公开(公告)号：US20120129988A1

公开(公告)日：2012-05-24

申请号：US13381879

申请日：2010-06-23

申请人： Koichi Fujimaru ,  Toshihisa Nonaka ,  Yoshiko Tatsuta

发明人： Koichi Fujimaru ,  Toshihisa Nonaka ,  Yoshiko Tatsuta

IPC分类号： C09J133/24 ,  H01L23/58 ,  H01L21/50 ,  H05K7/00

CPC分类号： C09J179/08 ,  C09J163/00 ,  H01L23/293 ,  H01L23/3121 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29388 ,  H01L2224/73204 ,  H01L2224/81204 ,  H01L2224/81907 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83907 ,  H01L2224/9211 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/3512

摘要： Provided is an adhesive composition having both excellent storability and excellent connection reliability. The adhesive composition comprises (a) a polyimide soluble in organic solvents, (b) an epoxy compound, (c) particles of a curing accelerator, and (d) inorganic particles, the amounts of the organic-solvent-soluble polyimide (a) and the curing-accelerator particles (c) being 15-90 parts by weight and 0.1-50 parts by weight, respectively, per 100 parts by weight of the epoxy compound (b), and the content of the inorganic particles (d) being 30-80 wt. % of the total amount of (a) to (d).

摘要翻译： 提供具有优异的保存性和良好的连接可靠性的粘合剂组合物。 粘合剂组合物包含（a）可溶于有机溶剂的聚酰亚胺，（b）环氧化合物，（c）固化促进剂颗粒和（d）无机颗粒，有机溶剂可溶性聚酰亚胺（a） 和固化促进剂颗粒（c）相对于100重量份环氧化合物（b）分别为15〜90重量份和0.1-50重量份，无机颗粒（d）的含量为 30-80重量％ （a）至（d）总量的百分比。

公开(公告)号：US07960462B2

公开(公告)日：2011-06-14

申请号：US12312436

申请日：2007-11-06

申请人： Yoichi Shinba ,  Hiroyuki Niwa ,  Yoshiko Tatsuta ,  Koichi Fujimaru ,  Toshihisa Nonaka

发明人： Yoichi Shinba ,  Hiroyuki Niwa ,  Yoshiko Tatsuta ,  Koichi Fujimaru ,  Toshihisa Nonaka

IPC分类号： C08K3/30

CPC分类号： G02B6/138 ,  C08F290/00 ,  C08F290/06 ,  C08F292/00 ,  C08K3/30

摘要： The present invention is an optical waveguide-forming paste composition including (A) barium sulfate particles with a mean particle diameter of 1 nm or more to 50 nm or less, (B) a compound having a polymerizable group and a carboxyl group, or a phosphoric ester compound having a polymerizable group, and (C) an organic solvent.

摘要翻译： 本发明是一种光波导形成膏组合物，其包含（A）平均粒径为1nm以上且50nm以下的硫酸钡粒子，（B）具有聚合性基团和羧基的化合物，或 具有聚合性基团的磷酸酯化合物，（C）有机溶剂。

公开(公告)号：US20090270541A1

公开(公告)日：2009-10-29

申请号：US12312436

申请日：2007-11-06

申请人： Yoichi Shinba ,  Hiroyuki Niwa ,  Yoshiko Tatsuta ,  Koichi Fujimaru ,  Toshihisa Nonaka

发明人： Yoichi Shinba ,  Hiroyuki Niwa ,  Yoshiko Tatsuta ,  Koichi Fujimaru ,  Toshihisa Nonaka

IPC分类号： C08K3/30

CPC分类号： G02B6/138 ,  C08F290/00 ,  C08F290/06 ,  C08F292/00 ,  C08K3/30

摘要： Problems: an object of the present invention is to provide an optical waveguide-forming paste composition that allows short-time curing and provides excellent developability.Means for Solving: The present invention is directed to an optical waveguide-forming paste composition including (A) barium sulfate particles with a mean particle diameter of 1 nm or more to 50 nm or less, (B) a compound having a polymerizable group and a carboxyl group, or a phosphoric ester compound having a polymerizable group, and (C) an organic solvent.

