公开(公告)号：US07911038B2

公开(公告)日：2011-03-22

申请号：US12306987

申请日：2007-06-29

申请人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

发明人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

IPC分类号： H01L23/495

CPC分类号： H05K3/205 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/563 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48472 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/244 ,  H05K3/423 ,  H05K2201/0338 ,  H05K2201/098 ,  H05K2201/09845 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wiring board has an insulating layer, a plurality of wiring layers formed in such a way as to be insulated from each other by the insulating layer, and a plurality of vias formed in the insulating layer to connect the wiring layers. Of the wiring layers, a surface wiring layer formed in one surface of the insulating layer include a first metal film exposed from the one surface and a second metal film embedded in the insulating layer and stacked on the first metal film. Edges of the first metal film project from edges of the second metal film in the direction in which the second metal film spreads. By designing the shape of the wiring layers embedded in the insulating layer in this manner, it is possible to obtain a highly reliable wiring board that can be effectively prevented from side etching in the manufacturing process and can adapt to miniaturization and highly dense packaging of wires.

摘要翻译： 布线基板具有绝缘层，多个布线层以通过绝缘层彼此绝缘的方式形成，以及形成在绝缘层中以连接布线层的多个通孔。 在布线层中，形成在绝缘层的一个表面上的表面布线层包括从一个表面露出的第一金属膜和嵌入在绝缘层中并叠放在第一金属膜上的第二金属膜。 第一金属膜的边缘沿着第二金属膜扩展的方向从第二金属膜的边缘突出。 通过以这种方式设计嵌入在绝缘层中的布线层的形状，可以获得在制造过程中可以有效地防止侧蚀刻的高可靠性布线板，并且可以适应电线的小型化和高密度封装 。

公开(公告)号：US20100232127A1

公开(公告)日：2010-09-16

申请号：US12439933

申请日：2007-09-04

申请人： Kentaro Mori ,  Shintaro Yamamichi ,  Katsumi Kikuchi ,  Hideya Murai ,  Takuo Funaya ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

发明人： Kentaro Mori ,  Shintaro Yamamichi ,  Katsumi Kikuchi ,  Hideya Murai ,  Takuo Funaya ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

IPC分类号： H05K1/18 ,  H05K1/02 ,  H05K3/00

CPC分类号： H05K3/0097 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K3/007 ,  H05K2201/0355 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/1536 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wiring board composite body includes a supporting substrate, and wiring boards formed on each of the upper and the lower surfaces of the supporting substrate. The supporting substrate includes a supporting body, and a metal body arranged on each of the upper and the lower surfaces of the supporting body. The wiring board comprises at least an insulation layer insulating upper and lower wirings, and a via connecting the upper and the lower wirings. The wiring board mounted on the metal body constitutes a wiring board with the metal body. Thus, the supporting body supporting the metal body is effectively used in a process of forming the wiring board on the metal body, and the wiring board composite body, which has advantageous structural and production characteristics, is provided. A semiconductor device and a method for manufacturing such wiring board composite body and the semiconductor device are also provided.

摘要翻译： 布线板复合体包括支撑基板和形成在支撑基板的上表面和下表面中的每一个上的布线板。 支撑基板包括支撑体和布置在支撑体的上表面和下表面中的每一个上的金属体。 布线基板至少包括上下布线绝缘层和连接上下布线的通孔。 安装在金属体上的布线板与金属体构成布线板。 因此，在金属体上形成配线基板的工序中，能够有效地使用支撑金属体的支撑体，具有有利的结构和制造特性的布线基板复合体。 还提供了一种用于制造这种布线板复合体和半导体器件的半导体器件和方法。

公开(公告)号：US08389414B2

公开(公告)日：2013-03-05

申请号：US13026651

申请日：2011-02-14

申请人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

发明人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

IPC分类号： H01L21/311

CPC分类号： H05K3/205 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/563 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48472 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/244 ,  H05K3/423 ,  H05K2201/0338 ,  H05K2201/098 ,  H05K2201/09845 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wiring board has an insulating layer, a plurality of wiring layers formed in such a way as to be insulated from each other by the insulating layer, and a plurality of vias formed in the insulating layer to connect the wiring layers. Of the wiring layers, a surface wiring layer formed in one surface of the insulating layer include a first metal film exposed from the one surface and a second metal film embedded in the insulating layer and stacked on the first metal film. Edges of the first metal film project from edges of the second metal film in the direction in which the second metal film spreads. By designing the shape of the wiring layers embedded in the insulating layer in this manner, it is possible to obtain a highly reliable wiring board that can be effectively prevented from side etching in the manufacturing process and can adapt to miniaturization and highly dense packaging of wires.

