Abstract:
Disclosed is a resistor thin film for micro-bolometer for growth of a vanadium dioxide (VO2) thin film in tetragonal VO2 crystal phase by deposition of VO2 on oxide with perovskite structure and a method for fabricating the same, and the resistor thin film for micro-bolometer according to the present disclosure includes a silicon substrate, an oxide thin film with perovskite structure formed on the silicon substrate, and a VO2 thin film in tetragonal crystal phase formed on the oxide thin film with perovskite structure.
Abstract:
Disclosed is a method for manufacturing a semiconductor device, which includes providing a template having a first substrate and a patterned first III-V group compound layer located on the first substrate, forming a sacrificial layer on the patterned first III-V group compound layer by epitaxial growth, forming a second III-V group compound layer on the sacrificial layer by epitaxial growth, bonding a second substrate made of silicon onto the second III-V group compound layer, and separating the second III-V group compound layer and the second substrate from the template by removing the sacrificial layer.
Abstract:
In an aspect of the present disclosure, there is disclosed a manufacture method of an antireflection coating using a self-assembly nano structure, which includes forming a first metal droplet on a substrate by means of droplet epitaxy, depositing a first non-metal on the formed first metal droplet, and forming a first nano compound crystal by means of self-assembly of the deposited first non-metal and the first metal droplet.
Abstract:
The present disclosure to an apparatus for membrane distillation using a solar absorber and a heat pump, in which in the implementation of a membrane distillation process for producing treated water using a temperature difference between raw water and a coolant, raw water is heated using the solar absorber with improved heat collection efficiency, and through this, the treated water production efficiency of the membrane distillation process is improved.
Abstract:
A method for manufacturing a semiconductor device by epitaxial lift-off includes: forming a sacrificial layer containing an III-V compound on a first substrate, forming a device layer on the sacrificial layer, patterning the sacrificial layer and the device layer into a shape having an extending portion along a first direction determined based on a surface orientation of the III-V compound of the sacrificial layer, bonding the patterned device layer onto a second substrate, and etching the sacrificial layer by using an etching solution in a state where the device layer is bonded onto the second substrate, to remove the sacrificial layer and the first substrate. Using the method for manufacturing a semiconductor device, it is possible to improve a process yield and increase a process speed by using the difference in etch rates depending on crystal orientation, which is an inherent characteristic of an III-V compound, during an ELO process.
Abstract:
Provided is a concentration ratio controlling apparatus for concentration type solar cells. The concentration ratio controlling apparatus may include a first condensing unit to primarily concentrate quantity of light that is irradiated from a light source; a second condensing unit disposed between a lower portion of the first condensing unit and a solar cell to secondarily concentrate the quantity of light that has passed through the first condensing unit and thereby irradiate the secondarily concentrated light toward the solar cell; an adjustment unit disposed in an optical path between the light source and the first condensing unit to adjust a concentration area of the first condensing unit based on an external force, and thereby adjust the quantity of light that is concentrated by the first condensing unit; and a control unit to analyze an input signal and thereby supply a corresponding drive control signal to the adjustment unit.
Abstract:
Disclosed is a nano-structure manufacturing method which includes: forming a first semiconductor composite layer, a semiconductor quantum structure layer, a second semiconductor composite layer, and a semiconductor quantum dot layer on a substrate in order; thermally treating the semiconductor quantum dot layer so that quantum dots of the semiconductor quantum dot layer are aggregated; and performing an etching process by using the aggregated quantum dots as a mask.