-
公开(公告)号：US20140069463A1
公开(公告)日：2014-03-13
申请号：US13606071
申请日：2012-09-07
CPC分类号： H01L21/6838 , H01L21/4807 , H01L21/67028
摘要： A system including a shuttle movable along a shuttle path, the shuttle being operable to support a sheet; a pick-up assembly including a yoke and a detection plate located above the shuttle path, the detection plate being freely supported by the yoke and movable in a vertical direction relative to the yoke with an upper limit and a lower limit defined by the yoke, wherein the yoke is operable to pick and place the sheet, and wherein the detection plate is used to detect the presence of a piece of debris on a surface of the sheet or a surface of the shuttle; and a cleaning device located adjacent to the pick-up assembly and above the shuttle path, wherein the cleaning device is operable to remove the piece of debris located on the surface of the sheet or the surface of the shuttle.
摘要翻译： 一种系统，包括可沿梭子轨道运动的往复运动件，梭子可操作以支撑片材; 一个拾取组件，包括位于往复轨道上方的磁轭和检测板，检测板由磁轭自由地支撑并且能够相对于磁轭在垂直方向上具有由磁轭限定的上限和下限， 其中所述轭可操作以拾取和放置所述片材，并且其中所述检测板用于检测片材表面或梭子表面上的碎片的存在; 以及位于所述拾取组件附近并在所述穿梭路径上方的清洁装置，其中所述清洁装置可操作以移除位于所述片材的表面上或所述梭的表面上的所述碎片。
-
2.发明授权
公开(公告)号：US6159765A
公开(公告)日：2000-12-12
申请号：US36170
申请日：1998-03-06
IPC分类号： H01L21/60 , H01L23/495 , H01L23/50 , H01L23/52 , H01L25/04 , H01L25/065 , H01L25/18 , H05K3/34
CPC分类号： H01L25/18 , H01L23/49575 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L2224/05554 , H01L2224/0603 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2224/4943 , H01L2924/00014 , H01L2924/10161 , H01L2924/14 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： An integrated circuit package that has the ability for interdevice communication. The integrated circuit package has a first device mounted within the integrated circuit package. A second device is also mounted within the integrated circuit package. The second device is directly coupled to the first device through interdevice bonding for allowing the first device and the second device to communicate and control one another.
摘要翻译： 具有跨设备通信能力的集成电路封装。 集成电路封装具有安装在集成电路封装内的第一器件。 第二器件也安装在集成电路封装内。 第二设备通过互连结合直接耦合到第一设备，以允许第一设备和第二设备彼此通信和控制。
-
3.发明授权Connecting a plurality of bond pads and/or inner leads with a single bond wire 有权用单根接线连接多个接合焊盘和/或内部引线公开(公告)号：US07326594B2
公开(公告)日：2008-02-05
申请号：US11563803
申请日：2006-11-28
CPC分类号： H01L23/49575 , H01L23/4952 , H01L23/5382 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/05644 , H01L2224/05655 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4813 , H01L2224/48137 , H01L2224/48139 , H01L2224/48247 , H01L2224/484 , H01L2224/48624 , H01L2224/48644 , H01L2224/48655 , H01L2224/48724 , H01L2224/48744 , H01L2224/48755 , H01L2224/48824 , H01L2224/48844 , H01L2224/48855 , H01L2224/4911 , H01L2224/49113 , H01L2224/49175 , H01L2224/85201 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/10161 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2224/45139 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit device comprising an integrated circuit die having a plurality of bond pads that are selectively connected to a plurality of inner leads of a leadframe. At least two bond pads are connected to at least one of the inner leads, and/or at least two inner leads are connected to at least one of bond pads with a single bond wire. A single bond wire is ball or wedge bonded to a first bond pad or inner lead and subsequently wedge bonded to one or more second bond pads or inner leads, then it is connected to a third or last bond pad or inner lead. The single bond wire requires only one connection area at each of the bond pad(s) and/or inner lead(s). The bond pad(s) of the die and/or inner lead(s) of the leadframe are thereby electrically connected together by the single bond wire.
