公开(公告)号：US4920248A

公开(公告)日：1990-04-24

申请号：US261966

申请日：1988-09-22

申请人： Kenichi Toyoda ,  Toru Mizuno ,  Nobutoshi Torii ,  Yuichi Kanda ,  Shigehiro Morikawa

发明人： Kenichi Toyoda ,  Toru Mizuno ,  Nobutoshi Torii ,  Yuichi Kanda ,  Shigehiro Morikawa

IPC分类号： B23K9/095 ,  B23K9/12 ,  B23K9/127

CPC分类号： B23K9/127 ,  B23K9/0956

摘要： An automatic welding apparatus carrying out an arc sensing operation is provided with a memory (2) storing parameters for arc sensing, and these parameters being rewritten by a manual input before beginning the welding, by an input from an on-line computer during the welding, or at a predetermined time by a program which outputs commands to the automatic welding apparatus (FIG. 6).

公开(公告)号：US4906814A

公开(公告)日：1990-03-06

申请号：US272840

申请日：1988-09-22

申请人： Kenichi Toyoda ,  Toru Mizuno ,  Nobutoshi Torii ,  Yuichi Kanda ,  Shigehiro Morikawa

发明人： Kenichi Toyoda ,  Toru Mizuno ,  Nobutoshi Torii ,  Yuichi Kanda ,  Shigehiro Morikawa

IPC分类号： B23K9/12 ,  B23K9/127

CPC分类号： B23K9/127

摘要： A method of starting arc sensing applicable to automatic welding apparatuses carrying out an arc sensing operation, which is a control operation comprising: detecting deviations of a welding electrode from a predetermined path in an up or down direction and right or left direction, by variations of a welding current while welding with a weaving operation; and correcting the deviation.In this method of starting arc sensing, the welding electrode is held in the dwell state while the arc is extremely unstable just after the arc is first generated, a weaving is carried out from a first predetermined time (T.sub.1) after the extreme instability of the arc has been eliminated, a detection and correction by an arc sensing of a deviation in the right and left direction only are carried out from a second predetermined time (T.sub.2) after the arc has become stable in the weaving state; anda detection and a correction by an arc sensing of a deviation in an up and down direction are carried out in addition to the arc sensing in the right and left direction, from a third predetermined time (T.sub.3) after the correction by the arc sensing of the deivation in the right and left direction only has been carried out (FIG. 7).

公开(公告)号：US4857700A

公开(公告)日：1989-08-15

申请号：US243564

申请日：1988-08-09

申请人： Kenichi Toyoda ,  Tohru Mizuno ,  Nobutoshi Torii ,  Yuichi Kanda ,  Shigehiro Morikawa

发明人： Kenichi Toyoda ,  Tohru Mizuno ,  Nobutoshi Torii ,  Yuichi Kanda ,  Shigehiro Morikawa

IPC分类号： B23K9/12 ,  B23K9/127

CPC分类号： B23K9/127

摘要： The arc current is divided into two areas each corresponding to a 1/4 period of weaving, the two areas are compared with each other, and an area corresponding to a predetermined time period at the end portion of the larger area is substrated from the larger area and another area comparison is performed. The movement of the welding torch is compensated in accordance with the predetermined correction function, so that, even when an actual weld line of base metals to be welded deviates from an instructed weld line, the welding torch is correctly moved along the weld line of the base materials and arc welding is performed.

公开(公告)号：US07416763B2

公开(公告)日：2008-08-26

申请号：US10870671

申请日：2004-06-16

申请人： Yuichi Kanda ,  Takashi Abe ,  Atsushi Tanaka ,  Keisuke Nishu

发明人： Yuichi Kanda ,  Takashi Abe ,  Atsushi Tanaka ,  Keisuke Nishu

IPC分类号： B05D1/36 ,  B05D7/00

CPC分类号： H05K3/388 ,  H05K3/225 ,  H05K2201/0329 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155

摘要： A process in which a base metal film is formed on the surface of a plastic film using a dry plating process, and a liquid containing an organic monomer is then brought in contact with the base metal film, thereby selectively forming a conductive organic polymer coating within any pinhole defects, and effectively filling the defects. A metal film is then formed on top of the base metal film using an electroplating process, thus forming a metal wet plating layer.

