MULTI-HEIGHT MULTI-COMPOSITION SEMICONDUCTOR FINS
    2.
    发明申请
    MULTI-HEIGHT MULTI-COMPOSITION SEMICONDUCTOR FINS 审中-公开
    多重多组分半导体FINS

    公开(公告)号:US20150333087A1

    公开(公告)日:2015-11-19

    申请号:US14809919

    申请日:2015-07-27

    摘要: A dielectric material layer is formed on a semiconductor-on-insulator (SOI) substrate including a top semiconductor layer containing a first semiconductor material. An opening is formed within the dielectric material layer, and a trench is formed in the top semiconductor layer within the area of the opening by an etch. A second semiconductor material is deposited to a height above the top surface of the top semiconductor layer employing a selective epitaxy process. Another dielectric material layer can be deposited, and another trench can be formed in the top semiconductor layer. Another semiconductor material can be deposited to a different height employing another selective epitaxy process. The various semiconductor material portions can be patterned to form semiconductor fins having different heights and/or different compositions.

    摘要翻译: 在包含第一半导体材料的顶部半导体层的绝缘体上半导体(SOI)基板上形成电介质材料层。 在电介质材料层内形成一个开口,并通过蚀刻在开口区域内的顶部半导体层中形成沟槽。 使用选择性外延工艺将第二半导体材料沉积到顶部半导体层的顶表面上方的高度。 可以沉积另一个介电材料层,并且可以在顶部半导体层中形成另一个沟槽。 可以使用另一选择性外延工艺将另一种半导体材料沉积到不同的高度。 各种半导体材料部分可以被图案化以形成具有不同高度和/或不同组成的半导体鳍片。