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12 条记录 (耗时 0.035 秒)

    SPONTANEOUSLY ROLLING ADHESIVE SHEET AND METHOD OF MANUFACTURING CUT PIECE
    4.
    发明申请
    SPONTANEOUSLY ROLLING ADHESIVE SHEET AND METHOD OF MANUFACTURING CUT PIECE 审中-公开
    自动滚压胶片及其制造方法

    公开(公告)号：US20120205030A1

    公开(公告)日：2012-08-16

    申请号：US13369886

    申请日：2012-02-09

    申请人： Kazuyuki KIUCHI ,  Akinori NISHIO

    发明人： Kazuyuki KIUCHI ,  Akinori NISHIO

    IPC分类号： B32B38/10 ,  B32B7/12

    CPC分类号： H01L21/6836 ,  C09J7/29 ,  C09J2201/12 ,  C09J2203/326 ,  C09J2475/003 ,  H01L2221/68327 ,  Y10T428/2848

    摘要： A spontaneously rolling adhesive sheet that can spontaneously roll from one end in one direction, or two opposed ends towards the center as a result of thermal stimulus to thereby form one or two cylindrical rolled bodies includes: a spontaneously rolling laminated sheet configured by lamination in the order of a shrinkable film layer which has a principal shrinking characteristic in one predetermined axial direction, a bonding adhesive layer and a rigid film layer, an adhesive layer laminated onto the rigid film layer side of the spontaneously rolling laminated sheet, and an organic coating layer disposed between the rigid film layer and the adhesive layer.

    摘要翻译： 一种自发滚动的粘合片，其可以从一个方向的一端自发地滚动，或者由于热刺激而从两个相对的端部向中心旋转，从而形成一个或两个圆柱形卷筒体，包括：自动卷绕层叠片， 在一个预定轴向上具有主要收缩特性的可收缩膜层的顺序，粘结粘合剂层和刚性膜层，层压在自发层压片的刚性膜层侧上的粘合剂层和有机涂层 设置在刚性膜层和粘合剂层之间。

    SELF-ROLLING LAMINATED SHEET AND SELF-ROLLING PRESSURE-SENSITIVE ADHESIVE SHEET
    7.
    发明申请
    SELF-ROLLING LAMINATED SHEET AND SELF-ROLLING PRESSURE-SENSITIVE ADHESIVE SHEET 失效
    自卷式层压板和自感压敏粘合片

    公开(公告)号：US20080131634A1

    公开(公告)日：2008-06-05

    申请号：US11937525

    申请日：2007-11-09

    申请人： Kazuyuki KIUCHI ,  Akira SHOJI ,  Akinori NISHIO ,  Kunio NAGASAKI

    发明人： Kazuyuki KIUCHI ,  Akira SHOJI ,  Akinori NISHIO ,  Kunio NAGASAKI

    IPC分类号： B65B53/00 ,  B05D5/10

    CPC分类号： B32B1/08 ,  B32B25/14 ,  B32B27/08 ,  C09J7/29 ,  C09J2201/162 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10S428/906 ,  Y10T428/1328 ,  Y10T428/14 ,  Y10T428/1471 ,  Y10T428/28 ,  Y10T428/2839 ,  Y10T428/2848

    摘要： The present invention relates to a self-rolling pressure-sensitive adhesive sheet, comprising a shrinkable film layer which is contractible in at least one axial direction; a restriction layer restricting a contraction of the shrinkable film layer, the restriction layer being disposed on a side of the shrinkable film layer; and a pressure-sensitive adhesive layer disposed on the side of the restriction layer which is opposite to the side on which the shrinkable film layer is disposed, the self-rolling pressure-sensitive adhesive sheet being a releasable pressure-sensitive adhesive sheet, in which the pressure-sensitive adhesive layer or the pressure-sensitive adhesive layer after an adhesiveness decreasing treatment has a pressure-sensitive adhesive power (180° peeling, against a silicon mirror wafer, tensile speed: 300 mm/min) of 6.5 N/10 mm or less, and in which the self-rolling pressure-sensitive adhesive sheet rolls up in one direction from an end to form one tubular roll or rolls up from two opposing ends toward a center of the two opposing ends to form two tubular rolls, when the self-rolling pressure-sensitive sheet is stimulated to induce the contraction of the shrinkable film layer. The self-rolling pressure-sensitive adhesive sheet can be very easily peeled off from an adherend without causing a damage or a contamination on the adherend, even when it is adhered to an adherend of a relatively low strength.

    摘要翻译： 本发明涉及一种自动压敏粘合片，其包括可沿至少一个轴向收缩的可收缩膜层; 限制层限制可收缩膜层的收缩，限制层设置在可收缩膜层的一侧; 以及设置在限制层的与设置有可收缩膜层的一侧相反的一侧的压敏粘合剂层，所述自动压敏粘合片是可剥离的压敏粘合片，其中 粘合性降低处理后的压敏粘合剂层或粘合剂层具有6.5N / 10mm的压敏粘合力（相对于硅镜片180°剥离，拉伸速度：300mm / min） 其中自动压敏粘合剂片从一端向一个方向卷起以形成一个管状辊，或者从两个相对端向两个相对端的中心卷起以形成两个管状辊，当 刺激自滚压敏片以引起收缩膜层的收缩。 即使粘附到相对低强度的被粘物上，自粘压敏粘合片也可以非常容易地从被粘物上剥离而不会对被粘物造成损伤或污染。

    METHOD FOR PROCESSING WAFER
    10.
    发明申请
    METHOD FOR PROCESSING WAFER 审中-公开
    加工方法

    公开(公告)号：US20110237050A1

    公开(公告)日：2011-09-29

    申请号：US13052317

    申请日：2011-03-21

    申请人： Toshimasa SUGIMURA ,  Akinori NISHIO ,  Kazuyuki KIUCHI

    发明人： Toshimasa SUGIMURA ,  Akinori NISHIO ,  Kazuyuki KIUCHI

    IPC分类号： H01L21/78

    CPC分类号： H01L21/6836 ,  H01L21/78 ,  H01L23/562 ,  H01L2221/68331 ,  H01L2221/68336 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

    摘要： The present invention provides a method which includes sticking a surface protection sheet for dicing onto a surface of a wafer and cutting the sheet together with the wafer to protect the surface of the wafer from being contaminated by deposition of a dust such as swarf and the like, and picking up a chip without causing cracking or chipping in the chip after a dicing step, in the steps of dicing the wafer and then picking up the chip. The method includes: sticking the surface protection sheet for dicing onto the surface of the wafer; cutting the sheet together with the wafer; subsequently giving a stimulus to the surface protection sheet for dicing to peel the end of the chip from the dicing tape; and then picking up the chip.

    摘要翻译： 本发明提供了一种方法，其包括将用于切割的表面保护片粘贴到晶片表面上并与晶片一起切割片材，以保护晶片的表面免受诸如切屑等灰尘的沉积的污染 在切割步骤之后，在切割晶片然后拾取芯片的步骤中，拾取芯片而不会在切割步骤之后的芯片中产生开裂或碎裂。 该方法包括：将用于切割的表面保护片粘贴到晶片的表面上; 将切片与晶片一起切割; 随后对表面保护片施加刺激以进行切割，从切割带剥离芯片的端部; 然后拿起芯片。