公开(公告)号：US20130209672A1

公开(公告)日：2013-08-15

申请号：US13763223

申请日：2013-02-08

申请人： Jochen REINMUTH ,  Frank SCHNELL ,  Heribert WEBER ,  Erhard HIRTH ,  Yvonne BERGMANN

发明人： Jochen REINMUTH ,  Frank SCHNELL ,  Heribert WEBER ,  Erhard HIRTH ,  Yvonne BERGMANN

IPC分类号： H05K3/00

CPC分类号： H05K3/0094 ,  B81B2201/0235 ,  B81B2207/096 ,  B81C1/00301 ,  H01L21/743 ,  H01L21/76898 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2924/1461 ,  H05K3/4061 ,  H05K2201/09563 ,  H01L2924/00

摘要： A method for manufacturing a component having a through-connection. The method includes providing a semiconductor substrate, forming a recess in the semiconductor substrate, and introducing into the recess a pourable starting material which has a metal. The method furthermore includes carrying out a heating process, an electrically conductive structure forming the through-connection being developed from the pourable starting material.

摘要翻译： 一种用于制造具有通过连接的部件的方法。 该方法包括提供半导体衬底，在半导体衬底中形成凹陷，并将具有金属的可倾倒起始材料引入凹槽中。 该方法还包括进行加热过程，形成从可倾倒起始材料形成的贯通连接的导电结构。

公开(公告)号：US20130341766A1

公开(公告)日：2013-12-26

申请号：US13915353

申请日：2013-06-11

申请人： Jochen REINMUTH ,  Heribert WEBER ,  Timo SCHARY ,  Yvonne BERGMANN

发明人： Jochen REINMUTH ,  Heribert WEBER ,  Timo SCHARY ,  Yvonne BERGMANN

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L23/481 ,  H01L21/7682 ,  H01L21/76898 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for producing a component having a semiconductor substrate with through-hole plating is provided, the through-plating being surrounded by a recess, and the semiconductor substrate having a first layer on one side, which covers the recess on the first side. The semiconductor substrate has a second layer on a second side, which covers the recess on the second side, and the through-hole plating is surrounded by a ring structure which is produced from the semiconductor substrate. The recess surrounding the ring structure is produced in the same process step or at the same time as the recess for the through-hole plating.

摘要翻译： 提供了具有带通孔电镀的半导体基板的部件的制造方法，所述贯通电镀被凹部包围，所述半导体基板在一侧具有覆盖所述第一侧的所述凹部的第一层。 半导体衬底在第二侧上具有覆盖第二侧的凹部的第二层，并且通孔电镀被由半导体衬底产生的环形结构包围。 围绕环结构的凹部在相同的工艺步骤中或与用于通孔电镀的凹槽同时产生。

公开(公告)号：US20140027927A1

公开(公告)日：2014-01-30

申请号：US13923035

申请日：2013-06-20

申请人： Jochen REINMUTH ,  Jens FREY ,  Yvonne BERGMANN

发明人： Jochen REINMUTH ,  Jens FREY ,  Yvonne BERGMANN

IPC分类号： H01L23/48 ,  H01L21/762

CPC分类号： H01L21/76224 ,  B81B7/007 ,  B81B2207/096 ,  B81C1/00095 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/02 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2224/02311 ,  H01L2224/05009 ,  H01L2224/29111 ,  H01L2224/29117 ,  H01L2224/29124 ,  H01L2224/29147 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/83193 ,  H01L2224/83805 ,  H01L2224/92 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/351 ,  H01L2224/0231 ,  H01L2224/83 ,  H01L21/78 ,  H01L2924/00014 ,  H01L2924/01032 ,  H01L2924/00

摘要： A method for manufacturing a component having an electrical through-connection is described. The method includes the following steps: providing a semiconductor substrate having a front side and a back side opposite from the front side, producing an insulating trench, which annularly surrounds a contact area, on the front side of the semiconductor substrate, filling the insulating trench with an insulating material, producing an electrical contact structure on the front side of the semiconductor substrate by depositing an electrically conductive material in the contact area, removing the semiconductor material remaining in the contact area on the back side of the semiconductor substrate in order to produce a contact hole which opens up the bottom side of the contact structure, and depositing a metallic material in the contact hole in order to electrically connect the electrical contact structure to the back side of the semiconductor substrate.

摘要翻译： 描述了一种用于制造具有电穿通连接的部件的方法。 该方法包括以下步骤：提供具有与前侧相反的前侧和后侧的半导体衬底，在半导体衬底的正面上产生环形地包围接触区域的绝缘沟槽，填充绝缘沟槽 具有绝缘材料，通过在接触区域中沉积导电材料，在半导体衬底的正面上产生电接触结构，去除残留在半导体衬底背面接触区域中的半导体材料，以便产生 接触孔，其向开放接触结构的底侧开口，并且在接触孔中沉积金属材料，以将电接触结构电连接到半导体衬底的背面。

