公开(公告)号：US5155906A

公开(公告)日：1992-10-20

申请号：US672110

申请日：1991-03-19

申请人： Yasushi Goto ,  Atsuo Nakajima ,  Isao Tsukagoshi ,  Tomohisa Ohta ,  Yutaka Yamaguchi

发明人： Yasushi Goto ,  Atsuo Nakajima ,  Isao Tsukagoshi ,  Tomohisa Ohta ,  Yutaka Yamaguchi

IPC分类号： H01R43/00 ,  H05K3/22 ,  H05K3/28 ,  H05K3/32 ,  H05K3/36

CPC分类号： H05K3/225 ,  H05K3/288 ,  H05K2203/0769 ,  H05K2203/0783 ,  H05K2203/176 ,  H05K3/321 ,  H05K3/361 ,  Y10T29/49155 ,  Y10T29/49721

摘要： Circuit connections can be repaired with high accuracy and high reliability by peeling a mutually connected circuit portion to be repaired and placing a porous sheet with predetermined shape on the peeled circuit surface, impregnating the porous sheet with a peeling solution, removing the porous sheet containing unnecessary adhesive dissolved by the peeling solution, while cleaning the circuit surface contacted with the peeling solution, and reconnecting the cleaned circuit surface to a circuit surface to be connected via an adhesive.

公开(公告)号：US5001542A

公开(公告)日：1991-03-19

申请号：US443169

申请日：1989-11-30

申请人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

发明人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

IPC分类号： H01R4/04 ,  C09J163/00 ,  G06K19/077 ,  H01B1/00 ,  H01B1/20 ,  H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L23/482 ,  H01L23/498 ,  H05K3/32

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/82365 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01054 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/15151 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1163 ,  H05K3/321

摘要： A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particles size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.

公开(公告)号：US6113728A

公开(公告)日：2000-09-05

申请号：US464118

申请日：1995-06-05

申请人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

发明人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

IPC分类号： H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/482 ,  H05K3/32 ,  B32B31/00 ,  C09J5/10

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L24/13 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/13019 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1163 ,  H05K3/321 ,  Y10T156/1075 ,  Y10T29/4913

摘要： An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.

摘要翻译： 一种粘合膜，其包含（a）液体环氧树脂，（b）具有一个或多个官能团的固体树脂，（c）微胶囊型固化剂，并且如果需要（d）偶联剂，对于连接半导体芯片是有效的 和加热和压力下的接线板。

公开(公告)号：US5843251A

公开(公告)日：1998-12-01

申请号：US853868

申请日：1992-03-20

申请人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

发明人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

IPC分类号： H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/482 ,  H05K3/32 ,  B32B31/00

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L24/13 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/13019 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1163 ,  H05K3/321 ,  Y10T156/1075 ,  Y10T29/4913

摘要： An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.

公开(公告)号：US5120665A

公开(公告)日：1992-06-09

申请号：US671472

申请日：1991-03-19

申请人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

发明人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

IPC分类号： H01R4/04 ,  C09J163/00 ,  G06K19/077 ,  H01B1/00 ,  H01B1/20 ,  H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L23/482 ,  H01L23/498 ,  H05K3/32

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/82365 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01054 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/15151 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1163 ,  H05K3/321

摘要： A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B). Also, a method of using for the composition connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.

公开(公告)号：US6042894A

公开(公告)日：2000-03-28

申请号：US890342

申请日：1997-07-09

申请人： Yasushi Goto ,  Isao Tsukagoshi ,  Tomohisa Ohta

发明人： Yasushi Goto ,  Isao Tsukagoshi ,  Tomohisa Ohta

IPC分类号： C08J5/00 ,  C09J7/02 ,  C09J9/02 ,  H01B1/22 ,  H01R4/04 ,  H01R13/24 ,  H05K3/10 ,  H05K3/32 ,  C08J7/04 ,  B05D5/00 ,  B05D1/36

CPC分类号： H01R13/2414 ,  C09J7/02 ,  C09J9/02 ,  H01B1/22 ,  H01R4/04 ,  H05K3/323 ,  H01L2224/11003 ,  H01L2924/07811 ,  H01L2924/09701 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/09945 ,  H05K2203/0307 ,  H05K2203/0338 ,  H05K3/102

摘要： An isotropically electroconductive resin film material produced by sticking electroconductive particles to a sticking layer formed on a support and fixing therein, and filling a film-forming resin incompatible with the sticking material among the electroconductive particles, has electroconductivity only in the film thickness direction via the electroconductive particles uniformly dispersed in the plane direction, and is suitable for electrically connecting oppositely placed circuits and fine electrodes of a plurality of electronic parts, and for testing electronic parts.

摘要翻译： 通过将导电颗粒粘附到形成在支撑体上并固定在其中的粘着层并且填充与导电颗粒之间的粘合材料不相容的成膜树脂而产生的各向同性导电树脂薄膜材料仅通过该导电颗粒在膜厚度方向上具有导电性 导电颗粒在平面方向上均匀分散，并且适用于电连接多个电子部件的相对放置的电路和精细电极，并用于测试电子部件。

公开(公告)号：US08327706B2

公开(公告)日：2012-12-11

申请号：US12832965

申请日：2010-07-08

申请人： Heewon Jeong ,  Yasushi Goto

发明人： Heewon Jeong ,  Yasushi Goto

IPC分类号： G01P15/08

CPC分类号： G01P3/22 ,  G01C19/5747 ,  G01C19/5762

摘要： A high-performance angular rate detecting device is provided. A driving part including a drive frame and a Coriolis frame is levitated by at least two fixing beams which share a fixed end and are extending in a direction orthogonal to a driving direction, thereby vibrating the driving part. Even when a substrate is deformed by mounting or heat fluctuation, internal stress generated to the fixed beam and a supporting beam is small, thereby maintaining a vibrating state such as resonance frequency and vibration amplitude constant. Therefore, a high-performance angular rate detecting device which is robust to changes in mounting environment can be obtained.