摘要翻译： 问题：本发明的目的是提供一种允许短时间固化并提供优异显影性的光波导形成膏组合物。 解决方法本发明涉及一种光波导形成用糊剂组合物，其包含（A）平均粒径为1nm以上且50nm以下的硫酸钡粒子，（B）具有聚合性基团的化合物和 羧基或具有聚合性基团的磷酸酯化合物，和（C）有机溶剂。

公开(公告)号：US07444058B2

公开(公告)日：2008-10-28

申请号：US11713605

申请日：2007-03-05

申请人： Toshihisa Nonaka ,  Noboru Asahi ,  Yoshiko Tatsuta

发明人： Toshihisa Nonaka ,  Noboru Asahi ,  Yoshiko Tatsuta

IPC分类号： G02B6/00

CPC分类号： G02B6/1221 ,  H05K1/0274 ,  H05K2201/0209 ,  H05K2201/068

摘要： This invention is a resin composition for optical wiring, comprising an inorganic filler with an average particle size of 1 nm to 100 nm and a resin, having a ratio nf/nr (where nf is the refractive index of the inorganic filler and nr is the refractive index of the resin) of 0.8 to 1.2, a thermal expansion coefficient of −1×10−5 /° C. to 4×10−5/° C., and a true dependency value of its refractive index on the temperature of −1×10−4/° C. to 1×10−4/° C. in a temperature range from −20° C. to 90° C., and substantially incapable of absorbing light in a wavelength range from 0.6 to 0.9 μm or from 1.2 to 1.6 μm. This invention also provides an optoelectronic circuit board.

摘要翻译： 本发明是一种用于光学配线的树脂组合物，其包含平均粒度为1nm至100nm的无机填料和具有n / >（其中n≠f是无机填料的折射率，n r是树脂的折射率）为0.8〜1.2，热膨胀系数为-1×10 -5±5℃至4×10 -5 /℃，其折射率的真实依赖性值为-1x10 -4℃， 在-20℃至90℃的温度范围内，基本上不能吸收波长范围为0.6的光，在/ 至0.9μm或1.2-1.6μm。 本发明还提供一种光电子电路板。

公开(公告)号：US20070147767A1

公开(公告)日：2007-06-28

申请号：US11713605

申请日：2007-03-05

申请人： Toshihisa Nonaka ,  Noboru Asahi ,  Yoshiko Tatsuta

发明人： Toshihisa Nonaka ,  Noboru Asahi ,  Yoshiko Tatsuta

IPC分类号： G02B6/00

CPC分类号： G02B6/1221 ,  H05K1/0274 ,  H05K2201/0209 ,  H05K2201/068

摘要： This invention is a resin composition for optical wiring, comprising an inorganic filler with an average particle size of 1 nm to 100 nm and a resin, having a ratio nf/nr (where nf is the refractive index of the inorganic filler and nr is the refractive index of the resin) of 0.8 to 1.2, a thermal expansion coefficient of −1×10−5/° C. to 4×105/° C., and a true dependency value of its refractive index on the temperature of −1×10−4/° C. to 1×10−4/° C. in a temperature range from −20° C. to 90° C., and substantially incapable of absorbing light in a wavelength range from 0.6 to 0.9 μm or from 1.2 to 1.6 μm. This invention also provides an optoelectronic circuit board.

摘要翻译： 本发明是一种用于光学配线的树脂组合物，其包含平均粒度为1nm至100nm的无机填料和具有n / >（其中n≠f是无机填料的折射率，n r是树脂的折射率）为0.8〜1.2，热膨胀系数为-1×10 -5±5℃至4×10 5 /℃，其折射率的真实依赖性值为-1×10 -4 / 在-20℃至90℃的温度范围内，基本上不能吸收波长在0.6至 0.9μm或1.2-1.6μm。 本发明还提供一种光电子电路板。

