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公开(公告)号：US07675387B2
公开(公告)日：2010-03-09
申请号：US11514229
申请日：2006-09-01
IPC分类号： H01L41/00
CPC分类号： H03H9/02574 , H03H9/02834
摘要： A surface acoustic wave device in the present invention is provided with a piezoelectric substrate, a supporting substrate being jointed to the piezoelectric substrate and including a material different in expansion coefficient from the piezoelectric substrate and an interdigital electrode for exciting a surface acoustic wave, the electrode being arranged on the surface of the piezoelectric substrate. Either the interdigital electrode or the piezoelectric substrate is configured so that the interdigital electrode is 40% or more to 70% or less as long as the piezoelectric substrate in the direction to which a surface acoustic wave propagates.
摘要翻译： 本发明的声表面波装置具有压电基板，支撑基板与压电基板连接，并且具有与压电基板不同的膨胀系数的材料和用于激励表面声波的叉指电极，所述电极 布置在压电基板的表面上。 叉指电极或压电基板之间的配置使得叉指电极与表面声波传播方向上的压电基片一样长度为40％以上至70％以下。
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公开(公告)号：US20070120623A1
公开(公告)日：2007-05-31
申请号：US11514229
申请日：2006-09-01
CPC分类号： H03H9/02574 , H03H9/02834
摘要： A surface acoustic wave device in the present invention is provided with a piezoelectric substrate, a supporting substrate being jointed to the piezoelectric substrate and including a material different in expansion coefficient from the piezoelectric substrate and an interdigital electrode for exciting a surface acoustic wave, the electrode being arranged on the surface of the piezoelectric substrate. Either the interdigital electrode or the piezoelectric substrate is configured so that the interdigital electrode is 40% or more to 70% or less as long as the piezoelectric substrate in the direction to which a surface acoustic wave propagates.
摘要翻译： 本发明的声表面波装置具有压电基板，支撑基板与压电基板连接，并且具有与压电基板不同的膨胀系数的材料和用于激励表面声波的叉指电极，所述电极 布置在压电基板的表面上。 叉指电极或压电基板之间的配置使得叉指电极与表面声波传播方向上的压电基片一样长度为40％以上至70％以下。
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公开(公告)号：US07211934B2
公开(公告)日：2007-05-01
申请号：US10750821
申请日：2004-01-05
IPC分类号： H01L41/08
CPC分类号： H03H9/059 , B81B7/007 , B81C1/00269 , B81C2203/019 , B81C2203/036 , H01L23/10 , H01L23/552 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L2224/0345 , H01L2224/0401 , H01L2224/05647 , H01L2224/05671 , H01L2224/11462 , H01L2224/13099 , H01L2224/13111 , H01L2224/13144 , H01L2224/16225 , H01L2224/29111 , H01L2224/29199 , H01L2224/29355 , H01L2224/29388 , H01L2224/29444 , H01L2224/45144 , H01L2224/73204 , H01L2224/81139 , H01L2224/81203 , H01L2224/81411 , H01L2224/81439 , H01L2224/81444 , H01L2224/8183 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H01L2224/9211 , H01L2224/94 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/3025 , H03H3/007 , H03H3/08 , H03H9/1078 , H01L2224/81 , H01L2924/00014 , H01L2224/83 , H01L2924/01049 , H01L2924/00
摘要： An electronic device of a chip size having improved airtightness is designed to be formed by a reduced number of process steps. An electronic component including a chip having a functional surface and electrodes at least on one side and a substrate having a portion which can be connected to the electrodes of the chip is designed as such an electronic device. In the electronic component, electroconductive glass or an intermetallic compound is used for connection portions to establish electrical connections between the chip and the substrate and to simultaneously seal the device surface on the chip.
摘要翻译： 具有改善的气密性的芯片尺寸的电子装置被设计成通过减少数量的工艺步骤形成。 将包括具有功能表面的芯片和至少一侧的电极的电子部件以及具有可与芯片的电极连接的部分的基板设计为这样的电子设备。 在电子部件中，导电玻璃或金属间化合物用于连接部分，以建立芯片和基板之间的电连接，同时密封芯片上的器件表面。
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公开(公告)号：US20150248190A1
公开(公告)日：2015-09-03
申请号：US14428429
申请日：2012-10-12
申请人： Kunio Matsumoto , Koichi Nakagawa
发明人： Kunio Matsumoto , Koichi Nakagawa
IPC分类号： G06F3/0481 , G06F17/21
CPC分类号： G06F3/0481 , G06F3/04817 , G06F8/38 , G06F17/212
摘要： A screen transition diagram creator that creates a screen transition diagram illustrating complicated transition relations in an easy-to-understand manner, including: a screen transition diagram editor providing the screen transition diagram in which transition relations among plural screens are illustrated by plural screen nodes and arrows between the screen nodes; a screen transition pattern applying unit applying a predetermined screen transition pattern to a target screen node group that includes at least part of the screen nodes illustrated in the screen transition diagram to provide a pattern-applied screen node group; and a screen transition structure diagram creator creating a screen transition structure diagram by abridgement processing on the pattern-applied screen node group according to a display layout corresponding to the screen transition pattern. In the abridgement processing, arrows are deleted and an icon that simplistically illustrates a transition pattern between the screen nodes displayed in the display layout is added.
