公开(公告)号：US09058028B2

公开(公告)日：2015-06-16

申请号：US13460663

申请日：2012-04-30

申请人： Kilsoo Kim ,  Tansel Yucelen ,  Anthony J. Calise

发明人： Kilsoo Kim ,  Tansel Yucelen ,  Anthony J. Calise

IPC分类号： G05B13/02 ,  G06F17/10 ,  G06G7/48 ,  G06F15/18 ,  G06E3/00 ,  G06N7/00

CPC分类号： G05B13/0205

摘要： Systems and methods for adaptive control are disclosed. The systems and methods can control uncertain dynamic systems. The control system can comprise a controller that employs a parameter dependent Riccati equation. The controller can produce a response that causes the state of the system to remain bounded. The control system can control both minimum phase and non-minimum phase systems. The control system can augment an existing, non-adaptive control design without modifying the gains employed in that design. The control system can also avoid the use of high gains in both the observer design and the adaptive control law.

摘要翻译： 公开了用于自适应控制的系统和方法。 系统和方法可以控制不确定的动态系统。 控制系统可以包括采用参数依赖Riccati方程的控制器。 控制器可以产生使系统状态保持有界的响应。 控制系统可以控制最小相位和非最小相位系统。 控制系统可以增加现有的非自适应控制设计，而无需修改该设计中采用的增益。 控制系统还可以避免在观察者设计和自适应控制规律中使用高增益。

公开(公告)号：US08996195B2

公开(公告)日：2015-03-31

申请号：US13445610

申请日：2012-04-12

申请人： Tansel Yucelen ,  Kilsoo Kim ,  Anthony J. Calise

发明人： Tansel Yucelen ,  Kilsoo Kim ,  Anthony J. Calise

IPC分类号： G05B13/00 ,  G06F7/00 ,  G05B13/02 ,  G05B13/04

CPC分类号： G05B13/042

摘要： An adaptive control system is disclosed. The control system can control uncertain dynamic systems. The control system can employ one or more derivative-free adaptive control architectures. The control system can further employ one or more derivative-free weight update laws. The derivative-free weight update laws can comprise a time-varying estimate of an ideal vector of weights. The control system of the present invention can therefore quickly stabilize systems that undergo sudden changes in dynamics, caused by, for example, sudden changes in weight. Embodiments of the present invention can also provide a less complex control system than existing adaptive control systems. The control system can control aircraft and other dynamic systems, such as, for example, those with non-minimum phase dynamics.

摘要翻译： 公开了一种自适应控制系统。 控制系统可以控制不确定的动态系统。 控制系统可以采用一个或多个无衍生的自适应控制架构。 控制系统可以进一步采用一个或多个无衍生的权重更新定律。 无衍生权重更新定律可以包括理想的权重向量的时变估计。 因此，本发明的控制系统可以快速地稳定由例如突然重量变化引起的动态突然变化的系统。 本发明的实施例还可以提供比现有的自适应控制系统更不复杂的控制系统。 控制系统可以控制飞机和其他动态系统，例如具有非最小相位动力学的系统。

公开(公告)号：US20120265367A1

公开(公告)日：2012-10-18

申请号：US13445610

申请日：2012-04-12

申请人： Tansel Yucelen ,  Kilsoo Kim ,  Anthony J. Calise

发明人： Tansel Yucelen ,  Kilsoo Kim ,  Anthony J. Calise

IPC分类号： G06F7/00 ,  G05B13/02

CPC分类号： G05B13/042

摘要： An adaptive control system is disclosed. The control system can control uncertain dynamic systems. The control system can employ one or more derivative-free adaptive control architectures. The control system can further employ one or more derivative-free weight update laws. The derivative-free weight update laws can comprise a time-varying estimate of an ideal vector of weights. The control system of the present invention can therefore quickly stabilize systems that undergo sudden changes in dynamics, caused by, for example, sudden changes in weight. Embodiments of the present invention can also provide a less complex control system than existing adaptive control systems. The control system can control aircraft and other dynamic systems, such as, for example, those with non-minimum phase dynamics.

