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公开(公告)号：US08947886B2
公开(公告)日：2015-02-03
申请号：US13186112
申请日：2011-07-19
CPC分类号： H01L24/83 , H01L24/00 , H01L24/24 , H01L24/27 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/92 , H01L2224/04026 , H01L2224/056 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/06181 , H01L2224/24226 , H01L2224/24246 , H01L2224/245 , H01L2224/2499 , H01L2224/26165 , H01L2224/27462 , H01L2224/29139 , H01L2224/29147 , H01L2224/29155 , H01L2224/32245 , H01L2224/73217 , H01L2224/82002 , H01L2224/82101 , H01L2224/82345 , H01L2224/82385 , H01L2224/82986 , H01L2224/831 , H01L2224/83851 , H01L2224/92144 , H01L2924/01327 , H01L2924/10253 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1461 , Y10T29/4913 , H01L2924/00 , H01L2924/00014 , H01L2924/014 , H01L2924/01028 , H01L2924/00012 , H01L2924/01029 , H01L2924/01047
摘要： An electronic component includes an electrically conductive carrier. The electrically conductive carrier includes a carrier surface and a semiconductor chip includes a chip surface. One or both of the carrier surface and the chip surface include a non-planar structure. The chip is attached to the carrier with the chip surface facing towards the carrier surface so that a gap is provided between the chip surface and the carrier surface due to the non-planar structure of one or both of the carrier surface and the first chip surface. The electronic component further includes a first galvanically deposited metallic layer situated in the gap.
摘要翻译： 电子部件包括导电载体。 导电载体包括载体表面，半导体芯片包括芯片表面。 载体表面和芯片表面中的一个或两个包括非平面结构。 芯片附着到载体上，其芯片表面面向载体表面，使得由于载体表面和第一芯片表面中的一个或两个的非平面结构，在芯片表面和载体表面之间提供间隙 。 电子部件还包括位于间隙中的第一电沉积金属层。
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公开(公告)号：US20130021766A1
公开(公告)日：2013-01-24
申请号：US13186112
申请日：2011-07-19
CPC分类号： H01L24/83 , H01L24/00 , H01L24/24 , H01L24/27 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/92 , H01L2224/04026 , H01L2224/056 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/06181 , H01L2224/24226 , H01L2224/24246 , H01L2224/245 , H01L2224/2499 , H01L2224/26165 , H01L2224/27462 , H01L2224/29139 , H01L2224/29147 , H01L2224/29155 , H01L2224/32245 , H01L2224/73217 , H01L2224/82002 , H01L2224/82101 , H01L2224/82345 , H01L2224/82385 , H01L2224/82986 , H01L2224/831 , H01L2224/83851 , H01L2224/92144 , H01L2924/01327 , H01L2924/10253 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1461 , Y10T29/4913 , H01L2924/00 , H01L2924/00014 , H01L2924/014 , H01L2924/01028 , H01L2924/00012 , H01L2924/01029 , H01L2924/01047
摘要： An electronic component includes an electrically conductive carrier. The electrically conductive carrier includes a carrier surface and a semiconductor chip includes a chip surface. One or both of the carrier surface and the chip surface include a non-planar structure. The chip is attached to the carrier with the chip surface facing towards the carrier surface so that a gap is provided between the chip surface and the carrier surface due to the non-planar structure of one or both of the carrier surface and the first chip surface. The electronic component further includes a first galvanically deposited metallic layer situated in the gap.
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3.发明授权Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module 有权用于将金属表面附着到载体的方法，将芯片附接到芯片载体的方法，芯片封装模块和封装模块公开(公告)号：US08912450B2
公开(公告)日：2014-12-16
申请号：US13169219
申请日：2011-06-27
IPC分类号： H05K1/02 , H01L23/00 , H05K1/03 , H05K1/09 , H05K1/16 , H05K1/11 , H05K1/00 , H05K1/18 , H05K7/00
CPC分类号： H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/2919 , H01L2224/32225 , H01L2224/83193 , H01L2924/181 , Y10T156/10 , Y10T428/31536 , H01L2924/00
摘要： A method for attaching a metal surface to a carrier is provided, the method including: forming a first polymer layer over the metal surface; forming a second polymer layer over a surface of the carrier; and bringing the first polymer layer into physical contact with the second polymer layer such that at least one of an interpenetrating polymer structure and an inter-diffusing polymer structure is formed between the first polymer layer and the second polymer layer.