摘要翻译： 一种集成电路器件，包括具有多个接合焊盘的集成电路管芯，所述接合焊盘选择性地连接到引线框架的多个内引线。 至少两个接合焊盘连接到内部引线中的至少一个，和/或至少两个内部引线与具有单键焊丝的至少一个接合焊盘连接。 单键线是球形或楔形结合到第一接合焊盘或内部引线，并且随后楔形结合到一个或多个第二接合焊盘或内部引线上，然后连接到第三或最后的接合焊盘或内部引线。 单键线在每个接合焊盘和/或内引线仅需要一个连接区域。 因此，引线框的管芯和/或内部引线的接合焊盘由此通过单键焊丝电连接在一起。
-
4.发明授权Apparatus and method for removing semiconductor chips from a diced semiconductor wafer 失效从切割的半导体晶片去除半导体芯片的装置和方法
公开(公告)号：US6139676A
公开(公告)日：2000-10-31
申请号：US911603
申请日：1997-08-14
申请人： Joseph D. Fernandez
发明人： Joseph D. Fernandez
CPC分类号： B32B38/10 , H01L21/67132 , Y10S156/943 , Y10S438/976 , Y10T156/1132 , Y10T156/1983
摘要： An apparatus and method is disclosed for removing a selected semiconductor chip from a semiconductor wafer. The selected semiconductor chip is elevated by the use of an X--Y--Z assembly by having a rounded tip portion of a round probe member assembly that is part of the X--Y--Z assembly contact a back portion of a flexible, transparent backing layer beneath the selected semiconductor chip so that removal of the semiconductor chip can be completed by using a vacuum type pencil.
摘要翻译： 公开了一种用于从半导体晶片去除所选择的半导体芯片的装置和方法。 所选择的半导体芯片通过使用XYZ组件被升高，所述XYZ组件具有作为XYZ组件的一部分的圆形探针构件组件的圆形尖端部分接触所选择的半导体芯片之下的柔性透明背衬层的后部，使得 可以通过使用真空型铅笔来完成半导体芯片的去除。
-
公开(公告)号：US07157790B2
公开(公告)日：2007-01-02
申请号：US10209502
申请日：2002-07-31
IPC分类号： H01L31/00
CPC分类号： H01L24/49 , H01L23/4952 , H01L24/45 , H01L24/48 , H01L2224/05554 , H01L2224/05624 , H01L2224/05644 , H01L2224/05655 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4813 , H01L2224/48247 , H01L2224/484 , H01L2224/48624 , H01L2224/48644 , H01L2224/48655 , H01L2224/48724 , H01L2224/48744 , H01L2224/48755 , H01L2224/48824 , H01L2224/48844 , H01L2224/48855 , H01L2224/4911 , H01L2224/49113 , H01L2224/49175 , H01L2224/85201 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01075 , H01L2924/01079 , H01L2924/10161 , H01L2924/14 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： An integrated circuit device comprising an integrated circuit die mounted on a leadframe having a plurality of inner leads. The integrated circuit die has a plurality of bond pads that are electrically connected to the inner leads of the leadframe, wherein at least two bond pads are connected to a one of the plurality of inner leads and/or at least two inner leads are connected to one or more bond pads with a single bond wire. A single bond wire is connected to a first bond pad or inner lead and subsequently wedge or stitch bonded to a second bond pad or inner lead, then it is connected to a third bond pad or inner lead. The single bond wire requires only one connection area at each of the bond pad(s) and inner lead(s). The bond pad(s) of the die and inner lead(s) of the leadframe are thereby electrically connected together by the single bond wire.
摘要翻译： 一种集成电路装置，包括安装在具有多个内引线的引线框上的集成电路管芯。 集成电路管芯具有电连接到引线框架的内部引线的多个接合焊盘，其中至少两个接合焊盘连接到多个内部引线中的一个和/或至少两个内部引线连接到 一个或多个具有单键线的接合焊盘。 单键线连接到第一接合焊盘或内引线，随后楔形或缝合接合到第二接合焊盘或内引线，然后连接到第三接合焊盘或内引线。 单键线在每个接合焊盘和内引线上仅需要一个连接区域。 因此，引线框架的管芯和内引线的接合焊盘由单键焊丝电连接在一起。
-
公开(公告)号：US06333549B2
公开(公告)日：2001-12-25
申请号：US09733780
申请日：2000-12-08
IPC分类号： H01L23495
CPC分类号： H01L25/18 , H01L23/49575 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L2224/05554 , H01L2224/0603 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2224/4943 , H01L2924/00014 , H01L2924/10161 , H01L2924/14 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： An integrated circuit package that has the ability for interdevice communication. The integrated circuit package has a first device mounted within the integrated circuit package. A second device is also mounted within the integrated circuit package. The second device is directly coupled to the first device through interdevice bonding for allowing the first device and the second device to communicate and control one another.
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.035 秒)
