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    MAGNETICALLY ACTUATED CHUCK FOR EDGE BEVEL REMOVAL
    1.
    发明申请
    MAGNETICALLY ACTUATED CHUCK FOR EDGE BEVEL REMOVAL 有权
    磁力去除的磁力驱动

    公开(公告)号：US20100219920A1

    公开(公告)日：2010-09-02

    申请号：US12394339

    申请日：2009-02-27

    Applicant: Jingbin Feng ,  Aaron LaBrie ,  Kousik Ganesan

    Inventor： Jingbin Feng ,  Aaron LaBrie ,  Kousik Ganesan

    IPC: H01F7/02

    CPC classification number: H01L21/68728 ,  Y10S414/141 ,  Y10T279/18

    Abstract: Provided are magnetically actuated wafer chucks that permit a wafer to be clamped or undamped at any time during a process and at any rotational speed, as desired. Such wafer chucks may include constraining members that are movable between open and closed positions. In a closed position, a constraining member aligns the wafer after wafer handoff and/or clamps the wafer during rotation to prevent it from flying off the chuck. In an open position, the constraining member moves away from the wafer to allow liquid etchant to flow from the wafer edge without obstruction. The constraining members may be, for example, cams, attached to arms or links of the chuck. The cams or other constraining members move between open and closed positions by self-balancing forces including a first force, such as a spring force, that acts to move a cam in a first direction, and a non-contact actuate-able force, such as a magnetic force, that acts to move the cam in the opposite direction. The resulting cam motion is smooth and continuous.

    Abstract translation: 提供了磁力驱动的晶片卡盘，其允许晶片在工艺期间的任何时间以及根据需要以任何转速进行夹紧或无阻尼。 这种晶片卡盘可以包括可在打开位置和闭合位置之间移动的约束构件。 在关闭位置，限制构件在晶片切换之后对准晶片和/或在旋转期间夹紧晶片以防止其从卡盘飞出。 在打开位置，约束构件远离晶片移动，以允许液体蚀刻剂从晶片边缘流动而无障碍。 约束构件可以是例如凸轮，附接到卡盘的臂或连杆。 凸轮或其他约束构件通过自平衡力在打开和关闭位置之间移动，包括用于沿第一方向移动凸轮的第一力（例如弹簧力）和非接触致动力 作为磁力，其作用是使凸轮沿相反方向移动。 所得到的凸轮运动是平滑和连续的。

    Magnetically actuated chuck for edge bevel removal
    2.
    发明授权
    Magnetically actuated chuck for edge bevel removal 有权
    用于边缘斜面去除的磁致动卡盘

    公开(公告)号：US08172646B2

    公开(公告)日：2012-05-08

    申请号：US12394339

    申请日：2009-02-27

    Applicant: Jingbin Feng ,  Aaron LaBrie ,  Kousik Ganesan

    Inventor： Jingbin Feng ,  Aaron LaBrie ,  Kousik Ganesan

    IPC: B24B1/00

    CPC classification number: H01L21/68728 ,  Y10S414/141 ,  Y10T279/18

    Abstract: Provided are magnetically actuated wafer chucks that permit a wafer to be clamped or unclamped at any time during a process and at any rotational speed, as desired. Such wafer chucks may include constraining members that are movable between open and closed positions. In a closed position, a constraining member aligns the wafer after wafer handoff and/or clamps the wafer during rotation to prevent it from flying off the chuck. In an open position, the constraining member moves away from the wafer to allow liquid etchant to flow from the wafer edge without obstruction. The constraining members may be, for example, cams, attached to arms or links of the chuck. The cams or other constraining members move between open and closed positions by self-balancing forces including a first force, such as a spring force, that acts to move a cam in a first direction, and a non-contact actuate-able force, such as a magnetic force, that acts to move the cam in the opposite direction. The resulting cam motion is smooth and continuous.