摘要翻译： 提供了一种将金属表面附着到载体上的方法，该方法包括：在金属表面上形成第一聚合物层; 在所述载体的表面上形成第二聚合物层; 并且使第一聚合物层与第二聚合物层物理接触，使得在第一聚合物层和第二聚合物层之间形成互穿聚合物结构和互扩散聚合物结构中的至少一个。
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4.发明申请METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATTACHING A CHIP TO A CHIP CARRIER, A CHIP-PACKAGING MODULE AND A PACKAGING MODULE 有权用于将金属表面连接到载体的方法，用于将芯片连接到芯片载体的方法，芯片包装模块和包装模块公开(公告)号：US20120327614A1
公开(公告)日：2012-12-27
申请号：US13169219
申请日：2011-06-27
CPC分类号： H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/2919 , H01L2224/32225 , H01L2224/83193 , H01L2924/181 , Y10T156/10 , Y10T428/31536 , H01L2924/00
摘要： A method for attaching a metal surface to a carrier is provided, the method including: forming a first polymer layer over the metal surface; forming a second polymer layer over a surface of the carrier; and bringing the first polymer layer into physical contact with the second polymer layer such that at least one of an interpenetrating polymer structure and an inter-diffusing polymer structure is formed between the first polymer layer and the second polymer layer.
摘要翻译： 提供了一种将金属表面附着到载体上的方法，该方法包括：在金属表面上形成第一聚合物层; 在所述载体的表面上形成第二聚合物层; 并且使第一聚合物层与第二聚合物层物理接触，使得在第一聚合物层和第二聚合物层之间形成互穿聚合物结构和互扩散聚合物结构中的至少一个。
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5.发明授权公开(公告)号：US09313897B2
公开(公告)日：2016-04-12
申请号：US13620202
申请日：2012-09-14
CPC分类号： H01L23/293 , C25D13/06 , C25D13/12 , H01L21/4825 , H01L21/56 , H01L21/565 , H01L23/3107 , H01L23/3114 , H01L23/49513 , H01L23/4952 , H01L23/49562 , H01L23/49582 , H01L23/49586 , H01L23/573 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/84 , H01L24/85 , H01L2224/2919 , H01L2224/32245 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/40245 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/73263 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83801 , H01L2224/8492 , H01L2224/8592 , H01L2224/92246 , H01L2224/92247 , H01L2924/01322 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/351 , H05K3/284 , H05K2203/135 , Y10T29/49144 , H01L2924/00014 , H01L2924/0665 , H01L2924/00
摘要： A packaged component and a method for making a packaged component are disclosed. In an embodiment the packaged component includes a component carrier having a component carrier contact and a component disposed on the component carrier, the component having a component contact. The packaged component further includes a conductive connection element connecting the component carrier contact with the component contact, an insulating film disposed directly at least on one of a top surface of the component or the conductive connection element, and an encapsulant encapsulating the component carrier, the component and the enclosed conductive connection elements.
摘要翻译： 公开了封装组件和制造封装组件的方法。 在一个实施例中，封装部件包括具有部件载体接触件和设置在部件载体上的部件的部件载体，该部件具有部件接触。 封装部件还包括将部件载体接触件与部件接触件连接的导电连接元件，直接设置在部件或导电连接元件的顶表面中的至少一个上的绝缘膜，以及封装部件载体的密封剂， 组件和封闭的导电连接元件。
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公开(公告)号：US09021887B2
公开(公告)日：2015-05-05
申请号：US13329618
申请日：2011-12-19
申请人： Franz-Peter Kalz , Horst Theuss , Bernhard Winkler , Khalil Hosseini , Joachim Mahler , Manfred Mengel
发明人： Franz-Peter Kalz , Horst Theuss , Bernhard Winkler , Khalil Hosseini , Joachim Mahler , Manfred Mengel
CPC分类号： B81B7/02 , B81B3/0021 , B81B3/0072 , B81B2201/0235 , B81B2201/0264 , B81C2203/0154 , G01L1/18 , G01L9/0072 , G01L19/0092 , G01L19/02
摘要： Micromechanical semiconductor sensing device comprises a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, said piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.
摘要翻译： 微机械半导体感测装置包括被配置为产生电感测信号的微机械感测结构和设置在微机械感测结构中的压阻感测装置，所述压阻感测装置被布置成感测扰动电感测信号的机械应力，并被配置为 基于感测到的电感测信号的机械应力产生电干扰信号。
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公开(公告)号：US20130152696A1
公开(公告)日：2013-06-20
申请号：US13329618
申请日：2011-12-19
申请人： Franz-Peter Kalz , Horst Theuss , Bernhard Winkler , Khalil Hosseini , Joachim Mahler , Manfred Mengel
发明人： Franz-Peter Kalz , Horst Theuss , Bernhard Winkler , Khalil Hosseini , Joachim Mahler , Manfred Mengel
IPC分类号： G01B7/16
CPC分类号： B81B7/02 , B81B3/0021 , B81B3/0072 , B81B2201/0235 , B81B2201/0264 , B81C2203/0154 , G01L1/18 , G01L9/0072 , G01L19/0092 , G01L19/02
摘要： Micromechanical semiconductor sensing device comprises a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, said piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.