摘要翻译： 使用干电镀法在塑料膜的表面上形成贱金属膜的方法，然后使含有有机单体的液体与贱金属膜接触，由此选择性地形成导电有机聚合物涂层 任何针孔缺陷，有效填补缺陷。 然后使用电镀工艺在基底金属膜的顶部上形成金属膜，从而形成金属湿镀层。

公开(公告)号：US5066847A

公开(公告)日：1991-11-19

申请号：US269742

申请日：1988-10-28

申请人： Hajimu Kishi ,  Tohru Mizuno ,  Yuichi Kanda

发明人： Hajimu Kishi ,  Tohru Mizuno ,  Yuichi Kanda

IPC分类号： B23K9/127

CPC分类号： B23K9/127

摘要： According to a path correction method in an automatic welding machine in accordance with the invention, the torch TC of a welding machine is grasped by a robot and welding is performed while the welding torch is weaved to the left and right of a welding line. At such time, an integrated value of welding current of the torch weaved with respect to a given welding line is computed every half cycle, the correction direction is decided, the amount of correction is decided by performing a computation, which is based on the integrated value, in dependence upon the correction direction decided, and the weaving path of the torch is corrected by multiplying the decided amount of correction by a predetermined coefficient.

公开(公告)号：US20050097735A1

公开(公告)日：2005-05-12

申请号：US10870671

申请日：2004-11-01

申请人： Yuichi Kanda ,  Takashi Abe ,  Atsushi Tanaka ,  Keisuke Nishu

发明人： Yuichi Kanda ,  Takashi Abe ,  Atsushi Tanaka ,  Keisuke Nishu

IPC分类号： C23C18/16 ,  C23C18/20 ,  C23C28/00 ,  C25D5/34 ,  C25D5/56 ,  C25D7/00 ,  H05K3/00 ,  H05K3/14 ,  H05K3/22 ,  H05K3/38 ,  H01R43/00 ,  H05K3/02

CPC分类号： H05K3/388 ,  H05K3/225 ,  H05K2201/0329 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155

摘要： A process in which a base metal film is formed on the surface of a plastic film using a dry plating process, and a liquid containing an organic monomer is then brought in contact with the base metal film, thereby selectively forming a conductive organic polymer coating within any pinhole defects, and effectively filling the defects. A metal film is then formed on top of the base metal film using an electroplating process, thus forming a metal wet plating layer.

摘要翻译： 使用干电镀法在塑料膜的表面上形成贱金属膜的方法，然后使含有有机单体的液体与贱金属膜接触，由此选择性地形成导电有机聚合物涂层 任何针孔缺陷，有效填补缺陷。 然后使用电镀工艺在基底金属膜的顶部上形成金属膜，从而形成金属湿镀层。

公开(公告)号：US06451448B1

公开(公告)日：2002-09-17

申请号：US09470725

申请日：1999-12-22

申请人： Yuichi Kanda ,  Sin-ei Satoh ,  Shigenari Ohtake ,  Takeshi Suzuki ,  Hiroyuki Natume

发明人： Yuichi Kanda ,  Sin-ei Satoh ,  Shigenari Ohtake ,  Takeshi Suzuki ,  Hiroyuki Natume