摘要翻译： 一种屏幕转换图创建器，其以易于理解的方式创建示出复杂的转变关系的屏幕转换图，包括：提供屏幕转换图的屏幕转换图编辑器，其中多个屏幕节点和多个屏幕节点之间显示多个屏幕之间的转换关系， 屏幕节点之间的箭头; 屏幕转换模式应用单元，将预定屏幕转换模式应用于包括屏幕转换图中所示屏幕节点的至少一部分的目标屏幕节点组，以提供模式应用屏幕节点组; 以及屏幕转换结构图创建器，根据与屏幕转换模式相对应的显示布局，通过对图案应用屏幕节点组进行缩小处理来创建屏幕转换结构图。 在缩小处理中，删除箭头，并且添加简单地示出在显示布局中显示的屏幕节点之间的转换模式的图标。
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公开(公告)号：US08278270B2
公开(公告)日：2012-10-02
申请号：US13175110
申请日：2011-07-01
CPC分类号： C07K14/4753 , A61K38/00
摘要： An HGF precursor protein variant, in which a peptide structure comprises a sequence including a peptide chain X inserted between an α chain of HGF or a polypeptide where 1 to 20 amino-acid residues from the C-terminus of the α chain are deleted, and a β chain of HGF or a polypeptide where 1 to 20 amino-acid residues from the N-terminus of the β chain are deleted; wherein (i) the peptide chain X has an amino-acid sequence of at least two residues, (ii) the peptide chain X can be cleaved by a protease reaction or a chemical reaction, and (iii) a protein obtained by cleaving at least one site of the peptide chain X has HGF action.
摘要翻译： 一种HGF前体蛋白质变体，其中肽结构包含插入在H链α链或多肽之间的肽链X的序列，其中缺失来自α链C末端的1-20个氨基酸残基， 一个 的HGF链或多肽，其中从＆lt; bgr的N末端1至20个氨基酸残基; 链被删除; 其中（i）肽链X具有至少两个残基的氨基酸序列，（ii）肽链X可以通过蛋白酶反应或化学反应来切割，和（iii）通过至少裂解获得的蛋白质 肽链X的一个位点具有HGF作用。
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公开(公告)号：US08076289B2
公开(公告)日：2011-12-13
申请号：US12695532
申请日：2010-01-28
IPC分类号： A61K38/18
CPC分类号： C07K14/4753 , A61K38/1833 , A61K48/00
摘要： A pharmaceutical preparation comprising a hepatocyte growth factor or a DNA molecule encoding the same and the like according to the present invention can suppress the fibrosis of a transplanted organ after organ transplantation. The present invention is useful in the fields of organ transplantation and regeneration therapy.
摘要翻译： 包含肝细胞生长因子或编码本发明的DNA分子的药物制剂能够抑制器官移植后的移植器官的纤维化。 本发明可用于器官移植和再生治疗领域。
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公开(公告)号：US20110269944A1
公开(公告)日：2011-11-03
申请号：US13175110
申请日：2011-07-01
IPC分类号： C07K14/475
CPC分类号： C07K14/4753 , A61K38/00
摘要： An HGF precursor protein variant, in which a peptide structure comprises a sequence including a peptide chain X inserted between an α chain of HGF or a polypeptide where 1 to 20 amino-acid residues from the C-terminus of the α chain are deleted, and a β chain of HGF or a polypeptide where 1 to 20 amino-acid residues from the N-terminus of the β chain are deleted; wherein (i) the peptide chain X has an amino-acid sequence of at least two residues, (ii) the peptide chain X can be cleaved by a protease reaction or a chemical reaction, and (iii) a protein obtained by cleaving at least one site of the peptide chain X has HGF action.