公开(公告)号：US20090123747A1

公开(公告)日：2009-05-14

申请号：US11921560

申请日：2006-06-05

申请人： Koichi Fujimaru ,  Toshihisa Nonaka

发明人： Koichi Fujimaru ,  Toshihisa Nonaka

IPC分类号： B32B27/38 ,  B32B33/00 ,  C08L71/02 ,  H01L23/00

CPC分类号： C09J179/08 ,  C08L63/00 ,  C08L79/08 ,  C08L2666/20 ,  C08L2666/22 ,  C09J163/00 ,  H01L21/563 ,  H01L23/544 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/293 ,  H01L2224/73203 ,  H01L2224/81121 ,  H01L2224/81801 ,  H01L2224/8385 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19042 ,  Y10T428/287 ,  Y10T428/31515 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： [Problems] To provided an adhesive composition for semiconductor that permits handling without an occurrence of cracking or peeling off even when being flexed, that at the time of laminating, permits laminating on the electrode side of a semiconductor wafer provided with bump electrodes of which bump electrodes have a narrow pitch and a high pin proportion, that at the time of dicing, permits a high-speed cutting without any dicing dust contamination or defect, and that facilitates detection of alignment marks at the time of dicing and flip chip assembly.[Means for Solving Problems] There is provided an adhesive composition for semiconductor comprising an organic-solvent-soluble polyimide (a), an epoxy compound (b) and a hardening accelerator (c), wherein per 100 wt parts of the epoxy compound (b), there are contained 15 to 90 wt parts of the organic-solvent-soluble polyimide (a) and 0.1 to 10 wt parts of the hardening accelerator (c), wherein the epoxy compound (b) contains a compound being liquid at 25° C. under 1.013×105 N/m2 and a compound being solid at 25° C. under 1.013×105 N/m2, and wherein a ratio of compound being liquid based on all the epoxy compounds is 20 wt % or more and 60 wt % or less.

摘要翻译： [问题]提供一种半导体用粘合剂组合物，即使在弯曲时也能够不发生开裂或剥离的情况下进行处理，所以在层叠时允许层压在设置有突起电极的半导体晶片的电极侧 电极具有窄的间距和高的引脚比例，在切割时允许高速切割而没有任何切割粉尘污染或缺陷，并且便于在切割和倒装芯片组装时检测对准标记。 解决问题的手段提供一种半导体用粘合剂组合物，其包含有机溶剂可溶性聚酰亚胺（a），环氧化合物（b）和硬化促进剂（c）），其中，相对于100重量份环氧化合物 b）中，含有15〜90重量份的有机溶剂可溶性聚酰亚胺（a）和0.1〜10重量份的硬化促进剂（c），其中环氧化合物（b）含有在25℃下为液体的化合物 在1.013×10 5 N / m 2的范围内，化合物在25℃下为1.013×10 5 N / m 2，为固体，其中基于所有环氧化合物的液体化合物的比例为20重量％以上至60重量％ 或更少。

公开(公告)号：US08653202B2

公开(公告)日：2014-02-18

申请号：US11921560

申请日：2006-06-05

申请人： Koichi Fujimaru ,  Toshihisa Nonaka

发明人： Koichi Fujimaru ,  Toshihisa Nonaka

IPC分类号： C08G69/26 ,  C08F8/00 ,  C08L63/00 ,  C08L61/04 ,  C08L69/00 ,  C08F283/04 ,  C08G69/48 ,  C08G73/10 ,  C08L77/00 ,  C08L79/08

CPC分类号： C09J179/08 ,  C08L63/00 ,  C08L79/08 ,  C08L2666/20 ,  C08L2666/22 ,  C09J163/00 ,  H01L21/563 ,  H01L23/544 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/293 ,  H01L2224/73203 ,  H01L2224/81121 ,  H01L2224/81801 ,  H01L2224/8385 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19042 ,  Y10T428/287 ,  Y10T428/31515 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： An adhesive composition for semiconductor containing an organic-solvent-soluble polyimide (a), an epoxy compound (b) and a hardening accelerator (c), wherein per 100 wt parts of the epoxy compound (b), there are contained 15 to 90 wt parts of the organic-solvent-soluble polyimide (a) and 0.1 to 10 wt parts of the hardening accelerator (c), wherein the epoxy compound (b) contains a compound being liquid at 25° C. under 1.013×105 N/m2 and a compound being solid at 25° C. under 1.013×105 N/m2, and wherein a ratio of compound being liquid based on all the epoxy compounds is 20 wt % or more and 60 wt % or less.

摘要翻译： 含有有机溶剂可溶性聚酰亚胺（a），环氧化合物（b）和硬化促进剂（c））的半导体用粘合剂组合物，其中，相对于100重量份的环氧化合物（b），含有15〜90 有机溶剂可溶性聚酰亚胺（a）的重量份和硬化促进剂（c）0.1〜10重量份，其中环氧化合物（b）在25℃下含有1.01×10 5 N / m2，化合物在25℃下为1.013×10 5 N / m 2，其中基于所有环氧化合物的液体化合物的比例为20重量％以上至60重量％以下。

公开(公告)号：US20120183775A1

公开(公告)日：2012-07-19

申请号：US13498161

申请日：2010-10-08

申请人： Yoichi Shinba ,  Shoichi Niizeki ,  Toshihisa Nonaka

发明人： Yoichi Shinba ,  Shoichi Niizeki ,  Toshihisa Nonaka

IPC分类号： H05K3/22 ,  C09K5/00 ,  B32B15/02 ,  C23C22/06 ,  C23C22/07

CPC分类号： C09C3/10 ,  C01P2004/03 ,  C01P2004/62 ,  C01P2004/84 ,  C01P2006/40 ,  C09C1/62 ,  C09C1/64 ,  C09C1/644 ,  H05K3/28 ,  H05K2201/0224 ,  H05K2201/10977 ,  H05K2203/122 ,  Y10T428/2991

