公开(公告)号：US20140008795A1

公开(公告)日：2014-01-09

申请号：US13922722

申请日：2013-06-20

申请人： Jongkook KIM ,  Su-min PARK ,  Soojeoung PARK ,  Bona BAEK ,  Hohyeuk IM ,  Byoungwook JANG ,  Yoonha JUNG

发明人： Jongkook KIM ,  Su-min PARK ,  Soojeoung PARK ,  Bona BAEK ,  Hohyeuk IM ,  Byoungwook JANG ,  Yoonha JUNG

IPC分类号： H01L23/498 ,  H01L21/56

CPC分类号： H01L23/3107 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/5386 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： Provided are a semiconductor package and a method of fabricating the same. The package substrate includes a hole, which may be used to form a mold layer without any void. The mold layer may be partially removed to expose a lower conductive pattern. Accordingly, it is possible to improve routability of solder balls.

摘要翻译： 提供半导体封装及其制造方法。 封装基板包括孔，其可用于形成没有任何空隙的模具层。 可以部分去除模具层以暴露下部导电图案。 因此，可以提高焊球的布线性。

公开(公告)号：US20150189750A1

公开(公告)日：2015-07-02

申请号：US14569845

申请日：2014-12-15

申请人： Byoung Wook JANG ,  Jongkook KIM ,  Su-min PARK

发明人： Byoung Wook JANG ,  Jongkook KIM ,  Su-min PARK

IPC分类号： H05K1/11

CPC分类号： H05K1/111 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/14 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2924/15311 ,  H05K2201/09227 ,  H05K2201/094 ,  H05K2201/10674 ,  Y02P70/611

摘要： Packages substrates are provided. The package substrates may include a substrate and a set of leads disposed on the substrate. The set of lead may include a first lead, a second lead and a third lead, which are sequentially disposed along a first direction. Each of the first lead, the second lead and the third lead may extend along a second direction that is different from the first direction. The first lead and the second lead may be spaced apart at a first distance, and the second lead and the third lead may be spaced apart at a second distance that is less than the first distance.

摘要翻译： 提供包装底物。 封装衬底可以包括衬底和设置在衬底上的一组引线。 该组引线可以包括沿着第一方向依次布置的第一引线，第二引线和第三引线。 第一引线，第二引线和第三引线中的每一个可沿与第一方向不同的第二方向延伸。 第一引线和第二引线可以以第一距离间隔开，并且第二引线和第三引线可以以小于第一距离的第二距离间隔开。

公开(公告)号：US20150228627A1

公开(公告)日：2015-08-13

申请号：US14693352

申请日：2015-04-22

申请人： Heung-Kyu KWON ,  Min-Ok NA ,  Sungwoo PARK ,  Ji-hyun PARK ,  Su-min PARK

发明人： Heung-Kyu KWON ,  Min-Ok NA ,  Sungwoo PARK ,  Ji-hyun PARK ,  Su-min PARK

IPC分类号： H01L25/065 ,  H01L23/31 ,  H01L23/48 ,  H01L23/00

CPC分类号： H01L25/0657 ,  H01L21/561 ,  H01L21/565 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/0557 ,  H01L2224/13099 ,  H01L2224/14181 ,  H01L2224/16112 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17181 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01064 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

摘要翻译： 一种装置包括具有第一焊盘的第一衬底和具有第二焊盘的第二衬底。 第一模塑料置于第一基材和第二基材之间。 第一半导体芯片设置在第一基板上并与第一模制部分接触。 第一连接器接触第一焊盘，第二连接器接触第二焊盘。 第二连接器设置在第一连接器上。 第二连接器的体积大于第一连接器的体积。 露出第一半导体芯片的表面。 第一模塑料与第二连接器相接触，第二连接器的至少一部分由第一模塑料包围。

公开(公告)号：US20110138224A1

公开(公告)日：2011-06-09

申请号：US12787086

申请日：2010-05-25

申请人： Kwang Yong LEE ,  Su-min PARK

发明人： Kwang Yong LEE ,  Su-min PARK

IPC分类号： G06F11/14

CPC分类号： G06F11/079

摘要： A system for tracepoint-based fault diagnosis and recovery includes: a system state tracing model unit for storing state tracing models which are obtained by a modeling technique and are required for fault diagnosis and recovery; a state diagnosis unit for determining whether or not an action event is executable with reference to the state tracing models when the action event is received from a specific tracepoint among multiple tracepoints which exist in each of components within an operating system of the system, and generating a fault recovery command when it is determined that the action is not executable, that is, a fault has occurred; and a fault recovery unit for performing a fault recovery processing based on the state tracing models in response to the generated fault recovery command.

摘要翻译： 用于基于跟踪点的故障诊断和恢复系统包括：用于存储通过建模技术获得并且是故障诊断和恢复所需的状态跟踪模型的系统状态跟踪模型单元; 状态诊断单元，用于当从所述系统的操作系统中的每个组件中存在的多个跟踪点中的特定跟踪点接收到所述动作事件时，参考所述状态跟踪模型来确定动作事件是否可执行，并且生成 确定动作不可执行的故障恢复命令，即已发生故障; 以及故障恢复单元，用于响应于所生成的故障恢复命令，基于状态跟踪模型执行故障恢复处理。