摘要:
An apparatus includes a processor for executing instructions at runtime and instructions for dynamically compiling the set of instructions executing at runtime. A memory device stores the instructions to be executed and the dynamic compiling instructions. A memory device serves as a trace buffer used to store traces during formation during the dynamic compiling. The dynamic compiling instructions includes a next-executing-cycle (N-E-C) trace selection process for forming traces for the instructions executing at runtime. The N-E-C trace selection process continues through an existing trace-head when forming traces without terminating a recording of a current trace if an existing trace-head is encountered.
摘要:
An apparatus includes a processor for executing instructions at runtime and instructions for dynamically compiling the set of instructions executing at runtime. A memory device stores the instructions to be executed and the dynamic compiling instructions. A memory device serves as a trace buffer used to store traces during formation during the dynamic compiling. The dynamic compiling instructions includes a next-executing-cycle (N-E-C) trace selection process for forming traces for the instructions executing at runtime. The N-E-C trace selection process continues through an existing trace-head when forming traces without terminating a recording of a current trace if an existing trace-head is encountered.
摘要:
An execution trace of building blocks of computer code includes a head building block at which the execution trace starts, and a tail building block at which the execution trace ends. The building blocks are executable in a sequence from the head building block to the tail building block. The execution trace is truncated at a particular building block of the execution trace, which becomes the tail building block. The particular building block can correspond to a head building block of an additional execution trace, and/or to a loop header building block of a loop within the execution trace and at which the loop is entered. The execution trace is a compilation unit on which basis a trace-based compiler computer program generates an executable version of the code at least by compiling these units.
摘要:
Integrated trace selection and profiling in dynamic optimizers may include selecting a trace head based on profile of basic blocks that are executed. The basic blocks executed from the trace head may be recorded as a trace. The trace may be added to a trace nursery in non-compiled state. The trace may be interpreted and profiled until the trace matures. Under a profiling mode, path sensitive runtime information such as values, types, targets of call-sites, and exit frequencies can be collected. The trace may be moved out of the nursery to a compilation queue in response to determining that the trace has matured based on an execution count of the profiled trace.
摘要:
An execution trace of building blocks of computer code includes a head building block at which the execution trace starts, and a tail building block at which the execution trace ends. The building blocks are executable in a sequence from the head building block to the tail building block. The execution trace is truncated at a particular building block of the execution trace, which becomes the tail building block. The particular building block can correspond to a head building block of an additional execution trace, and/or to a loop header building block of a loop within the execution trace and at which the loop is entered. The execution trace is a compilation unit on which basis a trace-based compiler computer program generates an executable version of the code at least by compiling these units.
摘要:
A tactile sensation providing apparatus, so as to reduce an influence by provision of a tactile sensation on detection of a position by a touch sensor, includes a touch sensor 11, a tactile sensation providing unit 12 disposed near the sensor 11 and configured to vibrate the sensor 11, a touch sensor control unit 20 configured to transmit a scanning signal to the sensor 11 and, by receiving the signal from the sensor 11, to detect the position of the contact to the sensor, signal lines 16, 18 configured to transmit the signal between the sensor 11 and the control unit 20, and a tactile sensation control unit 30 configured to, based on the position of the contact detected by the control unit 20, control the providing unit 12 to vibrate the sensor 11. The providing unit 12 is disposed avoiding overlapping with the lines 16, 18.
摘要:
The present invention relates to methods for amplifying nucleic acids in micro-channels. More specifically, the present invention relates to methods for performing a real-time polymerase chain reaction (PCR) in a continuous-flow microfluidic system and to methods for monitoring real-time PCR in such systems.
摘要:
A printing press control device and a cut-off register control device forcibly move a compensator roller by a set moving amount each time a set time elapses during a period from the start of speed acceleration to the end of speed acceleration.
摘要:
A urea solution reformer and an exhaust gas purifier is configured to heat a carrier gas supplied from a carrier gas source by a carrier gas heating unit, to inject the carrier gas heated by the carrier gas heating unit from a carrier gas injecting nozzle, and to cause a urea solution to be supplied by a first urea solution supply nozzle to a tip end of the carrier gas injecting nozzle so that the urea solution is atomized by the carrier gas injected from the carrier gas injecting nozzle. Provided to face toward the carrier gas injecting nozzle is a catalyst unit for decomposing the atomized urea solution to reform it into an ammonia gas. An ammonia gas supply nozzle is attached to an exhaust pipe of an engine so as to supply the ammonia gas discharged from an outlet of the catalyst unit into the exhaust pipe.
摘要:
A semiconductor device containing: a semiconductor element; a support substrate; an insulating material layer for sealing the semiconductor element and a periphery thereof; a metal thin film wiring layer provided in the insulating material layer, with a part thereof being exposed on an external surface; and metal vias provided in the insulating material layer and electrically connected to the metal thin film wiring layer. The semiconductor element is provided in a plurality of units and the respective semiconductor elements are stacked via an insulating material such that a circuit surface of each semiconductor element faces the metal thin film wiring layer, and electrode pads of each semiconductor element are exposed without being hidden by the semiconductor element stacked thereabove.