公开(公告)号：US20060261971A1

公开(公告)日：2006-11-23

申请号：US11130648

申请日：2005-05-17

申请人： Janice Danvir ,  Mark Chason ,  Katherine Devanie ,  David Hume

发明人： Janice Danvir ,  Mark Chason ,  Katherine Devanie ,  David Hume

IPC分类号： G08B3/00

CPC分类号： G08B7/062 ,  G08B7/066

摘要： A method and apparatus are provided to aide in emergency egress of a structure. More particularly, egress indicators are co-located with hazard sensors. During detection of a hazard condition, locations of sensors detecting the hazard are identified and a pathway directing traffic away from the hazard is determined. Finally, the egress indicators are operated to direct traffic down the determined pathway.

摘要翻译： 提供了一种在结构的紧急出口中辅助的方法和装置。 更特别地，出口指示器与危险传感器共处。 在检测到危险状况时，识别出检测到危险的传感器的位置，并确定了将危险行驶的路径指向。 最后，出口指示器被操作以将流量导向确定的路径。

公开(公告)号：US20060006817A1

公开(公告)日：2006-01-12

申请号：US11126686

申请日：2005-05-11

申请人： Marc Chason ,  Janice Danvir ,  Katherine Devanie ,  David Hume ,  Tomasz Klosowiak ,  Kevin McDunn

发明人： Marc Chason ,  Janice Danvir ,  Katherine Devanie ,  David Hume ,  Tomasz Klosowiak ,  Kevin McDunn

IPC分类号： G05F1/00 ,  H05B37/02

CPC分类号： H04W52/0296 ,  H04W84/18 ,  H04W88/02 ,  Y02D70/144 ,  Y02D70/162

摘要： An alternating current (AC) powered self organizing wireless node (100, 400, 600) includes a self organizing wireless receiver-transmitter (115), an AC branch connection (105), an AC to direct current (DC) converter (110), a secondary power function (120), and a housing (150). The self organizing wireless receiver-transmitter can communicate information throughout a network of compatible self organizing nodes solely using radio transmission to and reception from nearby self-organizing nodes. The secondary power function can couple power to the AC to DC converter for powering the self organizing wireless receiver-transmitter when AC power is not provided. The AC powered self organizing wireless node is designed and fabricated for agency certification. The AC powered self organizing wireless node may include one or more sensors (125), sensor inputs (135), transducers (130), or control outputs (155).

摘要翻译： 交流（AC）供电的自组织无线节点（100,400,600）包括自组织无线接收器 - 发射器（115），AC分支连接（105），AC至直流（DC）转换器（110） ，辅助电力功能（120）和壳体（150）。 自组织无线接收机 - 发射机可以通过使用到附近的自组织节点的无线电传输和从其接收的相容自组织节点的网络来传送信息。 辅助电源功能可以连接AC到DC转换器的电源，以便在不提供交流电源时给自组织无线接收器 - 发射器供电。 交流供电的自组织无线节点是为代理认证设计和制造的。 AC供电的自组织无线节点可以包括一个或多个传感器（125），传感器输入（135），换能器（130）或控制输出（155）。

公开(公告)号：US07265994B2

公开(公告)日：2007-09-04

申请号：US10356419

申请日：2003-01-31

申请人： Janice Danvir ,  Katherine Devanie ,  Nadia Yala

发明人： Janice Danvir ,  Katherine Devanie ,  Nadia Yala

IPC分类号： H05K7/10 ,  H05K7/12

CPC分类号： H05K3/305 ,  H01L2224/29012 ,  H01L2224/29015 ,  H01L2224/3015 ,  H01L2224/30155 ,  H01L2224/32058 ,  H01L2224/73103 ,  H01L2224/73203 ,  H05K3/3436 ,  H05K7/1053 ,  H05K2201/0129 ,  H05K2201/09909 ,  H05K2201/10734 ,  H05K2203/0191 ,  Y02P70/613 ,  H01L2924/00012

摘要： A self supported underfill film (18) adhesively bonds surface mount integrated circuit packages (14) to a printed circuit board (10). The printed circuit board has conductive traces (12) and exposed conductive pads (13) on the surface. A film adhesive is strategically positioned on the printed circuit board near the conductive pads, and the surface mount integrated circuit package is then placed on the board so that the conductive pads (16) on the package align with the conductive pads on the board. The film adhesive softens when the package is soldered to the board, and the film ultimately serves as an underfill to increase the mechanical integrity of the solder joints.

