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16 条记录 (耗时 0.036 秒)

    Interposer for mounting semiconductor dice on substrates
    3.
    发明授权
    Interposer for mounting semiconductor dice on substrates 失效
    用于将半导体裸片安装在基板上的插入器

    公开(公告)号：US06303992B1

    公开(公告)日：2001-10-16

    申请号：US09347542

    申请日：1999-07-06

    申请人： Cuong Van Pham ,  Frank Burke DiPiazza ,  Jay DeAvis Baker ,  Marc Alan Straub ,  Vivek Amir Jairazbhoy

    发明人： Cuong Van Pham ,  Frank Burke DiPiazza ,  Jay DeAvis Baker ,  Marc Alan Straub ,  Vivek Amir Jairazbhoy

    IPC分类号： H01L2348

    CPC分类号： H01L23/473 ,  H01L2224/16225

    摘要： An interposer 10 for electrically coupling a semiconductor die 50 to a substrate 70, comprising: an interposer body 12 made of a dielectric material and having a contact surface 14 and an opposed bonding surface 16; a plurality of contact pads 18 arranged about the periphery of the contact surface 14; a plurality of bonding pads 20 arranged across generally the entire area of the bonding surface 16; and a plurality of electrically conductive conduits 22 disposed generally within the interposer body, such that each conduit 22 connects a respective one of the contact pads 18 with a respective one of the bonding pads 20. The interposer 10 may also include: a sealed cooling channel 28 defined within the interposer body 12; a fluid medium 30 generally filling the cooling channel 28; and a piezoelectric element 26 attached to the interposer body such that the piezoelectric element communicates with the cooling channel 28 and the fluid medium 30, the piezoelectric element being operatively coupled to at least two of the electrically conductive conduits 22.

    摘要翻译： 一种用于将半导体管芯50电耦合到衬底70的插入器10，包括：由介电材料制成并具有接触表面14和相对的接合表面16的插入体本体12; 布置在接触表面14周围的多个接触垫18; 布置在接合表面16的整个区域的多个接合焊盘20; 以及大体上设置在插入体内部的多个导电管道22，使得每个导管22将相应的一个接触焊盘18与相应的一个接合焊盘20连接。插入器10还可以包括：密封的冷却通道 28; 通常填充冷却通道28的流体介质30; 以及压电元件26，其连接到中介体，使得压电元件与冷却通道28和流体介质30连通，压电元件可操作地耦合到至少两个导电导管22。

    Substrate and electrical connector assembly
    5.
    发明授权
    Substrate and electrical connector assembly 失效
    基板和电连接器组件

    公开(公告)号：US6126459A

    公开(公告)日：2000-10-03

    申请号：US822535

    申请日：1997-03-24

    申请人： Prathap Amerwai Reddy ,  Cuong Van Pham ,  Brian John Hayden ,  Daniel Edward Farnstrom

    发明人： Prathap Amerwai Reddy ,  Cuong Van Pham ,  Brian John Hayden ,  Daniel Edward Farnstrom

    IPC分类号： H01R12/65 ,  H05K1/11 ,  H01R9/09

    CPC分类号： H05K1/119 ,  H01R12/65 ,  H05K2201/0191 ,  H05K2201/09118 ,  H05K2201/10303

    摘要： A substrate and electrical connector assembly including a unitary panel structure with metal conductors having a rigid main body portion, a rigid marginal edge portion, and a thin flexible section extending between the rigid main body portion and the rigid marginal edge portion. The assembly also includes an at least one conductive lead deposited on a surface of the plastic panel structure which extends from the rigid main body portion across the flexible section to the rigid marginal edge portion. Further included is an at least one conductive terminal affixed to the rigid marginal edge portion which is in electrical connection with the at least one conductive lead. The at least one conductive terminal is adapted to receive a mating connector. The flexible section enables the rigid marginal edge portion to move relative to the rigid main body portion.

