公开(公告)号：US06191492B1

公开(公告)日：2001-02-20

申请号：US08161859

申请日：1993-12-06

申请人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

发明人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

IPC分类号： H01L2328

CPC分类号： H01L24/48 ,  H01L23/3135 ,  H01L23/49586 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/29339 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/8592 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/05042 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic device comprising a substrate having a frame, a metal lead and an electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film or wherein pores at the surface of the organic resin are filled within an inactive gas such as argon because of a plasma treatment of the resin surface with the inactive gas whereby impurities are prevented from entering into the organic resin through the pores.

摘要翻译： 一种电子设备，包括具有框架，金属引线和接合结构中的电子部件的基板，以及在所述基板上形成的有机树脂的模制件，其中所述有机树脂的表面设置有硬化防水或 碳质膜或其中有机树脂表面的孔被填充在惰性气体如氩气中，因为用惰性气体等离子体处理树脂表面，从而防止杂质通过孔进入有机树脂。

公开(公告)号：US4887548A

公开(公告)日：1989-12-19

申请号：US193680

申请日：1988-05-13

申请人： Kazuo Urata ,  Naoki Hirose ,  Shigenori Hayashi

发明人： Kazuo Urata ,  Naoki Hirose ,  Shigenori Hayashi

IPC分类号： H01L21/31 ,  C23C16/34 ,  C23C16/48 ,  H01L21/205

CPC分类号： C23C16/488

摘要： A thin film manufacturing system comprises a reaction vessel with a window that is transparent to ultraviolet radiation; a means of exhausting gas from the reaction vessel to a reduced pressure condition, a means of introducing a gas into the reaction vessel to form a thin film, a source of ultraviolet radiation that activates the gas, and slits provided at a predetermined interval on the window that is transparent to ultraviolet radiation.

摘要翻译： 薄膜制造系统包括具有对紫外线辐射透明的窗口的反应容器; 将气体从反应容器排出到减压状态的方法，将气体引入反应容器中以形成薄膜，激活气体的紫外线辐射源，以及以预定间隔设置的狭缝的方法 对紫外线辐射透明的窗户。

公开(公告)号：US5147822A

公开(公告)日：1992-09-15

申请号：US667231

申请日：1991-02-25

申请人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

发明人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L23/49586 ,  H01L21/56 ,  H01L23/29 ,  H01L23/3135 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181

摘要： An electronic device comprising a substrate having a frame, a metal lead and electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film.

摘要翻译： 一种电子设备，包括具有框架，金属引线和接合结构中的电子部件的基板，以及在所述基板上形成的有机树脂的模制品，其中所述有机树脂的表面设置有硬化的耐水或含碳的 电影。

公开(公告)号：US06756670B1

公开(公告)日：2004-06-29

申请号：US09698055

申请日：2000-10-30

申请人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

发明人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

IPC分类号： H01L2306

CPC分类号： H01L23/49586 ,  H01L21/56 ,  H01L23/29 ,  H01L23/3135 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/8592 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/05042 ,  H01L2924/00012

摘要： An electronic device comprising a substrate having a frame, a metal lead and an electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film or wherein pores at the surface of the organic resin are filled within an inactive gas such as argon because of a plasma treatment of the resin surface with the inactive gas whereby impurities are prevented from entering into the organic resin through the pores.

摘要翻译： 一种电子设备，包括具有框架，金属引线和接合结构中的电子部件的基板，以及在所述基板上形成的有机树脂的模制件，其中所述有机树脂的表面设置有硬化防水或 碳质膜或其中有机树脂表面的孔被填充在惰性气体如氩气中，因为用惰性气体等离子体处理树脂表面，从而防止杂质通过孔进入有机树脂。

公开(公告)号：US4949004A

公开(公告)日：1990-08-14

申请号：US307190

申请日：1989-02-08

申请人： Shunpei Yamazaki ,  Takashi Inujima ,  Kazuo Urata ,  Mamoru Tashiro ,  Yuji Tanamura ,  Shinji Imato ,  Kenji Itoh ,  Seiichi Odaka ,  Shigenori Hayashi ,  Naoki Hirose

