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公开(公告)号:US20090243079A1
公开(公告)日:2009-10-01
申请号:US12381957
申请日:2009-03-17
申请人: Seung-won Lim , O-seob Jeon , Seung-yong Choi , Joon-seo Son , Man-kyo Jong
发明人: Seung-won Lim , O-seob Jeon , Seung-yong Choi , Joon-seo Son , Man-kyo Jong
CPC分类号: H01L23/49575 , H01L23/49531 , H01L23/5382 , H01L24/06 , H01L24/28 , H01L24/29 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/05553 , H01L2224/16 , H01L2224/16235 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45139 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48799 , H01L2224/4903 , H01L2224/49051 , H01L2224/4911 , H01L2224/49113 , H01L2224/73253 , H01L2224/73265 , H01L2224/81801 , H01L2224/83801 , H01L2224/83851 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/07802 , H01L2924/0781 , H01L2924/09701 , H01L2924/10253 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1532 , H01L2924/15321 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00 , H01L2924/0665 , H01L2224/45099 , H01L2924/00012 , H01L2924/01049
摘要: Provided is a semiconductor device package including a substrate formed of a silicon (Si)-based material. The semiconductor device package includes a first substrate which comprises first and second principal planes which are opposite each other, and a substrate body layer disposed between the first and second principal planes, the substrate body layer being formed of a silicon (Si)-based material; and at least one first semiconductor device which is mounted on the first principal plane.
摘要翻译: 提供了一种包括由基于硅(Si)的材料形成的衬底的半导体器件封装。 半导体器件封装包括第一衬底,其包括彼此相对的第一和第二主平面以及设置在第一和第二主平面之间的衬底主体层,衬底主体层由基于硅(Si)的材料形成 ; 以及安装在第一主平面上的至少一个第一半导体器件。
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公开(公告)号:US07687903B2
公开(公告)日:2010-03-30
申请号:US12220638
申请日:2008-07-24
申请人: Joon-seo Son , Seung-won Lim , O-seob Jeon
发明人: Joon-seo Son , Seung-won Lim , O-seob Jeon
IPC分类号: H01L23/34
CPC分类号: H01L23/49551 , H01L23/3107 , H01L23/4334 , H01L23/4951 , H01L23/49572 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/165 , H01L2224/16245 , H01L2224/32245 , H01L2224/45139 , H01L2224/48095 , H01L2224/48247 , H01L2224/73253 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1532 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要: Provided are a power module including a power package and a control package that are provided separately and can be highly integrated, and method of fabricating the power module. The power module includes: a molded power package including at least one power device on a first lead frame; and a molded control package vertically stacked on the power package, and including at least one control device on a second lead frame. A first part of the first lead frame and a first part of the second lead frame are coupled to each other so that the power package and the control package can be electrically coupled to each other.
摘要翻译: 提供了一种功率模块,其包括单独提供并且可以高度集成的功率封装和控制封装以及制造功率模块的方法。 功率模块包括:模制功率封装,其包括在第一引线框架上的至少一个功率器件; 以及垂直堆叠在所述功率封装上的模制控制组件,并且在第二引线框架上包括至少一个控制装置。 第一引线框架的第一部分和第二引线框架的第一部分彼此耦合,使得功率封装和控制封装可以彼此电耦合。
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公开(公告)号:US20090129028A1
公开(公告)日:2009-05-21
申请号:US12220638
申请日:2008-07-24
申请人: Joon-seo Son , Seung-won Lim , O-seob Jeon
发明人: Joon-seo Son , Seung-won Lim , O-seob Jeon
CPC分类号: H01L23/49551 , H01L23/3107 , H01L23/4334 , H01L23/4951 , H01L23/49572 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/165 , H01L2224/16245 , H01L2224/32245 , H01L2224/45139 , H01L2224/48095 , H01L2224/48247 , H01L2224/73253 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1532 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要: Provided are a power module including a power package and a control package that are provided separately and can be highly integrated, and method of fabricating the power module. The power module includes: a molded power package including at least one power device on a first lead frame; and a molded control package vertically stacked on the power package, and including at least one control device on a second lead frame. A first part of the first lead frame and a first part of the second lead frame are coupled to each other so that the power package and the control package can be electrically coupled to each other.