    摘要翻译： 一种基板和电连接器组件，包括具有金属导体的整体面板结构，金属导体具有刚性主体部分，刚性边缘部分以及在刚性主体部分和刚性边缘部分之间延伸的薄柔性部分。 组件还包括沉积在塑料板结构的表面上的至少一个导电引线，该导电引线从刚性主体部分穿过柔性部分延伸到刚性边缘部分。 还包括至少一个固定到刚性边缘部分的导电端子，该刚性边缘部分与至少一个导电引线电连接。 所述至少一个导电端子适于接收配合连接器。 柔性部分使得刚性边缘部分相对于刚性主体部分移动。

    Electrical connector for rigid circuit boards
    6.
    发明授权
    Electrical connector for rigid circuit boards 失效
    电路板用电连接器

    公开(公告)号：US5899759A

    公开(公告)日：1999-05-04

    申请号：US999156

    申请日：1997-12-29

    申请人： Yew Thye Yeow ,  Cuong Van Pham

    发明人： Yew Thye Yeow ,  Cuong Van Pham

    IPC分类号： H01R12/57 ,  H01R12/72 ,  H05K3/34 ,  H01R9/09

    CPC分类号： H01R12/57 ,  H01R12/721 ,  H05K3/3405 ,  H05K2201/09172 ,  H05K2201/10386

    摘要： There is disclosed herein an electrically conductive coupling for connecting an electrical element to a conductive circuit trace on a printed circuit board, comprising: (1) a finger extending outward from an edge of a rigid printed circuit board, wherein the circuit trace terminates on a first surface of the finger; (2) an electrical connector formed from a metal stamping and comprising: a substantially rectotubular barrel portion being dimensioned so as to provide an interference fit with the finger when the finger is inserted therein; an engaging portion being removably connectable with the electrical element; and a transition portion integral with the barrel portion and engaging portion; wherein the finger is connectably inserted into the barrel portion; and (3) a solidified joint of electrically conductive bonding material disposed on the first surface of the finger, such that the joint electrically couples the circuit trace with the barrel portion of the electrical connector.

    摘要翻译： 这里公开了用于将电气元件连接到印刷电路板上的导电电路迹线的导电耦合器，其包括：（1）从刚性印刷电路板的边缘向外延伸的手指，其中电路迹线终止于 手指的第一表面; （2）由金属冲压件形成的电连接器，包括：基本上直立的筒部，其尺寸被设计成当手指插入其中时提供与手指的过盈配合; 接合部分可拆卸地与电气元件连接; 以及与筒部和接合部一体的过渡部分; 其中所述手指可连接地插入到所述筒部中; 和（3）设置在手指的第一表面上的导电接合材料的固化接头，使得接头将电路迹线与电连接器的镜筒部分电耦合。

    Method and apparatus for use in assembling electronic devices
    7.
    发明授权
    Method and apparatus for use in assembling electronic devices 失效
    用于组装电子设备的方法和装置

    公开(公告)号：US06251219B1

    公开(公告)日：2001-06-26

    申请号：US09160202

    申请日：1998-09-17

    申请人： Philip H. Chen ,  Dennis M. Gibson ,  Cuong Van Pham

    发明人： Philip H. Chen ,  Dennis M. Gibson ,  Cuong Van Pham

    IPC分类号： H05K330

    CPC分类号： H01L21/52 ,  Y10T29/4913 ,  Y10T29/53178 ,  Y10T156/1092 ,  Y10T156/1744

    摘要： A fixture holds a plurality of circuit components backside up in a substantially coplanar relationship in the same spatial relationship between the circuit components that the components are intended to have a circuit board or substrate as part of an electronic device. An adhesive applying device, such as a screen printer, applies adhesive to the backside of each circuit component. The circuit components may then be transferred onto a substrate by the use of a piston transfer device, for instance. Preferably, all the circuit components are transferred substantially simultaneously.

    摘要翻译： 固定装置将多个电路组件以基本上共面的关系保持在电路组件之间相同的空间关系中，组件旨在具有作为电子设备的一部分的电路板或衬底。 诸如丝网印刷机的粘合剂施加装置将粘合剂施加到每个电路部件的背面。 然后可以通过使用例如活塞传送装置将电路部件转移到基板上。 优选地，所有电路组件基本上同时传送。

    Method of soldering materials supported on low-melting substrates
    8.
    发明授权
    Method of soldering materials supported on low-melting substrates 失效
    焊接在低熔点基材上的材料的方法