摘要翻译： 布线基板具有绝缘层，多个布线层以通过绝缘层彼此绝缘的方式形成，以及形成在绝缘层中以连接布线层的多个通孔。 在布线层中，形成在绝缘层的一个表面上的表面布线层包括从一个表面露出的第一金属膜和嵌入在绝缘层中并叠放在第一金属膜上的第二金属膜。 第一金属膜的边缘沿着第二金属膜扩展的方向从第二金属膜的边缘突出。 通过以这种方式设计嵌入在绝缘层中的布线层的形状，可以获得在制造过程中可以有效地防止侧蚀刻的高可靠性布线板，并且可以适应电线的小型化和高密度封装 。

公开(公告)号：US20090315190A1

公开(公告)日：2009-12-24

申请号：US12306987

申请日：2007-06-29

申请人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

发明人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

IPC分类号： H01L23/538 ,  H05K1/11 ,  H01L21/60 ,  H01L21/31

CPC分类号： H05K3/205 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/563 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48472 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/244 ,  H05K3/423 ,  H05K2201/0338 ,  H05K2201/098 ,  H05K2201/09845 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wiring board has an insulating layer, a plurality of wiring layers formed in such a way as to be insulated from each other by the insulating layer, and a plurality of vias formed in the insulating layer to connect the wiring layers. Of the wiring layers, a surface wiring layer formed in one surface of the insulating layer include a first metal film exposed from the one surface and a second metal film embedded in the insulating layer and stacked on the first metal film. Edges of the first metal film project from edges of the second metal film in the direction in which the second metal film spreads. By designing the shape of the wiring layers embedded in the insulating layer in this manner, it is possible to obtain a highly reliable wiring board that can be effectively prevented from side etching in the manufacturing process and can adapt to miniaturization and highly dense packaging of wires.

摘要翻译： 布线基板具有绝缘层，多个布线层以通过绝缘层彼此绝缘的方式形成，以及形成在绝缘层中以连接布线层的多个通孔。 在布线层中，形成在绝缘层的一个表面上的表面布线层包括从一个表面露出的第一金属膜和嵌入在绝缘层中并叠放在第一金属膜上的第二金属膜。 第一金属膜的边缘沿着第二金属膜扩展的方向从第二金属膜的边缘突出。 通过以这种方式设计嵌入在绝缘层中的布线层的形状，可以获得在制造过程中可以有效地防止侧蚀刻的高可靠性布线板，并且可以适应电线的小型化和高密度封装 。

公开(公告)号：US07838779B2

公开(公告)日：2010-11-23

申请号：US11452933

申请日：2006-06-15

申请人： Shintaro Yamamichi ,  Katsumi Kikuchi ,  Hideya Murai ,  Takuo Funaya ,  Takehiko Maeda ,  Kenta Ogawa ,  Jun Tsukano ,  Hirokazu Honda

发明人： Shintaro Yamamichi ,  Katsumi Kikuchi ,  Hideya Murai ,  Takuo Funaya ,  Takehiko Maeda ,  Kenta Ogawa ,  Jun Tsukano ,  Hirokazu Honda

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K3/0055 ,  H05K3/20 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/09563 ,  H05K2201/09863 ,  H05K2203/0796 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wiring board in which lower-layer wiring composed of a wiring body and an etching barrier layer is formed in a concave portion formed on one face of a board-insulating film, upper-layer wiring is formed on the other face of the board-insulating film, and the upper-layer wiring and the wiring body of the lower-layer wiring are connected to each other through a via hole formed in the board-insulating film. The via hole is barrel-shaped, bell-shaped, or bellows-shaped.