摘要翻译： 公开了一种自适应控制系统。 控制系统可以控制不确定的动态系统。 控制系统可以采用一个或多个无衍生的自适应控制架构。 控制系统可以进一步采用一个或多个无衍生的权重更新定律。 无衍生权重更新定律可以包括理想的权重向量的时变估计。 因此，本发明的控制系统可以快速地稳定由例如突然重量变化引起的动态突然变化的系统。 本发明的实施例还可以提供比现有的自适应控制系统更不复杂的控制系统。 控制系统可以控制飞机和其他动态系统，例如具有非最小相位动力学的系统。

公开(公告)号：US20120277888A1

公开(公告)日：2012-11-01

申请号：US13460663

申请日：2012-04-30

申请人： Kilsoo Kim ,  Tansel Yucelen ,  Anthony Calise

发明人： Kilsoo Kim ,  Tansel Yucelen ,  Anthony Calise

IPC分类号： G05B13/02

CPC分类号： G05B13/0205

摘要： Systems and methods for adaptive control are disclosed. The systems and methods can control uncertain dynamic systems. The control system can comprise a controller that employs a parameter dependent Riccati equation. The controller can produce a response that causes the state of the system to remain bounded. The control system can control both minimum phase and non-minimum phase systems. The control system can augment an existing, non-adaptive control design without modifying the gains employed in that design. The control system can also avoid the use of high gains in both the observer design and the adaptive control law.

摘要翻译： 公开了用于自适应控制的系统和方法。 系统和方法可以控制不确定的动态系统。 控制系统可以包括采用参数依赖Riccati方程的控制器。 控制器可以产生使系统状态保持有界的响应。 控制系统可以控制最小相位和非最小相位系统。 控制系统可以增加现有的非自适应控制设计，而无需修改该设计中采用的增益。 控制系统还可以避免在观察者设计和自适应控制规律中使用高增益。

公开(公告)号：US08294255B2

公开(公告)日：2012-10-23

申请号：US12662269

申请日：2010-04-08

申请人： Kilsoo Kim

发明人： Kilsoo Kim

IPC分类号： H01L23/48

CPC分类号： H01L23/13 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/5386 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4824 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： The semiconductor package includes a printed circuit board, a first semiconductor chip, and a second semiconductor chip. The printed circuit board includes a slot. The first semiconductor chip is mounted on the printed circuit board to cover a first part of the slot. The second semiconductor chip is mounted on the printed circuit board to cover a second part of the slot separate from the first part. The first semiconductor chip is substantially coplanar with the second semiconductor chip.

摘要翻译： 半导体封装包括印刷电路板，第一半导体芯片和第二半导体芯片。 印刷电路板包括一个槽。 第一半导体芯片安装在印刷电路板上以覆盖槽的第一部分。 第二半导体芯片安装在印刷电路板上以覆盖与第一部分分离的槽的第二部分。 第一半导体芯片与第二半导体芯片基本上共面。

公开(公告)号：US09633973B2

公开(公告)日：2017-04-25

申请号：US14613357

申请日：2015-02-03

申请人： Kilsoo Kim ,  SunWon Kang

发明人： Kilsoo Kim ,  SunWon Kang

IPC分类号： H01L23/48 ,  H01L25/065 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L25/0652 ,  H01L23/3128 ,  H01L24/05 ,  H01L24/06 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/02373 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0557 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/06181 ,  H01L2224/06182 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/17517 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/245 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48145 ,  H01L2224/4824 ,  H01L2224/73207 ,  H01L2224/73209 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package is provided comprising a package substrate having an opening located in a central region thereof and a circuit pattern provided adjacent to the opening. A first semiconductor chip is located on the package substrate and includes first bonding pads. A pair of second semiconductor chips are spaced apart from each other across the opening and mounted between the package substrate and the first semiconductor chip. Each of the second semiconductor chips includes a second bonding pad. A connection element is further provided to electrically connect the second bonding pad to a corresponding one of the first bonding pads.

公开(公告)号：US09589930B2

公开(公告)日：2017-03-07

申请号：US14588243

申请日：2014-12-31

申请人： Chul Park ,  Kilsoo Kim ,  In Lee

发明人： Chul Park ,  Kilsoo Kim ,  In Lee

IPC分类号： H01L25/065

CPC分类号： H01L25/0652 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48147 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

摘要： A semiconductor package comprises a package substrate; a first chip stack and a second chip stack mounted side by side on the package substrate, wherein the first and second chip stacks each include a plurality of semiconductor chips stacked on the package substrate, wherein each of the semiconductor chips includes a plurality of bonding pads provided on a respective edge region thereof, wherein at least some of the plurality of bonding pads are functional pads, and wherein the functional pads occupy a region that is substantially less than an entirety of the respective edge region.