发明人： Shunpei Yamazaki ,  Takashi Inujima ,  Kazuo Urata ,  Mamoru Tashiro ,  Yuji Tanamura ,  Shinji Imato ,  Kenji Itoh ,  Seiichi Odaka ,  Shigenori Hayashi ,  Naoki Hirose

IPC分类号： H01J61/52

CPC分类号： H01J61/52

摘要： A mercury-vapor lamp is provided with a reservoir in which a superfluous amount of mercury is stored in the form of liquid state. The liquid mercury in the reservoir is cooled to a certain temperature. The pressure of mercury-vapor is automatically reduced to the saturated pressure of the liquid mercury cooled. In this configuration, the pressure of mercury-vapor is controlled by adjusting the temperature of the liquid mercury stored in the reservoir.

公开(公告)号：US5192995A

公开(公告)日：1993-03-09

申请号：US655032

申请日：1991-02-14

申请人： Shunepi Yamazaki ,  Kazuo Urata ,  Itaru Koyama ,  Naoki Hirose

发明人： Shunepi Yamazaki ,  Kazuo Urata ,  Itaru Koyama ,  Naoki Hirose

IPC分类号： H01L23/495

CPC分类号： H01L23/49586 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041

摘要： An improved electric device and manufacturing method for the same are described. The device is for example an IC chip clothed with moulding. In advance of the moulding process, the rear surface of lead frame of the IC chip is cleaned and coated with an antioxidation film made of silicon nitride in order to avoid the oxidation of the lead frame. The antioxidation film ensures the connection of the moulding and the lead frame and protect the IC chip from moisture invaded through cracks or gaps. The coating of silicon nitride is carried out after cleaning the lead frame.

摘要翻译： 描述了一种改进的电气装置及其制造方法。 该装置例如是具有成型的IC芯片。 在模制过程之前，为了避免引线框架的氧化，对IC芯片的引线框架的后表面进行清洁并涂覆有由氮化硅制成的抗氧化膜。 抗氧化膜可确保模制品与引线框架的连接，并保护IC芯片免受通过裂缝或间隙侵入的水分。 在清洁引线框架之后进行氮化硅涂层。

公开(公告)号：US5013688A

公开(公告)日：1991-05-07

申请号：US385155

申请日：1989-07-26

申请人： Shunepi Yamazaki ,  Kazuo Urata ,  Itaru Koyama ,  Noriya Ishida ,  Mari Sasaki ,  Shinji Imatou ,  Kazuhisa Nakashita ,  Naoki Hirose

发明人： Shunepi Yamazaki ,  Kazuo Urata ,  Itaru Koyama ,  Noriya Ishida ,  Mari Sasaki ,  Shinji Imatou ,  Kazuhisa Nakashita ,  Naoki Hirose

IPC分类号： H01L21/316 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L24/48 ,  H01L21/56 ,  H01L23/3135 ,  H01L23/49586 ,  H01L2224/05624 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/8592 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10T29/49121

摘要： An improved electric device and manufacturing method for the same are described. The device is, for example, an IC chip clothed with moulding. In advance of the moulding process, the IC chip is coated with silicon nitride in order to protect the IC chip from moisture invaded through cracks or gaps. The coating of silicon nitride is carried out after cleaning the surface of the IC chip by plasma CVD.

摘要翻译： 描述了一种改进的电气装置及其制造方法。 该装置例如是具有成型的IC芯片。 在模制过程之前，IC芯片被涂覆有氮化硅，以保护IC芯片免受通过裂纹或间隙侵入的水分。 在通过等离子体CVD清洁IC芯片的表面之后进行氮化硅涂层。

公开(公告)号：US4950624A

公开(公告)日：1990-08-21

申请号：US194206

申请日：1988-05-16

申请人： Takashi Inuzima ,  Shigenori Hayashi ,  Toru Takayama ,  Seiichi Odaka ,  Naoki Hirose

发明人： Takashi Inuzima ,  Shigenori Hayashi ,  Toru Takayama ,  Seiichi Odaka ,  Naoki Hirose