公开(公告)号：US20130189483A1

公开(公告)日：2013-07-25

申请号：US13744611

申请日：2013-01-18

申请人： Jochen REINMUTH ,  Yvonne BERGMANN

发明人： Jochen REINMUTH ,  Yvonne BERGMANN

IPC分类号： H05K13/00

CPC分类号： H05K13/00 ,  B81B2201/0264 ,  B81B2207/095 ,  B81C1/00301 ,  H01L21/7682 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H05K3/002 ,  H05K3/4076 ,  H05K3/421 ,  H05K2201/068 ,  Y10T29/49165 ,  Y10T428/24322 ,  H01L2924/00

摘要： A method is described for manufacturing a component having a through-connection. The method includes providing a substrate; forming a trench structure in the substrate, a substrate area which is completely surrounded by the trench structure being produced; forming a closing layer for closing off the trench structure, a cavity girded by the closing layer being formed in the area of the trench structure; removing substrate material from the substrate area surrounded by the closed-off trench structure; and at least partially filling the substrate area surrounded by the closed-off trench structure with a metallic material. A component having a through-connection is also described.

摘要翻译： 描述了用于制造具有贯通连接的部件的方法。 该方法包括提供基板; 在衬底中形成沟槽结构，被正被制造的沟槽结构完全包围的衬底区域; 形成用于封闭所述沟槽结构的封闭层，由所述封闭层围绕的腔体形成在所述沟槽结构的区域中; 从由封闭沟槽结构包围的衬底区域中去除衬底材料; 并且用金属材料至少部分地填充由封闭沟槽结构包围的衬底区域。 还描述了具有贯通连接的部件。

公开(公告)号：US20150001653A1

公开(公告)日：2015-01-01

申请号：US14314624

申请日：2014-06-25

申请人： Christoph SCHELLING ,  Yvonne BERGMANN ,  Jochen REINMUTH

发明人： Christoph SCHELLING ,  Yvonne BERGMANN ,  Jochen REINMUTH

IPC分类号： B81C1/00 ,  B81B3/00

CPC分类号： B81C1/00158 ,  B81B3/0021 ,  B81B2201/0257

摘要： For simplifying the manufacture of a MEMS structural component including a deflectable diaphragm which spans an opening in the rear side of the structural component, and including a fixed counter-element, which is provided with passage openings, the counter-element from the base substrate of the MEMS structural component is patterned and the deflectable diaphragm is implemented in a layered structure on the base substrate. These measures are intended to improve the diaphragm properties and reduce the overall height of the MEMS structural component.

摘要翻译： 为了简化MEMS结构部件的制造，该MEMS结构部件包括跨越结构部件的后侧的开口的可偏转隔膜，并且包括设置有通道开口的固定的相对元件，来自基底基板的相对元件 MEMS结构部件被图案化，并且可偏转膜片以基底衬底上的分层结构实现。 这些措施旨在改善隔膜性能并降低MEMS结构部件的整体高度。

公开(公告)号：US20130341738A1

公开(公告)日：2013-12-26

申请号：US13921419

申请日：2013-06-19

申请人： Jochen REINMUTH ,  Jens FREY ,  Yvonne BERGMANN

发明人： Jochen REINMUTH ,  Jens FREY ,  Yvonne BERGMANN

IPC分类号： B81C1/00 ,  B81B3/00

CPC分类号： B81C1/00134 ,  B81B3/0018 ,  B81B7/007 ,  B81B2207/095

摘要： A method for manufacturing a component having an electrical through-connection includes: providing a semiconductor substrate having a front side and a back side opposite from the front side; producing, on the front side of the semiconductor substrate, an insulating trench which annularly surrounds a contact area; introducing an insulating material into the insulating trench; producing a contact hole on the front side of the semiconductor substrate by removing the semiconductor material surrounded by the insulating trench in the contact area; and depositing a metallic material in the contact hole.

摘要翻译： 一种用于制造具有电穿通连接的部件的方法包括：提供具有前侧和与前侧相对的后侧的半导体衬底; 在所述半导体衬底的前侧产生环形地围绕接触区域的绝缘沟槽; 将绝缘材料引入绝缘沟槽中; 通过去除由接触区域中的绝缘沟槽围绕的半导体材料，在半导体衬底的正面上产生接触孔; 以及在所述接触孔中沉积金属材料。

公开(公告)号：US20110169125A1

公开(公告)日：2011-07-14

申请号：US13004599

申请日：2011-01-11

申请人： Jochen REINMUTH ,  Barbara Will ,  Heribert Weber

发明人： Jochen REINMUTH ,  Barbara Will ,  Heribert Weber

IPC分类号： H01L29/06 ,  H01L21/60

CPC分类号： H01L21/3081 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/033 ,  B81C1/00404 ,  B81C1/00626 ,  H01L21/0334 ,  H01L21/76229

摘要： A method is described for creating at least one recess in a semiconductor component, in particular a micromechanical or electrical semiconductor component, having the following steps: applying at least one mask to the semiconductor component, forming at least one lattice having at least one or more lattice openings in the mask over the recess to be formed, the lattice opening or lattice openings being formed as a function of the etching rate and/or the dimensioning of the recess to be formed; forming the recess below the lattice.