摘要翻译： 半导体封装包括封装衬底; 第一芯片堆叠和第二芯片堆叠并排安装在封装基板上，其中第一和第二芯片堆叠各自包括堆叠在封装衬底上的多个半导体芯片，其中每个半导体芯片包括多个焊盘 设置在其相应的边缘区域上，其中所述多个接合焊盘中的至少一些是功能焊盘，并且其中所述功能焊盘占据实质上小于所述相应边缘区域整体的区域。

公开(公告)号：US08981574B2

公开(公告)日：2015-03-17

申请号：US14064110

申请日：2013-10-25

申请人： Kilsoo Kim ,  SunWon Kang

发明人： Kilsoo Kim ,  SunWon Kang

IPC分类号： H01L29/15 ,  H01L25/065 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L25/0652 ,  H01L23/3128 ,  H01L24/05 ,  H01L24/06 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/02373 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0557 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/06181 ,  H01L2224/06182 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/17517 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/245 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48145 ,  H01L2224/4824 ,  H01L2224/73207 ,  H01L2224/73209 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package is provided comprising a package substrate having an opening located in a central region thereof and a circuit pattern provided adjacent to the opening. A first semiconductor chip is located on the package substrate and includes first bonding pads. A pair of second semiconductor chips are spaced apart from each other across the opening and mounted between the package substrate and the first semiconductor chip. Each of the second semiconductor chips includes a second bonding pad. A connection element is further provided to electrically connect the second bonding pad to a corresponding one of the first bonding pads.

摘要翻译： 提供一种半导体封装，其包括具有位于其中心区域中的开口的封装基板和邻近开口设置的电路图案。 第一半导体芯片位于封装衬底上并且包括第一焊盘。 一对第二半导体芯片在开口之间彼此间隔开，并且安装在封装衬底和第一半导体芯片之间。 每个第二半导体芯片包括第二接合焊盘。 还提供连接元件以将第二接合焊盘电连接到第一接合焊盘中相应的一个。

公开(公告)号：US09971505B2

公开(公告)日：2018-05-15

申请号：US14986773

申请日：2016-01-04

申请人： Youngjin Jeon ,  Jeongdon Ihm ,  Kilsoo Kim ,  Jinman Han

发明人： Youngjin Jeon ,  Jeongdon Ihm ,  Kilsoo Kim ,  Jinman Han

IPC分类号： G06F3/06 ,  G11C7/10 ,  G11C7/22 ,  G11C7/04

CPC分类号： G06F3/0604 ,  G06F3/0656 ,  G06F3/0659 ,  G06F3/0679 ,  G11C7/04 ,  G11C7/1084 ,  G11C7/1093 ,  G11C7/1096 ,  G11C7/222 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/00012

摘要： Memory systems are provided. A memory system may include a plurality of nonvolatile memories and a memory controller configured to control the plurality of nonvolatile memories. Moreover, the memory system may include an input/output buffer circuit connected between the memory controller and the plurality of nonvolatile memories. A data channel may be connected between the memory controller and the input/output buffer circuit, and first and second internal data channels may be connected between the input/output buffer circuit and respective first and second groups of the plurality of nonvolatile memories. The input/output buffer circuit may be configured to connect the data channel to one of the first and second internal data channels.

公开(公告)号：US20160117110A1

公开(公告)日：2016-04-28

申请号：US14986773

申请日：2016-01-04

申请人： Youngjin Jeon ,  Jeongdon Ihm ,  Kilsoo Kim ,  Jinman Han

发明人： Youngjin Jeon ,  Jeongdon Ihm ,  Kilsoo Kim ,  Jinman Han

IPC分类号： G06F3/06

CPC分类号： G06F3/0604 ,  G06F3/0656 ,  G06F3/0659 ,  G06F3/0679 ,  G11C7/04 ,  G11C7/1084 ,  G11C7/1093 ,  G11C7/1096 ,  G11C7/222 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/00012

摘要： Memory systems are provided. A memory system may include a plurality of nonvolatile memories and a memory controller configured to control the plurality of nonvolatile memories. Moreover, the memory system may include an input/output buffer circuit connected between the memory controller and the plurality of nonvolatile memories. A data channel may be connected between the memory controller and the input/output buffer circuit, and first and second internal data channels may be connected between the input/output buffer circuit and respective first and second groups of the plurality of nonvolatile memories. The input/output buffer circuit may be configured to connect the data channel to one of the first and second internal data channels.

摘要翻译： 提供内存系统。 存储器系统可以包括多个非易失性存储器和被配置为控制多个非易失性存储器的存储器控​​制器。 此外，存储器系统可以包括连接在存储器控制器和多个非易失性存储器之间的输入/输出缓冲器电路。 数据通道可以连接在存储器控制器和输入/输出缓冲器电路之间，并且第一和第二内部数据通道可以连接在输入/输出缓冲器电路和多个非易失性存储器的相应的第一和第二组之间。 输入/输出缓冲器电路可以被配置为将数据信道连接到第一和第二内部数据信道之一。