    Abstract translation: 提供了磁力驱动的晶片卡盘，其允许晶片在工艺期间的任何时间被夹紧或松开，并且根据需要以任何转速。 这种晶片卡盘可以包括可在打开位置和闭合位置之间移动的约束构件。 在关闭位置，限制构件在晶片切换之后对准晶片和/或在旋转期间夹紧晶片以防止其从卡盘飞出。 在打开位置，约束构件远离晶片移动，以允许液体蚀刻剂从晶片边缘流动而无障碍。 约束构件可以是例如凸轮，附接到卡盘的臂或连杆。 凸轮或其他约束构件通过自平衡力在打开和关闭位置之间移动，包括用于沿第一方向移动凸轮的第一力（例如弹簧力）和非接触致动力 作为磁力，其作用是使凸轮沿相反方向移动。 所得到的凸轮运动是平滑和连续的。

    Plating method and apparatus with multiple internally irrigated chambers
    3.
    发明授权
    Plating method and apparatus with multiple internally irrigated chambers 有权
    具有多个内部灌溉室的电镀方法和装置

    公开(公告)号：US08262871B1

    公开(公告)日：2012-09-11

    申请号：US12640992

    申请日：2009-12-17

    Applicant: Steven T. Mayer ,  Shantinath Ghongadi ,  Kousik Ganesan ,  Zhian He ,  Jingbin Feng

    Inventor： Steven T. Mayer ,  Shantinath Ghongadi ,  Kousik Ganesan ,  Zhian He ,  Jingbin Feng

    IPC: C25B9/00 ,  C25D17/00

    CPC classification number: C25D17/001 ,  C25D5/08 ,  C25D17/002 ,  C25D17/008

    Abstract: An apparatus for electroplating a layer of metal onto a work piece surface includes a membrane separating the chamber of the apparatus into a catholyte chamber and an anolyte chamber. In the catholyte chamber is a catholyte manifold region that includes a catholyte manifold and at least one flow distribution tube. The catholyte manifold and at least one flow distribution tube serve to mix and direct catholyte flow in the catholyte chamber. The provided configuration effectively reduces failure and improves the operational ranges of the apparatus.

    Abstract translation: 用于将金属层电镀到工件表面上的装置包括将装置的室分离成阴极电解液室和阳极电解液室的膜。 在阴极电解液室中是阴极电解液歧管区域，其包括阴极电解液歧管和至少一个流量分布管。 阴极电解液歧管和至少一个分流管用于混合和引导阴极电解液在阴极电解液室中的流动。 所提供的配置有效地减少故障并改善设备的操作范围。

    Plating method and apparatus with multiple internally irrigated chambers
    4.
    发明授权
    Plating method and apparatus with multiple internally irrigated chambers 有权
    具有多个内部灌溉室的电镀方法和装置

    公开(公告)号：US08540857B1

    公开(公告)日：2013-09-24

    申请号：US13571199

    申请日：2012-08-09

    Applicant: Steven Mayer ,  Shantinath Ghongadi ,  Kousik Ganesan ,  Zhian He ,  Jingbin Feng

    Inventor： Steven Mayer ,  Shantinath Ghongadi ,  Kousik Ganesan ,  Zhian He ,  Jingbin Feng

    IPC: C25B9/00 ,  C25D17/00 ,  C25D7/12

    CPC classification number: C25D17/001 ,  C25D5/08 ,  C25D17/002 ,  C25D17/008

    Abstract: An apparatus for electroplating a layer of metal onto a work piece surface includes a membrane separating the chamber of the apparatus into a catholyte chamber and an anolyte chamber. In the catholyte chamber is a catholyte manifold region that includes a catholyte manifold and at least one flow distribution tube. The catholyte manifold and at least one flow distribution tube serve to mix and direct catholyte flow in the catholyte chamber. The provided configuration effectively reduces failure and improves the operational ranges of the apparatus.