IPC分类号： B32B1501

CPC分类号： H05K3/384 ,  C09J5/02 ,  C09J2400/166 ,  C25D3/04 ,  C25D5/16 ,  H01L23/142 ,  H01L23/4334 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01065 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/4611 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/1572 ,  Y10T428/12396 ,  Y10T428/12472 ,  Y10T428/12479 ,  Y10T428/12528 ,  Y10T428/12569 ,  Y10T428/12903 ,  Y10T428/12993 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A surface treated metallic material according to the present invention comprises a metallic substrate and a metallic compound layer formed thereon, wherein the entire surface of the metallic compound layer is covered with minute, upright, scaly protrusions. The width in the major axial direction of the scaly protrusions is between 0.05˜0.5 &mgr;m and the thickness between 0.01˜0.1 &mgr;m, and the thickness of the metallic compound layer is between 0.1˜1.0 &mgr;m. The metallic compound layer incorporates one, or two or more of, the materials selected from the group consisting of chromium oxide, chromium hydroxide, niobium oxide, niobium hydroxide, rhodium oxide, rhodium hydroxide, vanadium oxide, vanadium hydroxide, palladium oxide, palladium hydroxide, nickel oxide, and nickel hydroxide. By using surface treated metallic materials of this type, bonding strength to a resin layer can be improved.

摘要翻译： 根据本发明的表面处理的金属材料包括金属基底和形成在其上的金属化合物层，其中金属化合物层的整个表面被微小的直立的鳞片状突起覆盖。 鳞片突起的主轴向宽度在0.05〜0.5μm之间，厚度在0.01〜0.1μm之间，金属化合物层的厚度在0.1〜1.0μm之间。 金属化合物层包含选自氧化铬，氢氧化铬，氧化铌，氢氧化铌，氧化铑，氢氧化铑，氧化钒，氢氧化钒，氧化钯，氢氧化钯的一种或两种以上的材料 ，氧化镍和氢氧化镍。 通过使用这种表面处理的金属材料，可以提高与树脂层的结合强度。

公开(公告)号：US5510197A

公开(公告)日：1996-04-23

申请号：US233460

申请日：1994-04-26

申请人： Shunji Takahashi ,  Seizo Masukawa ,  Rensei Futatsuka ,  Tetsuya Sugimoto ,  Takeshi SUzuki ,  Chuzo Azuma ,  Yuichi Kanda ,  Takao Fukatami

发明人： Shunji Takahashi ,  Seizo Masukawa ,  Rensei Futatsuka ,  Tetsuya Sugimoto ,  Takeshi SUzuki ,  Chuzo Azuma ,  Yuichi Kanda ,  Takao Fukatami

IPC分类号： C23C14/14 ,  B32B15/01 ,  C23C14/16 ,  H01L21/48 ,  H01L23/495 ,  H01L23/50 ,  B32B15/20

CPC分类号： B32B15/018 ,  C23C14/16 ,  H01L21/4821 ,  H01L23/49582 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/48664 ,  H01L2224/48764 ,  H01L2224/48864 ,  H01L2224/85464 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  Y10S428/938 ,  Y10T428/12875 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/1291

摘要： A lead frame material comprises a base plate consisting of copper or copper alloys, and a protective coating formed on the upper or the both surface of the base plate. The protective coating is composed of at least one metal selected from the group consisting of gold, gold alloy, silver, silver alloy, palladium and palladium alloy, and has a thickness of 10-500 angstrom. The protective coating is formed by means of vapor deposition. It is possible to form an intermediate coating of nickel or nickel alloys between the surface of the base plate and the protective coating, by means of vapor deposition or wet plating. The suitable thickness of the intermediate coating is within the range of 50-20000 angstrom.

摘要翻译： 引线框架材料包括由铜或铜合金构成的基板和形成在基板的上表面或两个表面上的保护涂层。 保护涂层由选自金，金合金，银，银合金，钯和钯合金中的至少一种金属组成，并且具有10-500埃的厚度。 保护涂层通过气相沉积形成。 可以通过气相沉积或湿电镀在基板的表面和保护涂层之间形成镍或镍合金的中间涂层。 中间涂层的合适厚度在50-20000埃的范围内。