摘要翻译： 在由板状绝缘膜的一面形成的凹部形成有由布线体和蚀刻阻挡层构成的下层布线的布线基板，在基板绝缘膜的另一面形成有上层布线， 绝缘膜，上层布线和下层布线的布线体通过形成在基板绝缘膜上的通孔相互连接。 通孔为桶形，钟形或波纹管状。

公开(公告)号：US20060283625A1

公开(公告)日：2006-12-21

申请号：US11452933

申请日：2006-06-15

申请人： Shintaro Yamamichi ,  Katsumi Kikuchi ,  Hideya Murai ,  Takuo Funaya ,  Takehiko Maeda ,  Kenta Ogawa ,  Jun Tsukano ,  Hirokazu Honda

发明人： Shintaro Yamamichi ,  Katsumi Kikuchi ,  Hideya Murai ,  Takuo Funaya ,  Takehiko Maeda ,  Kenta Ogawa ,  Jun Tsukano ,  Hirokazu Honda

IPC分类号： H05K1/11 ,  H05K1/03

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K3/0055 ,  H05K3/20 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/09563 ,  H05K2201/09863 ,  H05K2203/0796 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wiring board in which lower-layer wiring composed of a wiring body and an etching barrier layer is formed in a concave portion formed on one face of a board-insulating film, upper-layer wiring is formed on the other face of the board-insulating film, and the upper-layer wiring and the wiring body of the lower-layer wiring are connected to each other through a via hole formed in the board-insulating film. The via hole is barrel-shaped, bell-shaped, or bellows-shaped.

摘要翻译： 在由板状绝缘膜的一面形成的凹部形成有由布线体和蚀刻阻挡层构成的下层布线的布线基板，在基板绝缘膜的另一面形成有上层布线， 绝缘膜，上层布线和下层布线的布线体通过形成在基板绝缘膜上的通孔相互连接。 通孔为桶形，钟形或波纹管状。

公开(公告)号：US07674989B2

公开(公告)日：2010-03-09

申请号：US11449673

申请日：2006-06-09

申请人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Takuo Funaya ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

发明人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Takuo Funaya ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

IPC分类号： H01R12/04

CPC分类号： H05K1/115 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/09509 ,  H05K2201/09854 ,  H05K2203/1476 ,  Y10T29/49165

摘要： A wiring board for mounting a semiconductor element or electronic component having a plurality of wiring layers, an insulating layer provided between these wiring layers, and a via which is provided to the insulating layer and which electrically connects the wiring layers. In this wiring board, the cross-sectional shape of the via in the plane parallel to the wiring layers is obtained by the partial overlapping of a plurality of similar shapes (circles). Stable operation can be obtained in a semiconductor element by minimizing obstacles to increased density, effectively increasing the cross-sectional area of the via, and preventing the wiring resistance from increasing by making the cross-sectional shape of the via into a shape obtained by the partial overlapping of a plurality of similar shapes.

摘要翻译： 一种用于安装具有多个布线层的半导体元件或电子元件的布线板，设置在这些布线层之间的绝缘层，以及设置在绝缘层上并将布线层电连接的通孔。 在该布线板中，通过多个相似形状（圆圈）的部分重叠，获得与布线层平行的平面中的通孔的截面形状。 通过最小化增加密度的障碍物，有效地增加通孔的横截面积，并且通过使通孔的横截面形状成为由通孔形成的形状来防止布线电阻增加，可以在半导体元件中获得稳定的操作 多个类似形状的部分重叠。

公开(公告)号：US20060283629A1

公开(公告)日：2006-12-21

申请号：US11449673

申请日：2006-06-09

申请人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Takuo Funaya ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

发明人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Takuo Funaya ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

IPC分类号： H05K1/11 ,  H05K3/42

CPC分类号： H05K1/115 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/09509 ,  H05K2201/09854 ,  H05K2203/1476 ,  Y10T29/49165

摘要： A wiring board for mounting a semiconductor element or electronic component having a plurality of wiring layers, an insulating layer provided between these wiring layers, and a via which is provided to the insulating layer and which electrically connects the wiring layers. In this wiring board, the cross-sectional shape of the via in the plane parallel to the wiring layers is obtained by the partial overlapping of a plurality of similar shapes (circles). Stable operation can be obtained in a semiconductor element by minimizing obstacles to increased density, effectively increasing the cross-sectional area of the via, and preventing the wiring resistance from increasing by making the cross-sectional shape of the via into a shape obtained by the partial overlapping of a plurality of similar shapes.