摘要翻译： 一种HGF前体蛋白质变体，其中肽结构包含插入在H链α链或多肽之间的肽链X的序列，其中缺失来自α链C末端的1-20个氨基酸残基， 一个 的HGF链或多肽，其中从＆lt; bgr的N末端1至20个氨基酸残基; 链被删除; 其中（i）肽链X具有至少两个残基的氨基酸序列，（ii）肽链X可以通过蛋白酶反应或化学反应来切割，和（iii）通过至少裂解获得的蛋白质 肽链X的一个位点具有HGF作用。
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公开(公告)号：US20080274960A1
公开(公告)日：2008-11-06
申请号：US11795314
申请日：2005-09-09
IPC分类号： A61K38/18 , C07K14/475 , C12N15/12 , A61P37/06
CPC分类号： C07K14/4753 , A61K38/1833 , A61K48/00
摘要： A pharmaceutical preparation comprising a hepatocyte growth factor or a DNA molecule encoding the same and the like according to the present invention can suppress the fibrosis of a transplanted organ after organ transplantation. The present invention is useful in the fields of organ transplantation and regeneration therapy.
摘要翻译： 包含肝细胞生长因子或编码本发明的DNA分子的药物制剂能够抑制器官移植后的移植器官的纤维化。 本发明可用于器官移植和再生治疗领域。
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公开(公告)号：US06635971B2
公开(公告)日：2003-10-21
申请号：US10042270
申请日：2002-01-11
申请人： Toyoki Asada , Yuji Fujita , Hideo Sotokawa , Kazumi Kawamoto , Kunio Matsumoto , Shinya Hamagishi , Mari Matsuyoshi
发明人： Toyoki Asada , Yuji Fujita , Hideo Sotokawa , Kazumi Kawamoto , Kunio Matsumoto , Shinya Hamagishi , Mari Matsuyoshi
IPC分类号： H01L2329
CPC分类号： H01L24/31 , G02B6/4232 , G02B6/4246 , H01L21/563 , H01L24/29 , H01L24/83 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83192 , H01L2224/83951 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/15151 , H01L2924/351 , H01L2924/00 , H01L2224/0401
摘要： An electronic device, in which terminals of a semiconductor integrated circuit chip and terminals of a circuit substrate are mounted with solder so as to face one another. The electronic device includes a first resin, which is disposed between the circuit substrate and a terminal formation face of the semiconductor integrated circuit chip and a second resin, which is disposed at the outer perimeter of the semiconductor integrated circuit chip or is disposed laterally thereon. The modulus of elasticity of the second resin is smaller than the modulus of elasticity of the first resin, the modulus of elasticity of the second resin is at least 0.5 GPa but not more than 28 GPa at room temperature.
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10.发明授权Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step 失效半导体器件及其制造方法，包括探针测试步骤和老化测试步骤公开(公告)号：US06197603B1
公开(公告)日：2001-03-06
申请号：US09157153
申请日：1998-09-18
申请人： Ryuji Kohno , Tetsuo Kumazawa , Makoto Kitano , Akihiko Ariga , Yuji Wada , Naoto Ban , Shuji Shibuya , Yasuhiro Motoyama , Kunio Matsumoto , Susumu Kasukabe , Terutaka Mori , Hidetaka Shigi , Takayoshi Watanabe
发明人： Ryuji Kohno , Tetsuo Kumazawa , Makoto Kitano , Akihiko Ariga , Yuji Wada , Naoto Ban , Shuji Shibuya , Yasuhiro Motoyama , Kunio Matsumoto , Susumu Kasukabe , Terutaka Mori , Hidetaka Shigi , Takayoshi Watanabe
IPC分类号： G01R3126
CPC分类号： G01R3/00 , G01R1/0735
摘要： Dispersion of a load may be kept within a predetermined allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane against a wafer by applying a pressure load to a plurality of places on a plane of the pressure members on the side opposite the wafer in a probe test step, burn-in test step which represent typical semiconductor device manufacturing steps. It is then possible to provide semiconductor devices and a manufacturing method thereof which enhance the reliability and productivity of the semiconductor devices by probing a large number of integrated circuits or a large size integrated circuit at the same time.
摘要翻译： 即使当大量区域中的多个探针通过将设置在膜中的探针压在晶片上时，通过将压力负载施加到多个位置的平面上的多个位置，负载的分散也可以保持在预定容限内 在探针测试步骤中与晶片相对的一侧的压力构件，代表典型的半导体器件制造步骤的老化测试步骤。 因此，可以提供通过同时探测大量集成电路或大尺寸集成电路来提高半导体器件的可靠性和生产率的半导体器件及其制造方法。
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