摘要翻译： 提供了一种高性能角速率检测装置。 包括驱动框架和科里奥利框架的驱动部分通过共享固定端并且沿与驱动方向正交的方向延伸的至少两个固定梁悬浮，从而使驱动部分振动。 即使当通过安装或热波动使基板变形时，产生到固定梁和支撑梁的内应力也小，从而保持振动状态，例如共振频率和振动幅度恒定。 因此，可以获得对安装环境变化坚固的高性能角速度检测装置。

公开(公告)号：US07405588B2

公开(公告)日：2008-07-29

申请号：US10933272

申请日：2004-09-03

申请人： Takayuki Kawahara ,  Masayuki Miyazaki ,  Yasushi Goto ,  Natsuki Yokoyama ,  Takahiro Onai

发明人： Takayuki Kawahara ,  Masayuki Miyazaki ,  Yasushi Goto ,  Natsuki Yokoyama ,  Takahiro Onai

IPC分类号： H03K19/173

CPC分类号： G11C23/00 ,  H03K19/1776 ,  H03K19/1778

摘要： The present invention relates to an LSI in which functions can be changed, and realizes, particularly, a system LSI in which functions are changed by changing connections of the circuit by use of MEMS switches. A bistable MEMS switch which can maintain states, and exhibits optimal stitching property, i.e., the switch has a very small resistance of several Ω or less in an on-state, and has an infinite resistance in an off-state; is employed. An element in which functions can be changed during operation, is produced by utilizing a wiring layer of a CMOS semiconductor to form the MEMS switch. A semiconductor device exhibiting high-degree of freedom for changing functions, high-speed, and having small area, is realized.

摘要翻译： 本发明涉及可以改变功能的LSI，特别是实现通过使用MEMS开关改变电路的连接来改变功能的系统LSI。 可以保持状态并且表现出最佳缝合性能的双稳态MEMS开关，即开关在导通状态下具有几欧姆或更小的非常小的电阻，并且在断开状态下具有无限电阻; 被雇用。 通过使用CMOS半导体的布线层来形成功能可以在操作期间改变的元件来形成MEMS开关。 实现了具有高自由度，高速度，小面积化的高自由度的半导体装置。

公开(公告)号：US20080018709A1

公开(公告)日：2008-01-24

申请号：US11737791

申请日：2007-04-20

申请人： KEI TAKENAKA ,  Yasushi Goto

发明人： KEI TAKENAKA ,  Yasushi Goto

IPC分类号： B41J2/05

CPC分类号： F04B19/006 ,  B01F13/0076 ,  B01L3/502792 ,  B01L2200/10 ,  B01L2300/0816 ,  B01L2300/0819 ,  B01L2300/089 ,  B01L2400/0415

摘要： A liquid conveying substrate comprises: rectangular electrodes which are disposed on the substrate surface and whose surfaces are covered with a dielectric with a water repellent surface; first axial electrode columns where the rectangular electrodes are coupled in an x direction; and second axial electrode columns where the rectangular electrodes are coupled in a y direction. Accordingly, electrodes necessary for conveying liquid droplets can be arranged on one substrate, and the number of mechanisms for controlling the potential can be suppressed.

摘要翻译： 液体输送基板包括：矩形电极，其设置在基板表面上，其表面被具有防水表面的电介质覆盖; 第一轴向电极柱，其中矩形电极沿x方向耦合; 以及第二轴向电极列，其中矩形电极在y方向上耦合。 因此，可以在一个基板上配置用于输送液滴所必需的电极，并且可以抑制用于控制电位的机构的数量。

公开(公告)号：US07199022B2

公开(公告)日：2007-04-03

申请号：US10814627

申请日：2004-04-01

申请人： Kan Yasui ,  Toshiyuki Mine ,  Yasushi Goto ,  Natsuki Yokoyama

发明人： Kan Yasui ,  Toshiyuki Mine ,  Yasushi Goto ,  Natsuki Yokoyama

IPC分类号： H01L21/76

CPC分类号： H01L21/76224 ,  Y10S438/907

摘要： In order to achieve an isolation trench formation process according to the present invention in which the structure of a silicon nitride film liner can be easily controlled and to allow both of reduction of the device feature length and reduction in stress occurring in an isolation trench, the silicon nitride film liner is first deposited on the inner wall of the trench formed on a silicon substrate. The upper surface of a first embedded insulator film for filling the inside of the trench is recessed downward so as to expose an upper end portion of the silicon nitride film liner. Next, the exposed portion of the silicon nitride film liner is converted into non-silicon-nitride type insulator film, such as a silicon oxide film. A second embedded insulator film is then deposited on the upper portion of the first embedded insulator film, and the deposited surface is then planarized.

摘要翻译： 为了实现根据本发明的隔离沟槽形成方法，其中可以容易地控制氮化硅膜衬垫的结构并且允许器件特征长度的减小和在隔离沟槽中发生的应力的减小， 氮化硅膜衬垫首先沉积在形成在硅衬底上的沟槽的内壁上。 用于填充沟槽内部的第一嵌入式绝缘体膜的上表面向下凹入以暴露氮化硅膜衬垫的上端部分。 接下来，将氮化硅膜衬垫的露出部分转换成诸如氧化硅膜的非氮化硅型绝缘膜。 然后将第二嵌入式绝缘膜沉积在第一嵌入式绝缘膜的上部上，然后将沉积的表面平坦化。