摘要翻译： 一种用于安装具有多个布线层的半导体元件或电子元件的布线板，设置在这些布线层之间的绝缘层，以及设置在绝缘层上并将布线层电连接的通孔。 在该布线板中，通过多个相似形状（圆圈）的部分重叠，获得与布线层平行的平面中的通孔的横截面形状。 通过最小化增加密度的障碍物，有效地增加通孔的横截面积，并且通过使通孔的横截面形状成为由通孔形成的形状来防止布线电阻增加，可以在半导体元件中获得稳定的操作 多个类似形状的部分重叠。

公开(公告)号：US20090283895A1

公开(公告)日：2009-11-19

申请号：US12446899

申请日：2007-10-09

申请人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Katsumi Maeda ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Masaya Kawano ,  Yuuji Kayashima

发明人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Katsumi Maeda ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Masaya Kawano ,  Yuuji Kayashima

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L23/5389 ,  H01L24/19 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/83 ,  H01L2224/82

摘要： A semiconductor device including a metal frame having a penetrating opening; a semiconductor chip provided in the opening; an insulating layer provided on the upper surface of the metal frame such that the insulating layer covers the upper surface, which is the circuit-formed surface of the semiconductor chip; an interconnect layer provided only on the upper-surface side of the metal frame with intervention of the insulating material and electrically connected to a circuit of the semiconductor chip; a via conductor provided on the upper surface of said semiconductor chip to electrically connect the circuit of the semiconductor chip and the interconnect layer; and a resin layer provided on the lower surface of the metal frame.

摘要翻译： 一种半导体器件，包括具有穿透开口的金属框架; 设置在开口内的半导体芯片; 绝缘层，设置在金属框架的上表面上，使得绝缘层覆盖作为半导体芯片的电路形成表面的上表面; 互连层，其仅在金属框架的上表面侧设置，并且绝缘材料的介入并且电连接到半导体芯片的电路; 设置在所述半导体芯片的上表面上的通孔导体，以电连接半导体芯片的电路和互连层; 以及设置在金属框架的下表面上的树脂层。

公开(公告)号：US08536691B2

公开(公告)日：2013-09-17

申请号：US12446899

申请日：2007-10-09

申请人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Katsumi Maeda ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Masaya Kawano ,  Yuuji Kayashima

发明人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Katsumi Maeda ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Masaya Kawano ,  Yuuji Kayashima

IPC分类号： H01L23/02

CPC分类号： H01L23/5389 ,  H01L24/19 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/83 ,  H01L2224/82

摘要： A semiconductor device including a metal frame having a penetrating opening; a semiconductor chip provided in the opening; an insulating layer provided on the upper surface of the metal frame such that the insulating layer covers the upper surface, which is the circuit-formed surface of the semiconductor chip; an interconnect layer provided only on the upper-surface side of the metal frame with intervention of the insulating material and electrically connected to a circuit of the semiconductor chip; a via conductor provided on the upper surface of said semiconductor chip to electrically connect the circuit of the semiconductor chip and the interconnect layer; and a resin layer provided on the lower surface of the metal frame.

摘要翻译： 一种半导体器件，包括具有穿透开口的金属框架; 设置在开口内的半导体芯片; 绝缘层，设置在金属框架的上表面上，使得绝缘层覆盖作为半导体芯片的电路形成表面的上表面; 互连层，其仅在金属框架的上表面侧设置，并且绝缘材料的介入并且电连接到半导体芯片的电路; 设置在所述半导体芯片的上表面上的通孔导体，以电连接半导体芯片的电路和互连层; 以及设置在金属框架的下表面上的树脂层。