    Abstract translation: 用于将金属层电镀到工件表面上的装置包括将装置的室分离成阴极电解液室和阳极电解液室的膜。 在阴极电解液室中是阴极电解液歧管区域，其包括阴极电解液歧管和至少一个流量分布管。 阴极电解液歧管和至少一个分流管用于混合和引导阴极电解液在阴极电解液室中的流动。 所提供的配置有效地减少故障并改善设备的操作范围。

    Electroplating Apparatus with Vented Electrolyte Manifold
    6.
    发明申请
    Electroplating Apparatus with Vented Electrolyte Manifold 有权
    带通风电解质歧管的电镀设备

    公开(公告)号：US20100147679A1

    公开(公告)日：2010-06-17

    申请号：US12337147

    申请日：2008-12-17

    Applicant: Jingbin Feng ,  Zhian He ,  Robert Rash ,  Steven T. Mayer

    Inventor： Jingbin Feng ,  Zhian He ,  Robert Rash ,  Steven T. Mayer

    IPC: C25D17/00

    CPC classification number: C25D7/123 ,  C25D17/001 ,  C25D17/002

    Abstract: Embodiments related to increasing a uniformity of an electroplated film are disclosed. For example, one disclosed embodiment provides an electroplating apparatus comprising a plating chamber, a work piece holder, a cathode contact configured to electrically contact a work piece, and an anode contact configured to electrically contact an anode disposed in the plating chamber. A diffusing barrier is disposed between the cathode contact and the anode contact to provide a uniform electrolyte flow to the work piece, and electrolyte delivery and return paths are provided for delivering electrolyte to and away from the plating chamber. Additionally, a vented electrolyte manifold is disposed in the electrolyte delivery path immediately upstream of the plating chamber, the vented electrolyte manifold comprising one or more electrolyte delivery openings that open to the plating chamber and one or more vents that open to a location other than the plating chamber.

    Abstract translation: 公开了与提高电镀膜的均匀性有关的实施例。 例如，一个公开的实施例提供了一种电镀设备，其包括电镀室，工件保持器，构造成电接触工件的阴极接触件和被配置为电接触设置在电镀室中的阳极的阳极接触件。 扩散阻挡层设置在阴极接触件和阳极接触件之间，以提供均匀的电解质流向工件，并且提供电解质输送和返回路径用于将电解质输送到电镀室和远离电镀室。 另外，排气的电解液歧管设置在紧邻镀室的上游的电解质输送路径中，排出的电解质歧管包括一个或多个向电镀室敞开的电解质输送开口，以及一个或多个通向出口 电镀室。

    Plating cup with contoured cup bottom
    8.
    发明授权
    Plating cup with contoured cup bottom 有权
    电镀杯具有轮廓的杯底

    公开(公告)号：US09512538B2

    公开(公告)日：2016-12-06

    申请号：US13609037

    申请日：2012-09-10

    Applicant: Zhian He ,  Jingbin Feng ,  Shantinath Ghongadi ,  Frederick D. Wilmot

    Inventor： Zhian He ,  Jingbin Feng ,  Shantinath Ghongadi ,  Frederick D. Wilmot

    IPC: C25D17/00 ,  C25D17/06 ,  C25D17/12 ,  C25D7/12

    CPC classification number: C25D17/06 ,  C25D7/12 ,  C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  C25D17/007 ,  C25D17/12

    Abstract: Disclosed herein are cups for engaging wafers during electroplating in clamshell assemblies and supplying electrical current to the wafers during electroplating. The cup can comprise an elastomeric seal disposed on the cup and configured to engage the wafer during electroplating, where upon engagement the elastomeric seal substantially excludes plating solution from a peripheral region of the wafer, and where the elastomeric seal and the cup are annular in shape, and comprise one or more contact elements for supplying electrical current to the wafer during electroplating, the one or more contact elements attached to and extending inwardly towards a center of the cup from a metal strip disposed over the elastomeric seal. A notch area of the cup can have a protrusion or an insulated portion on a portion of a bottom surface of the cup where the notch area is aligned with a notch in the wafer.

    Abstract translation: 这里公开了用于在电镀期间在蛤壳式组件中接合晶片并在电镀期间向晶片供应电流的杯子。 杯子可以包括设置在杯子上并被配置为在电镀期间接合晶片的弹性体密封件，其中在接合时，弹性体密封件基本上排除来自晶片的周边区域的电镀溶液，并且其中弹性体密封件和杯子是环形的 并且包括用于在电镀期间向晶片供应电流的一个或多个接触元件，所述一个或多个接触元件从设置在弹性体密封件上方的金属条附接到杯的中心并向内延伸。 杯的切口区域可以在杯的底表面的一部分上具有突起或绝缘部分，其中凹口区域与晶片中的凹口对准。

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