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    POWER MODULE FOR LOW THERMAL RESISTANCE AND METHOD OF FABRICATING THE SAME
    7.
    发明申请
    POWER MODULE FOR LOW THERMAL RESISTANCE AND METHOD OF FABRICATING THE SAME 有权
    用于低耐热性的功率模块及其制造方法

    公开(公告)号：US20100167470A1

    公开(公告)日：2010-07-01

    申请号：US12702615

    申请日：2010-02-09

    申请人： Keun-hyuk Lee ,  O-seob Jeon ,  Seung-won Lim

    发明人： Keun-hyuk Lee ,  O-seob Jeon ,  Seung-won Lim

    IPC分类号： H01L21/56 ,  H01L21/60

    CPC分类号： H01L23/3735 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4334 ,  H01L2224/32225 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00

    摘要： A power module with low thermal resistance buffers the stress put on a substrate during a package molding operation to virtually always prevent a fault in the substrate of the module. The power module includes a substrate, a conductive adhesive layer formed on the substrate, a device layer comprising a support tab, a power device, and a passive device which are formed on the conductive adhesive layer, and a sealing material hermetically sealing the device layer. The support tab is buffers the stress applied by a support pin to the substrate, thereby virtually always preventing a ceramic layer included in the substrate from cracking or breaking. As a result, a reduction in the isolation breakdown voltage of the substrate is virtually always prevented and the failure of the entire power module is do to a reduction in the breakdown voltage of the substrate is virtually always prevented.

    摘要翻译： 具有低热阻的功率模块缓冲在封装成型操作期间施加在基板上的应力，几乎总是防止模块的衬底中的故障。 功率模块包括基板，形成在基板上的导电粘合剂层，形成在导电粘合剂层上的支撑突片，功率器件和无源器件的器件层，以及密封材料密封器件层 。 支撑片缓冲由支撑销施加到基板上的应力，从而实际上总是防止包含在基板中的陶瓷层破裂或断裂。 结果，实际上总是防止基板的隔离击穿电压的降低，并且实际上总是防止整个电源模块的故障，以致基板的击穿电压的降低。

    Power module for low thermal resistance and method of fabricating the same
    10.
    发明授权
    Power module for low thermal resistance and method of fabricating the same 有权
    低热阻功率模块及其制造方法

    公开(公告)号：US07701048B2

    公开(公告)日：2010-04-20

    申请号：US11743829

    申请日：2007-05-03

    申请人： Keun-hyuk Lee ,  O-seob Jeon ,  Seung-won Lim

    发明人： Keun-hyuk Lee ,  O-seob Jeon ,  Seung-won Lim

    IPC分类号： H01L23/52

    CPC分类号： H01L23/3735 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4334 ,  H01L2224/32225 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00

    摘要： A power module with low thermal resistance buffers the stress put on a substrate during a package molding operation to virtually always prevent a fault in the substrate of the module. The power module includes a substrate, a conductive adhesive layer formed on the substrate, a device layer comprising a support tab, a power device, and a passive device which are formed on the conductive adhesive layer, and a sealing material hermetically sealing the device layer. The support tab is buffers the stress applied by a support pin to the substrate, thereby virtually always preventing a ceramic layer included in the substrate from cracking or breaking. As a result, a reduction in the isolation breakdown voltage of the substrate is virtually always prevented and the failure of the entire power module is do to a reduction in the breakdown voltage of the substrate is virtually always prevented.

    摘要翻译： 具有低热阻的功率模块缓冲在封装成型操作期间施加在基板上的应力，几乎总是防止模块的衬底中的故障。 功率模块包括基板，形成在基板上的导电粘合剂层，形成在导电粘合剂层上的支撑突片，功率器件和无源器件的器件层，以及密封材料密封器件层 。 支撑片缓冲由支撑销施加到基板上的应力，从而实际上总是防止包含在基板中的陶瓷层破裂或断裂。 结果，实际上总是防止基板的隔离击穿电压的降低，并且实际上总是防止整个电源模块的故障，以致基板的击穿电压的降低。