摘要:
A system and method is disclosed for controlling signal conditioning parameters and a sampling parameter controlling conversion of a received signal to digital sampled values prior to decoding. The sampled values are decoded according to a comparison with expected values calculated according to a model of a transmission channel. The model is also updated from time to time by comparing the expected values with actual sampled values. Variation of the expected values over time is calculated. One or more of the signal conditioning parameters and the sampling parameter are adjusted according to a numerical minimization method such that the system BER is reduced.
摘要:
A system and method is disclosed for controlling signal conditioning parameters and a sampling parameter controlling conversion of a received signal to digital sampled values prior to decoding. The sampled values are decoded according to a comparison with expected values calculated according to a model of a transmission channel. The model is also updated from time to time by comparing the expected values with actual sampled values. Variation of the expected values over time is calculated. One or more of the signal conditioning parameters and the sampling parameter are adjusted according to a numerical minimization method such that the system BER is reduced.
摘要:
A multiple access Proximity Communication system in which electrical elements on an integrated circuit chip provide the multiplexing of multiple signals to a single electrical receiving element on another chip. Multiple pads formed on one chip and receiving separate signals may be capacitively coupled to one large pad on the other chip. Multiple inductive coils on one chip may be magnetically coupled to one large coil on another chip or inductive coils on three or more chips may be used for either transmitting or receiving. The multiplexing may be based on time, frequency, or code.
摘要:
A multi-chip module (MCM) is described in which at least two substrates are mechanically coupled by an adhesive layer that maintains alignment and a zero (or near zero) spacing between proximity connectors on surfaces of the substrates, thereby facilitating high signal quality during proximity communication between the substrates. In order to provide sufficient shear strength, the adhesive layer has a thickness that is larger than the spacing. This may be accomplished using one or more positive and/or negative features on the substrates. For example, the adhesive may be bonded to: one of the surfaces and an inner surface of a channel that is recessed below the other surface; inner surfaces of channels that are recessed below both of the surfaces; or both of the surfaces. In this last case, the zero (or near zero) spacing may be achieved by disposing proximity connectors on a mesa that protrudes above at least one of the substrate surfaces.
摘要:
The disclosed embodiments provide a synchronizer latch circuit that facilitates resolving metastability issues. This synchronizer latch circuit includes a set of lightly loaded, cross-coupled transistors that form a metastable resolving and state-holding element that is coupled to two outputs. An incoming synchronization signal creates a voltage difference between the two outputs, but does not directly force a state change for the outputs. Instead, the data and clock inputs control transistors that allow neighboring power sources and/or ground network connections to weakly influence the outputs. The cross-coupled transistors then amplify the resulting voltage difference to generate valid output voltages, even when the data input and clock signal are received at roughly the same time. Thus, the synchronizer latch circuit facilitates rapidly resolving metastability and improving synchronizer performance.
摘要:
A ramp-stack chip package is described. This chip package includes a vertical stack of semiconductor dies or chips that are offset from each other in a horizontal direction, thereby defining a terrace with exposed pads. A high-bandwidth ramp component, which is positioned approximately parallel to the terrace, is electrically and mechanically coupled to the exposed pads. For example, the ramp component may be coupled to the semiconductor dies using: solder, microsprings and/or an anisotropic conducting film. Furthermore, each of the semiconductor dies includes a static bend so that an end segment of each of the semiconductor dies is parallel to the direction and is mechanically coupled to the ramp component. These end segments may facilitate high-bandwidth communication of signals between the chips and the ramp component, for example, via proximity communication.
摘要:
One embodiment of the present invention provides a system that facilitates capacitive communication between integrated circuit chips. The system includes a substrate having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The system additionally includes an integrated circuit chip having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. Additionally, the integrated circuit chip is pressed against the substrate such that the active face of the integrated circuit chip is parallel to and adjacent to the active face of the substrate, and capacitive signal pads on the active face of the integrated circuit chip overlap signal pads on the active face of the substrate. The arrangement of the substrate and integrated circuit chip facilitates communication between the integrated circuit chip and the substrate through capacitive coupling via the overlapping signal pads.
摘要:
An integrated circuit containing a communication channel is described. This communication channel includes a transmit circuit configured to transmit signals using a voltage-mode driver, a receive circuit, and a capacitive link that couples the transmit circuit to the receive circuit. The communication channel includes a filter with a capacitive-summing junction to equalize signals communicated between the transmit circuit and the receive circuit.
摘要:
A method for calibrating an offset voltage of an amplifier used to amplify capacitively coupled communication signals is described. During this process, a common voltage is applied to one or more inputs to the amplifier. Next, an output of the amplifier is iteratively, measured, and charge is applied to the one or more inputs until the offset voltage is less than a pre-determined value. Note that applying the charge may involve applying a sequence of one or more charge pulses.
摘要:
One embodiment of the present invention provides a system that reduces power consumption by using capacitive coupling to perform a majority detection operation. The system starts by driving a plurality of signals onto a plurality of driven wires. The signals are then fed from each driven wire through a corresponding coupling capacitor to a single majority detection wire. Next, the system feeds signal on the majority detection wire and a bias voltage to a differential receiver. The output of the differential receiver switches if the signal on the majority-detection wire switches relative to the bias voltage. The system then uses the output of the differential receiver to optimize the signals from the plurality of driven wires for transmission across a long signal route. Optimizing the transmission of signals reduces the power consumed by the computer system.