    公开(公告)号：US5921460A

    公开(公告)日：1999-07-13

    申请号：US870049

    申请日：1997-06-05

    申请人： Mark Stephen Topping ,  Cuong Van Pham ,  Brian John Hayden

    发明人： Mark Stephen Topping ,  Cuong Van Pham ,  Brian John Hayden

    IPC分类号： B23K20/10 ,  H01L21/607 ,  H05K3/34 ,  H05K3/36

    CPC分类号： H01L24/80 ,  B23K20/10 ,  H05K3/3494 ,  H05K3/363 ,  B23K2201/36 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2203/0195 ,  H05K2203/0285 ,  H05K3/3421 ,  H05K3/3463

    摘要： A method of soldering materials by controlling ultrasonic energy to effect melting of only the solder in an assembly to be joined that is carried on a low temperature melting substrate. The method facilitates making electrical connections for completing an electronic circuit unit that is supported on a low temperature melting substrate and comprises (a) positioning together first and second conductive terminals for said circuit with a solder deposit therebetween to form an assembly, at least one of the terminals of such assembly being supported directly on such low temperature melting substrate; (b) gripping the assembly between an ultrasonic motion generating horn and an anvil, while exciting the horn to apply ultrasonic vibration to the first terminal to provide sufficient shearing energy that frictionally rubs at least one surface of the solder deposit in a rubbing direction generally parallel to said one surface to rapidly heat and melt the solder deposit; and (c) essentially immediately upon the completion melting of the solder deposit, ceasing the application of ultrasonic shearing energy to allow the solder to solidify and form a soldered diffusion joint between the terminals.

    摘要翻译： 一种通过控制超声能量来焊接材料的方法，以在仅在低温熔融基底上承载的待接合组件中仅熔化焊料。 该方法有助于进行电连接以完成支撑在低温熔融基板上的电子电路单元，并且包括（a）将第一和第二导电端子定位在所述电路之间，其间具有焊料沉积物以形成组件，至少一个 这种组件的端子直接支撑在这种低温熔融基板上; （b）在超声波发生喇叭和砧座之间夹持组件，同时激励喇叭以对第一端子施加超声波振动，以提供足够的剪切能量，其摩擦方向大致平行于摩擦方向摩擦焊料沉积物的至少一个表面 使所述一个表面快速加热和熔化所述焊料沉积物; 和（c）基本上在焊料沉积物完成熔化之后立即停止超声剪切能量的施加，以允许焊料固化并在端子之间形成焊接的扩散接头。

    Connector assembly for electrical interconnection
    9.
    发明授权
    Connector assembly for electrical interconnection 失效
    用于电气互连的连接器组件

    公开(公告)号：US06893300B2

    公开(公告)日：2005-05-17

    申请号：US10195203

    申请日：2002-07-15

    申请人： Hong Zhou ,  Cuong Van Pham

    发明人： Hong Zhou ,  Cuong Van Pham

    IPC分类号： H01R13/05 ,  H01R13/10 ,  H01R13/631 ,  H01R4/48

    CPC分类号： H01R13/052 ,  H01R13/10 ,  H01R13/6315

    摘要： The present invention involves a universal connector assembly for electronic interconnection. The connector assembly includes a printed circuit board to which a male insert is in electrical communication. The male insert includes a strain relief tail connected to the printed circuit board and extends to a contact head. The assembly further includes a female socket for receiving the contact head of the male insert. The female socket has receiving members extending from a base to respective ends. The ends are biasingly spaced apart to define an opening through which the male insert is disposed for electrical contact with the female socket. The receiving members have an inside contact surface and an outside surface wherein the inside surface is configured to complement the outer contact wall of the male insert for electrical engagement when the male insert is disposed through the opening. The assembly further comprises a connector housing to which the base of the female socket is attached.

    摘要翻译： 本发明涉及用于电子互连的通用连接器组件。 连接器组件包括印刷电路板，阳插入件与电连通。 阳插入件包括连接到印刷电路板并延伸到接触头的应变消除尾部。 组件还包括用于接收阳插入件的接触头的阴插座。 阴插座具有从基部延伸到相应端部的接收构件。 端部被偏置地间隔开以限定开口，阳插入物通过该开口设置用于与母插座电接触。 接收构件具有内接触表面和外表面，其中当阳插入件穿过开口设置时，内表面构造成与阳插入件的外接触壁互补以进行电接合。 组件还包括连接器壳体，母插座的底座附接到该壳体。