ,  H01L2924/0002

摘要： An outer lead having a plurality of external leads 1 for electrically connecting the semiconductor IC of a semiconductor IC package to external devices comprises a base plate 11, a plated base structure formed over the surface of the base plate 11 and consisting of a plurality of plated base layers 12, 13 and 14 of Ni or a Ni alloy, and a surface layer 15 of Au or an Au alloy formed over the uppermost plated base layer 14 of the plated base structure. The number of the plated base layers is at least three. Each plated base layer 12, 13 and 14 of the plated base structure is subjected to crystal-growth annealing after being formed by plating to crystal-grow the grains thereof. A method of fabricating such an outer lead is provided.

摘要翻译： 具有用于将半导体IC封装的半导体IC电连接到外部器件的多个外部引线1的外部引线包括基板11，形成在基板11的表面上的镀覆基体结构，由多个电镀 Ni或Ni合金的基底层12,13和14以及形成在镀覆基底结构的最上面镀覆的基底层14上的Au或Au合金的表面层15。 电镀基层的数量至少为3个。 电镀基体结构的每个镀覆基底层12,13和14在通过电镀形成晶体生长其晶粒之后进行结晶生长退火。 提供一种制造这种外引线的方法。

公开(公告)号：US08744663B2

公开(公告)日：2014-06-03

申请号：US13240684

申请日：2011-09-22

申请人： Kazuhisa Sato ,  Makoto Yamamura ,  Yoshinori Masubuchi

发明人： Kazuhisa Sato ,  Makoto Yamamura ,  Yoshinori Masubuchi

IPC分类号： G01C22/00

CPC分类号： G05D1/0259 ,  G05D1/0225 ,  G05D1/0255 ,  G05D1/0265 ,  G05D1/027 ,  G05D1/0272 ,  G05D1/0274 ,  G05D2201/0208

摘要： In an apparatus for controlling an autonomous operating vehicle having an operating machine and a magnetic sensor adapted to detect a border of a travel-scheduled area, the vehicle is controlled to travel around the area from a start point along the border to sequentially record traveling directions and traveled distances on a bitmap. The generated travel trajectory is transformed to map information. A position of the vehicle is detected using bits of the bitmap of the transformed map information, and the vehicle is controlled to, as traveling straight in the north-south directions, while perform the operation with the operating machine based on the calculated traveling direction, the calculated traveled distance and the determined position, utilizing a primary reference direction obtained from a geomagnetic sensor as a reference.

摘要翻译： 在用于控制具有操作机器的自动操作车辆的装置和适于检测行驶调度区域的边界的磁传感器的情况下，控制车辆沿着边界的起始点绕该区域行进，以顺序地记录行驶方向 并在位图上移动距离。 所生成的行进轨迹被转换为地图信息。 使用变换后的地图信息的位图的位来检测车辆的位置，并且，以与计算出的行驶方向对应的操作机进行操作的同时，将车辆向南 - 南方向行进， 利用从地磁传感器获得的主参考方向作为参考，计算行进距离和确定位置。

公开(公告)号：US07726360B2

公开(公告)日：2010-06-01

申请号：US11361459

申请日：2006-02-23

申请人： Kazuhisa Sato ,  Masanori Hayashi ,  Toshiaki Takeshita ,  Hiroyuki Abe ,  Hisashi Nagaoka ,  Junichi Kobayashi

发明人： Kazuhisa Sato ,  Masanori Hayashi ,  Toshiaki Takeshita ,  Hiroyuki Abe ,  Hisashi Nagaoka ,  Junichi Kobayashi

IPC分类号： B65B1/30 ,  G06F19/00 ,  G06F17/00

CPC分类号： B60S5/02

摘要： Fuel supply station information distributing system includes at least one vehicle, an information distributing server and at least one station, which are interconnected through communication line networks. The information distributing server transmits at every given time a request-to-send for vehicle information to the vehicles as well as a request-to-send for station information to the stations. The information distributing server then creates a fuel supply station information associating for each vehicle based on the vehicle information received from the vehicle and the station information received from the stations, and distributes it to the vehicle. When the vehicle receives the fuel supply station information from the information distributing server, it is displayed on the car navigation screen for notifying the driver.

摘要翻译： 燃料供应站信息分发系统包括通过通信线路网互连的至少一个车辆，信息分发服务器和至少一个站。 信息分发服务器在每个给定时间向车辆发送用于车辆信息的请求发送以及向车站发送用于车站信息的请求。 然后，信息分发服务器基于从车辆接收的车辆信息和从站接收的车站信息，生成与各车辆相关的燃料供给站信息，并将其分配给车辆。 当车辆从信息分发服务器接收到燃料供应站信息时，它被显示在汽车导航屏幕上以通知驾驶员。