摘要翻译: 提供了一种功率模块,其包括单独提供并且可以高度集成的功率封装和控制封装以及制造功率模块的方法。 功率模块包括:模制功率封装,其包括在第一引线框架上的至少一个功率器件; 以及垂直堆叠在所述功率封装上的模制控制组件,并且在第二引线框架上包括至少一个控制装置。 第一引线框架的第一部分和第二引线框架的第一部分彼此耦合,使得功率封装和控制封装可以彼此电耦合。
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公开(公告)号:US20090127681A1
公开(公告)日:2009-05-21
申请号:US12262700
申请日:2008-10-31
申请人: Joon-seo Son , Seung-won Lim , O-seob Jeon
发明人: Joon-seo Son , Seung-won Lim , O-seob Jeon
IPC分类号: H01L23/495 , H01L21/56
CPC分类号: H01L23/49575 , H01L21/565 , H01L23/16 , H01L23/4334 , H01L24/01 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/00
摘要: Provided are a semiconductor package and a method of fabricating the same. The semiconductor package includes a first die-pad on which a semiconductor chip is mounted on a bottom surface of the first die-pad, a support plate disposed adjacent to a lateral surface of the first die-pad, a support prop protruding from the support plate, and supporting the first die-pad, and a package body that encapsulates the first die-pad, the semiconductor chip, and the support plate.
摘要翻译: 提供半导体封装及其制造方法。 半导体封装包括第一裸片焊盘,半导体芯片安装在第一裸片焊盘的底表面上,与第一裸片焊盘的侧表面相邻设置的支撑板,从支撑件突出的支撑支架 并且支撑第一管芯焊盘,以及封装体,其封装第一管芯焊盘,半导体芯片和支撑板。
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公开(公告)号:US08604606B2
公开(公告)日:2013-12-10
申请号:US12845299
申请日:2010-07-28
申请人: Joo-yang Eom , O-seob Jeon , Seung-won Lim , Seung-yong Choi
发明人: Joo-yang Eom , O-seob Jeon , Seung-won Lim , Seung-yong Choi
CPC分类号: H01L23/3675 , H01L23/367 , H01L23/3735 , H01L23/562 , H01L25/165 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H05K1/0306 , H05K1/053 , H05K3/0061 , H05K3/284 , H05K3/341 , H05K3/3484 , H05K2201/0347 , H05K2201/09745 , H05K2203/0315 , H01L2924/00014 , H01L2924/00
摘要: Provided are a heat sink package in which a semiconductor package and a heat sink are bound to each other and a method of fabricating the same. The heat sink package includes a heat sink having a cavity on an upper surface thereof; a metal layer formed on the bottom surface of the cavity; a solder paste layer formed on the metal layer; a substrate on the solder paste layer; and a lead and a semiconductor chip mounted on the substrate.
摘要翻译: 提供一种其中半导体封装和散热器彼此结合的散热器封装及其制造方法。 散热器封装包括在其上表面上具有空腔的散热器; 形成在空腔的底面上的金属层; 形成在所述金属层上的焊膏层; 焊膏层上的基板; 以及安装在基板上的引线和半导体芯片。
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公开(公告)号:US20100289137A1
公开(公告)日:2010-11-18
申请号:US12845299
申请日:2010-07-28
申请人: Joo-yang Eom , O-seob Jeon , Seung-won Lim , Seung-yong Choi
发明人: Joo-yang Eom , O-seob Jeon , Seung-won Lim , Seung-yong Choi
IPC分类号: H01L23/36
CPC分类号: H01L23/3675 , H01L23/367 , H01L23/3735 , H01L23/562 , H01L25/165 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H05K1/0306 , H05K1/053 , H05K3/0061 , H05K3/284 , H05K3/341 , H05K3/3484 , H05K2201/0347 , H05K2201/09745 , H05K2203/0315 , H01L2924/00014 , H01L2924/00
摘要: Provided are a heat sink package in which a semiconductor package and a heat sink are bound to each other and a method of fabricating the same.The heat sink package includes a heat sink having a cavity on an upper surface thereof; a metal layer formed on the bottom surface of the cavity; a solder paste layer formed on the metal layer; a substrate on the solder paste layer; and a lead and a semiconductor chip mounted on the substrate.
摘要翻译: 提供一种其中半导体封装和散热器彼此结合的散热器封装及其制造方法。 散热器封装包括在其上表面上具有空腔的散热器; 形成在空腔的底面上的金属层; 形成在所述金属层上的焊膏层; 焊膏层上的基板; 以及安装在基板上的引线和半导体芯片。
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公开(公告)号:US07786570B2
公开(公告)日:2010-08-31
申请号:US12358758
申请日:2009-01-23
申请人: Joo-Yang Eom , O-seob Jeon , Seung-won Lim , Seung-yong Choi
发明人: Joo-Yang Eom , O-seob Jeon , Seung-won Lim , Seung-yong Choi
CPC分类号: H01L23/3675 , H01L23/367 , H01L23/3735 , H01L23/562 , H01L25/165 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H05K1/0306 , H05K1/053 , H05K3/0061 , H05K3/284 , H05K3/341 , H05K3/3484 , H05K2201/0347 , H05K2201/09745 , H05K2203/0315 , H01L2924/00014 , H01L2924/00
摘要: Provided are a heat sink package in which a semiconductor package and a heat sink are bound to each other and a method of fabricating the same.The heat sink package includes a heat sink having a cavity on an upper surface thereof; a metal layer formed on the bottom surface of the cavity; a solder paste layer formed on the metal layer; a substrate on the solder paste layer; and a lead and a semiconductor chip mounted on the substrate.