摘要翻译： 描述了一种用于在半导体部件，特别是微机电或电半导体部件中形成至少一个凹部的方法，其具有以下步骤：将至少一个掩模施加到半导体部件，形成至少一个具有至少一个或多个 在要形成的凹部上的掩模中的格子孔，形成作为蚀刻速率和/或要形成的凹部的尺寸的函数的格子孔或格子孔; 在网格下面形成凹陷。

公开(公告)号：US20140374853A1

公开(公告)日：2014-12-25

申请号：US14307662

申请日：2014-06-18

申请人： Heribert WEBER ,  Hartmut KUEPPERS ,  Jens FREY ,  Jochen REINMUTH ,  Neil DAVIES

发明人： Heribert WEBER ,  Hartmut KUEPPERS ,  Jens FREY ,  Jochen REINMUTH ,  Neil DAVIES

IPC分类号： B81C1/00 ,  B81B3/00

CPC分类号： B81B7/0048 ,  H01L2224/16225

摘要： Measures are provided for stress decoupling between a semiconductor component and its mounting support, these measures being implementable very easily, inexpensively and in a space-saving manner, regardless of the substrate thickness of the component, and not being limited to soldered connections but instead also being usable in conjunction with other mounting and joining techniques. These measures relate to components, which include at least one electrical and/or micromechanical functionality and at least one wiring level, which is formed in a layer structure on a main surface of the component substrate, at least one mounting surface being implemented in the wiring level to establish a mechanical and/or electrical connection of the component to a support. The at least one mounting surface is spring mounted and is separated from the layer structure in at least some areas for this purpose.

摘要翻译： 提供了用于半导体部件与其安装支撑件之间的应力解耦的措施，这些措施可以非常容易地，低成本地且以节省空间的方式实现，而不管部件的基板厚度如何，而不仅限于焊接连接，而且还包括 可与其他安装和连接技术结合使用。 这些措施涉及组件，其包括至少一个电和/或微机械功能和至少一个布线层，其形成在部件基板的主表面上的层结构中，至少一个安装表面被实施在布线 以建立部件与支撑件的机械和/或电连接。 为此，至少一个安装表面是弹簧安装的，并且在至少一些区域中与层结构分离。

公开(公告)号：US20150054101A1

公开(公告)日：2015-02-26

申请号：US14467726

申请日：2014-08-25

申请人： Jochen REINMUTH

发明人： Jochen REINMUTH

IPC分类号： B81B3/00 ,  B81C1/00

CPC分类号： B81B3/0078 ,  B81B7/0016 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00825

摘要： A micromechanical component comprising a substrate having a main plane of extension, comprising a movable element, and comprising a spring arrangement assemblage is provided, the movable element being attached to the substrate by way of the spring arrangement assemblage, the movable element being deflectable out of a rest position into a deflection position, the movable element encompassing a first sub-element and a second sub-element connected to the first sub-element, the first sub-element extending mainly along the main plane of extension of the substrate, the second sub-element extending mainly along a functional plane, the functional plane being disposed substantially parallel to the main plane of extension of the substrate, the functional plane being spaced away from the main plane of extension.

摘要翻译： 一种微机械部件，包括具有主平面延伸部的基板，包括可移动元件，并且包括弹簧装置组合件，所述可移动元件通过所述弹簧装置组合件附接到所述基板，所述可移动元件可偏转 静止位置进入偏转位置，所述可移动元件包围第一子元件和连接到第一子元件的第二子元件，第一子元件主要沿着基板的延伸主平面延伸，第二子元件 子元件主要沿着功能平面延伸，功能平面设置成基本上平行于基板延伸的主平面，功能平面与主延伸平面间隔开。

公开(公告)号：US20120133003A1

公开(公告)日：2012-05-31

申请号：US13298753

申请日：2011-11-17

申请人： Jochen REINMUTH

发明人： Jochen REINMUTH

IPC分类号： H01L29/84

CPC分类号： B81C1/00246 ,  B81B2201/0235 ,  B81B2203/053 ,  B81C2203/0735 ,  B81C2203/0742 ,  G01P15/0802 ,  G01P15/125

摘要： A micromechanical component includes: a substrate having a multitude of trench structures which separate a first and a second mass element of the substrate from a web element of the substrate, in such a way that the first and second mass elements enclose the web element along an extension direction of the main surface of the substrate and are disposed to allow movement relative to the substrate in the direction of a surface normal of the main surface; a first electrode layer applied on the main surface of the substrate and forms a first electrode on the web element between the first and second mass elements; and a second electrode layer applied on the first and second mass elements and forming a self-supporting second electrode above the first electrode in the area of the web element, the first and second electrode forming a capacitance.

摘要翻译： 微机械部件包括：具有多个沟槽结构的衬底，其将衬底的第一和第二质量元件与衬底的腹板元件分开，使得第一和第二质量元件沿着 并且被设置为允许在主表面的法线方向上相对于基板的移动; 施加在所述基板的主表面上的第一电极层，并且在所述网状元件上在所述第一和第二质量元件之间形成第一电极; 以及施加在所述第一和第二质量元件上的第二电极层，并且在所述网状元件的区域中在所述第一电极的上方形成自支撑的第二电极，所述第一和第二电极形成电容。