摘要翻译： 微机械半导体感测装置包括被配置为产生电感测信号的微机械感测结构和设置在微机械感测结构中的压阻感测装置，所述压阻感测装置被布置成感测扰动电感测信号的机械应力，并被配置为 基于感测到的电感测信号的机械应力产生电干扰信号。
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8.发明申请公开(公告)号：US20130113114A1
公开(公告)日：2013-05-09
申请号：US13289667
申请日：2011-11-04
CPC分类号： H01L24/83 , H01L23/051 , H01L23/3107 , H01L23/49551 , H01L23/49562 , H01L23/49575 , H01L24/33 , H01L2224/0603 , H01L2224/32245 , H01L2224/33181 , H01L2224/83801 , H01L2224/8382 , H01L2224/8384 , H01L2224/8385 , H01L2924/01327 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/1461 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： A device includes a first power semiconductor chip having a first face and a second face opposite to the first face with a first contact pad arranged on the first face. The first contact pad is an external contact pad. The device further includes a first contact clip attached to the second face of the first power semiconductor chip. A second power semiconductor chip is attached to the first contact clip, and a second contact clip is attached to the second power semiconductor chip.
摘要翻译： 一种器件包括第一功率半导体芯片，其具有第一面和与第一面相对的第二面，第一接触垫布置在第一面上。 第一接触垫是外部接触垫。 该装置还包括附接到第一功率半导体芯片的第二面的第一接触夹。 第二功率半导体芯片附接到第一接触夹，第二接触夹附接到第二功率半导体芯片。
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9.发明授权公开(公告)号：US09048338B2
公开(公告)日：2015-06-02
申请号：US13289667
申请日：2011-11-04
IPC分类号： H01L21/00 , H01L23/00 , H01L23/495 , H01L23/051 , H01L23/31
CPC分类号： H01L24/83 , H01L23/051 , H01L23/3107 , H01L23/49551 , H01L23/49562 , H01L23/49575 , H01L24/33 , H01L2224/0603 , H01L2224/32245 , H01L2224/33181 , H01L2224/83801 , H01L2224/8382 , H01L2224/8384 , H01L2224/8385 , H01L2924/01327 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/1461 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： A device includes a first power semiconductor chip having a first face and a second face opposite to the first face with a first contact pad arranged on the first face. The first contact pad is an external contact pad. The device further includes a first contact clip attached to the second face of the first power semiconductor chip. A second power semiconductor chip is attached to the first contact clip, and a second contact clip is attached to the second power semiconductor chip.
摘要翻译： 一种器件包括第一功率半导体芯片，其具有第一面和与第一面相对的第二面，第一接触垫布置在第一面上。 第一接触垫是外部接触垫。 该装置还包括附接到第一功率半导体芯片的第二面的第一接触夹。 第二功率半导体芯片附接到第一接触夹，第二接触夹附接到第二功率半导体芯片。
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10.发明申请Method of Electrophoretic Depositing (EPD) a Film on a System and System Thereof 有权电泳沉积方法（EPD）系统及其系统上的薄膜公开(公告)号：US20140076613A1
公开(公告)日：2014-03-20
申请号：US13620202
申请日：2012-09-14
CPC分类号： H01L23/293 , C25D13/06 , C25D13/12 , H01L21/4825 , H01L21/56 , H01L21/565 , H01L23/3107 , H01L23/3114 , H01L23/49513 , H01L23/4952 , H01L23/49562 , H01L23/49582 , H01L23/49586 , H01L23/573 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/84 , H01L24/85 , H01L2224/2919 , H01L2224/32245 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/40245 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/73263 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83801 , H01L2224/8492 , H01L2224/8592 , H01L2224/92246 , H01L2224/92247 , H01L2924/01322 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/351 , H05K3/284 , H05K2203/135 , Y10T29/49144 , H01L2924/00014 , H01L2924/0665 , H01L2924/00
摘要： A packaged component and a method for making a packaged component are disclosed. In an embodiment the packaged component includes a component carrier having a component carrier contact and a component disposed on the component carrier, the component having a component contact. The packaged component further includes a conductive connection element connecting the component carrier contact with the component contact, an insulating film disposed directly at least on one of a top surface of the component or the conductive connection element, and an encapsulant encapsulating the component carrier, the component and the enclosed conductive connection elements.
摘要翻译： 公开了封装组件和制造封装组件的方法。 在一个实施例中，封装部件包括具有部件载体接触件和设置在部件载体上的部件的部件载体，该部件具有部件接触。 封装部件还包括将部件载体接触件与部件接触件连接的导电连接元件，直接设置在部件或导电连接元件的顶表面中的至少一个上的绝缘膜，以及封装部件载体的密封剂， 组件和封闭的导电连接元件。
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