摘要翻译: 提供一种其中半导体封装和散热器彼此结合的散热器封装及其制造方法。 散热器封装包括在其上表面上具有空腔的散热器; 形成在空腔的底面上的金属层; 形成在所述金属层上的焊膏层; 焊膏层上的基板; 以及安装在基板上的引线和半导体芯片。
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公开(公告)号:US20090194869A1
公开(公告)日:2009-08-06
申请号:US12358758
申请日:2009-01-23
申请人: Joo-yang Eom , O-seob Jeon , Seung-won Lim , Seung-yong Choi
发明人: Joo-yang Eom , O-seob Jeon , Seung-won Lim , Seung-yong Choi
IPC分类号: H01L23/36
CPC分类号: H01L23/3675 , H01L23/367 , H01L23/3735 , H01L23/562 , H01L25/165 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H05K1/0306 , H05K1/053 , H05K3/0061 , H05K3/284 , H05K3/341 , H05K3/3484 , H05K2201/0347 , H05K2201/09745 , H05K2203/0315 , H01L2924/00014 , H01L2924/00
摘要: Provided are a heat sink package in which a semiconductor package and a heat sink are bound to each other and a method of fabricating the same.The heat sink package includes a heat sink having a cavity on an upper surface thereof; a metal layer formed on the bottom surface of the cavity; a solder paste layer formed on the metal layer; a substrate on the solder paste layer; and a lead and a semiconductor chip mounted on the substrate.
摘要翻译: 提供一种其中半导体封装和散热器彼此结合的散热器封装及其制造方法。 散热器封装包括在其上表面上具有空腔的散热器; 形成在空腔的底面上的金属层; 形成在所述金属层上的焊膏层; 焊膏层上的基板; 以及安装在基板上的引线和半导体芯片。
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公开(公告)号:US06574107B2
公开(公告)日:2003-06-03
申请号:US09791629
申请日:2001-02-26
申请人: O-seob Jeon , Gi-young Jeon , Seung-yong Choi , Seung-won Lim , Seung-jin Kim , Eul-bin Im , Byeong Gon Kim
发明人: O-seob Jeon , Gi-young Jeon , Seung-yong Choi , Seung-won Lim , Seung-jin Kim , Eul-bin Im , Byeong Gon Kim
IPC分类号: H05K720
CPC分类号: H01L23/49537 , H01L23/34 , H01L23/49575 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/85399 , H01L2924/00014 , H01L2924/181 , H01L2924/1815 , H05K7/1432 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要: A stacked intelligent power module package is provided. The intelligent power module package of the present invention includes a power unit including a heat sink and a control unit which is separately manufactured from the power unit and is subsequently stacked on the power unit. The power unit and the control unit of the intelligent power module package are stacked in two different ways including stacking two wire-bonded leadframes of the power unit and the control unit and stacking two separate semiconductor packages of the power unit and the control unit by using locking means formed in each of the semiconductor packages after a trimming/forming process and an electrical property test are finished.
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公开(公告)号:US20090194859A1
公开(公告)日:2009-08-06
申请号:US12358566
申请日:2009-01-23
申请人: In-goo Kang , O-seob Jeon , Joon-seo Son
发明人: In-goo Kang , O-seob Jeon , Joon-seo Son
IPC分类号: H01L23/495 , H01L21/71
CPC分类号: H01L23/49575 , H01L23/4952 , H01L23/49524 , H01L23/49562 , H01L23/49586 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/371 , H01L2224/37124 , H01L2224/37144 , H01L2224/37147 , H01L2224/40247 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48472 , H01L2224/49111 , H01L2224/49171 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要: Provided is a semiconductor package having a power device and methods of fabricating the same. The semiconductor package includes a lead frame, a polymer layer component on the lead frame, a metal layer component on the polymer layer component, and a semiconductor chip on the metal layer component. The polymer layer component may include a material formed by adding alumina Al2O3 an aluminum nitride (AlN), or a boron nitride BN to an epoxy resin. The polymer layer component may have high thermal conductivity and good electric insulating characteristics.
摘要翻译: 提供了具有功率器件的半导体封装及其制造方法。 半导体封装包括引线框架,引线框架上的聚合物层部件,聚合物层部件上的金属层部件和金属层部件上的半导体芯片。 聚合物层组分可以包括通过将氧化铝Al 2 O 3添加到氮化铝(AlN)或氮化硼BN至环氧树脂而形成的材料。 聚合物层组分可具有高导热性和良好的电绝缘特性。
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