摘要翻译： 自支撑的底部填充膜（18）将表面贴装集成电路封装（14）粘合地粘合到印刷电路板（10）上。 印刷电路板在表面上具有导电迹线（12）和暴露的导电焊盘（13）。 薄膜粘合剂在导电焊盘附近在印刷电路板上有策略地定位，然后将表面贴装集成电路封装放置在板上，使得封装上的导电焊盘（16）与板上的导电焊盘对准。 当封装焊接到板上时，膜粘合剂软化，并且膜最终用作底部填充物以增加焊点的机械完整性。

公开(公告)号：US06650022B1

公开(公告)日：2003-11-18

申请号：US10241017

申请日：2002-09-11

申请人： Jing Qi ,  Janice Danvir ,  Zhaojin Han ,  Prasanna Kulkarni ,  Nadia Yala ,  Robert Doot

发明人： Jing Qi ,  Janice Danvir ,  Zhaojin Han ,  Prasanna Kulkarni ,  Nadia Yala ,  Robert Doot

IPC分类号： H01L3300

CPC分类号： H01L22/24 ,  H01L23/544 ,  H01L2924/0002 ,  H05K1/0269 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/10734 ,  H05K2203/161 ,  H01L2924/00

摘要： A bumped semiconductor device (10) exhibiting enhanced pattern recognition when illuminated in a machine vision system. The semiconductor device has a substantially coplanar array of solder bumps (16) and a coating of underfill material (17) on one face. A fluxing composition (18) containing an image enhancing agent is selectively deposited over at least two of the solder bumps in the array to modify the optical characteristics of the solder bumps to cause the solder bumps to appear bright against the background of the underfill material when the semiconductor device is illuminated (19) by selected wavelengths of light.

摘要翻译： 凸起的半导体器件（10）在机器视觉系统中被照亮时表现出增强的图案识别。 半导体器件在一个面上具有基本上共面的焊料凸块阵列（16）和底部填充材料（17）的涂层。 包含图像增强剂的助熔剂组合物（18）被选择性地沉积在阵列中的至少两个焊料凸块上，以改变焊料凸块的光学特性，以使得焊料凸块相对于底部填充材料的背景而显得明亮， 半导体器件被选择的波长的光照射（19）。

公开(公告)号：US06821878B2

公开(公告)日：2004-11-23

申请号：US10376405

申请日：2003-02-27

申请人： Janice Danvir ,  Jing Qi

发明人： Janice Danvir ,  Jing Qi

IPC分类号： H01L2144

CPC分类号： H01L24/16 ,  H01L21/563 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29011 ,  H01L2224/29076 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/284 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/00014

摘要： The invention provides a method of attaching an area-array device such as a bumped flip chip to an electrical substrate. An underfill material is applied to a portion of the electrical substrate, and the underfill material is heated to an underfill-material staging temperature. A bumped area-array device is provided, the bumped area-array device including an interconnection surface and a plurality of connective bumps extending from the interconnection surface. The interconnection surface of the bumped area-array device is positioned adjacent the applied underfill material. The bumped area-array device is heated to electrically connect the connective bumps to the electrical substrate. The invention also provides a flip-chip assembly and a printed wiring board panel with pre-applied underfill material.

公开(公告)号：US06649445B1

公开(公告)日：2003-11-18

申请号：US10241265

申请日：2002-09-11

申请人： Jing Qi ,  Janice Danvir ,  Tomasz Klosowiak

发明人： Jing Qi ,  Janice Danvir ,  Tomasz Klosowiak

IPC分类号： H01L2144

CPC分类号： H01L21/561 ,  H01L21/304 ,  H01L21/3043 ,  H01L21/56 ,  H01L21/563 ,  H01L21/78 ,  H01L23/3114 ,  H01L24/29 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/83191 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/00

摘要： A method for providing an underfill material on an integrated circuit chip at the wafer level. The wafer (10) typically contains one or more integrated circuit chips (12), and each integrated circuit chip typically has a plurality of solder bumps (34) on its active surface. The wafer is first diced (22) on the active surface side to form channels (38) that will ultimately define the edges (39) of each individual integrated circuit chip, the dicing being of such a depth that it only cuts part-way through the wafer. The front side (36) of the wafer is then coated (24) with an underfill material (40). Generally, a portion (45) of each solder bump remains uncoated, but in certain cases the bumps can be completely covered. The back side of the wafer is then lapped, ground, polished or otherwise treated (26) so as to remove material down to the level of the previously diced channels. This reduction in the thickness of the wafer causes the original diced channels to now extend completely from the front side to the back side of the wafer. The wafer is then singulated (28) by cutting the underfill material (92) that was deposited in the channels during the coating step, so that the integrated circuit chip (12) is released from the wafer, and the underfill material that was coated on the active side remains affixed to the active surface of each individual integrated circuit chip.

摘要翻译： 一种用于在晶片级的集成电路芯片上提供底部填充材料的方法。 晶片（10）通常包含一个或多个集成电路芯片（12），并且每个集成电路芯片在其有源表面上通常具有多个焊料凸块（34）。 晶片首先在有源表面侧切割（22）以形成最终限定每个单独的集成电路芯片的边缘（39）的通道（38），切割具有这样的深度，使得其仅切割 晶圆。 然后用底部填充材料（40）涂覆（24）晶片的前侧（36）。 通常，每个焊料凸块的一部分（45）保持未涂覆，但在某些情况下，凸块可被完全覆盖。 然后将晶片的背面研磨，研磨，抛光或以其他方式处理（26），以便将材料移除到先前切割的通道的水平。 晶片厚度的这种减小使得原来的切割通道现在完全从晶片的正面延伸到背面。 然后通过切割在涂布步骤期间沉积在通道中的底部填充材料（92）将晶片分割（28），使得集成电路芯片（12）从晶片释放，并将涂覆的底部填充材料 有源侧保持固定到每个单独的集成电路芯片的有源表面。