IPC分类号： C23C16/02 ,  C23C16/40 ,  C23C16/44 ,  C23C16/48 ,  C23C16/517 ,  C23C16/56 ,  H01L21/316

CPC分类号： H01L21/02164 ,  C23C16/0245 ,  C23C16/402 ,  C23C16/4405 ,  C23C16/482 ,  C23C16/488 ,  C23C16/517 ,  C23C16/56 ,  H01L21/0217 ,  H01L21/022 ,  H01L21/02211 ,  H01L21/02216 ,  H01L21/02274 ,  H01L21/02277 ,  H01L21/31608 ,  H01L21/31612 ,  Y10S148/017 ,  Y10S148/043 ,  Y10S148/045 ,  Y10S438/905

摘要： An improved CVD apparatus for depositing a uniform film is shown. The apparatus comprises a reaction chamber, a substrate holder and a plurality of light source for photo CVD or a pair of electrode for plasma CVD. The substrate holder is a cylindrical cart which is encircled by the light sources, and which is rotated around its axis by a driving device. With this configuration, the substrates mounted on the cart and the surroundings can be energized by light or plasma evenly throughout the surfaces to be coated.

公开(公告)号：US06520189B1

公开(公告)日：2003-02-18

申请号：US09398059

申请日：1999-09-17

申请人： Takashi Inushima ,  Shigenori Hayashi ,  Toru Takayama ,  Masakazu Odaka ,  Naoki Hirose

发明人： Takashi Inushima ,  Shigenori Hayashi ,  Toru Takayama ,  Masakazu Odaka ,  Naoki Hirose

IPC分类号： B08B312

CPC分类号： H01L21/02164 ,  C23C16/0245 ,  C23C16/402 ,  C23C16/4405 ,  C23C16/482 ,  C23C16/488 ,  C23C16/517 ,  C23C16/56 ,  H01L21/0217 ,  H01L21/022 ,  H01L21/02211 ,  H01L21/02216 ,  H01L21/02274 ,  H01L21/02277 ,  H01L21/31608 ,  H01L21/31612 ,  Y10S148/017 ,  Y10S148/043 ,  Y10S148/045 ,  Y10S438/905

摘要： An improved CVD apparatus for depositing a uniform film is shown. The apparatus comprises a reaction chamber, a substrate holder and a plurality of light sources for photo CVD or a pair of electrodes for plasma CVD. The substrate holder is a cylindrical cart which is encircled by the light sources, and which is rotated around its axis by a driving device. With this configuration, the substrates mounted on the cart and the surroundings can be energized by light of plasma evenly throughout the surfaces to be coated.

摘要翻译： 示出了用于沉积均匀膜的改进的CVD装置。 该装置包括反应室，衬底保持器和用于光CVD的多个光源或用于等离子体CVD的一对电极。 衬底保持器是由光源包围的圆柱形手推车，并且通过驱动装置绕其轴线旋转。 利用这种结构，安装在推车和周围环境上的基板可以通过等离子体的光均匀地通过待涂覆的表面来激励。

公开(公告)号：US5041201A

公开(公告)日：1991-08-20

申请号：US403821

申请日：1989-09-07

申请人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Shigenori Hayashi ,  Naoki Hirose ,  Noriya Ishida ,  Mari Sasaki ,  Atsushi Kawano

发明人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Shigenori Hayashi ,  Naoki Hirose ,  Noriya Ishida ,  Mari Sasaki ,  Atsushi Kawano

IPC分类号： C23C16/26 ,  C23C16/517

CPC分类号： C23C16/517 ,  C23C16/26

摘要： Plasma CVD method and apparatus are described. The apparatus comprises a vacuum chamber in which two pairs of electrodes are provided. A high frequency voltage is applied to one of the pairs in order to produce a plasma from a reactive gas in the chamber. A substrate to be coated is located between the other of the pairs. A relatively low frequency voltage is applied to the other pair of electrodes. By virtue of the low frequency voltage, the substrate is exposed to the bombardment of ions of the plasma during deposition. The bombardment functions to remove relatively soft portions of the depositing material.