摘要： Disclosed is a process which comprises bringing an acidic organic substance or phosphoric acid into contact with a metal to form, on the surface of the metal, a layer that contains either an organic acid salt formed from both the acidic organic substance and the metal or a phosphoric acid salt formed from both the phosphoric acid and the metal. In the process, the layer can be selectively formed only on the surface of the metal. When the process is applied to the production of core-shell particles, neither agglomeration of the particles nor viscosity increase of the fluid occurs, while when the process is applied to the production of a covered metal-wiring circuit board, the layer can be selectively formed only in the metal area to be covered.

摘要翻译： 公开了一种方法，其包括使酸性有机物质或磷酸与金属接触以在金属表面上形成含有由酸性有机物质和金属形成的有机酸盐的层或 由磷酸和金属形成的磷酸盐。 在该过程中，该层可以仅选择性地形成在金属的表面上。 当将该方法应用于核 - 壳颗粒的生产时，不会发生颗粒的聚集或流体的粘度增加，而当该方法应用于覆盖金属布线电路板的生产时，该层可以是选择性的 仅在被覆盖的金属区域形成。

公开(公告)号：US20090103236A1

公开(公告)日：2009-04-23

申请号：US11991464

申请日：2006-09-01

申请人： Toshihisa Nonaka ,  Yoshitake Hara ,  Masahiro Yoshioka

发明人： Toshihisa Nonaka ,  Yoshitake Hara ,  Masahiro Yoshioka

IPC分类号： H01G4/20 ,  C08G67/00 ,  C08K3/22 ,  C08G73/10

CPC分类号： H01G4/1227 ,  C03C17/007 ,  C03C2217/475 ,  C04B26/06 ,  C04B26/14 ,  C04B2111/90 ,  C08K7/18 ,  H01B3/006 ,  C04B14/305

摘要： A paste composition containing (a) a resin, (b) high dielectric constant inorganic particles having a perovskite crystal structure, and (c) an organic solvent, wherein the average particle diameter of the high dielectric constant inorganic particles is 0.002 μm to 0.06 μm, and the amount of all organic solvents is 35 wt % to 85 wt % based on the total amount of the paste composition. Further, a dielectric composition containing (a) a resin and (b) high dielectric constant inorganic particles having a perovskite crystal structure, wherein the average particle diameter of the high dielectric constant inorganic particles (b) is 0.002 μm to 0.06 μm.

摘要翻译： 一种糊状组合物，其含有（a）树脂，（b）具有钙钛矿晶体结构的高介电常数无机颗粒和（c）有机溶剂，其中所述高介电常数无机颗粒的平均粒径为0.002μm至0.06μm ，并且所有有机溶剂的量相对于糊剂组合物的总量为35重量％至85重量％。 此外，包含（a）树脂和（b）具有钙钛矿晶体结构的高介电常数无机颗粒的电介质组合物，其中高介电常数无机颗粒（b）的平均粒径为0.002μm至0.06μm。

公开(公告)号：US06406771B1

公开(公告)日：2002-06-18

申请号：US09692458

申请日：2000-10-20

申请人： Hideo Nakakuki ,  Takeshi Arai ,  Toshihisa Nonaka

发明人： Hideo Nakakuki ,  Takeshi Arai ,  Toshihisa Nonaka

IPC分类号： B32B302

CPC分类号： G11B7/006 ,  G11B7/00454 ,  G11B7/007 ,  G11B7/24 ,  G11B7/24085 ,  G11B7/243 ,  G11B7/2534 ,  G11B7/2585 ,  G11B2007/2431 ,  G11B2007/24312 ,  G11B2007/24314 ,  G11B2007/24316 ,  G11B2007/25706 ,  G11B2007/25708 ,  G11B2007/25711 ,  G11B2007/25713 ,  G11B2007/25715 ,  Y10T428/21

摘要： The object of this invention is to provide a rewritable phase change type optical recording medium and an optical recording apparatus that are good in erasure characteristics and small in jitter even in high linear velocity high density recording, are unlikely to cause cross erasure even in the use of a substrate with a narrow track width, are unlikely to be deteriorated in signal quality even after repeated irradiation with a laser beam, and are good also in storage durability. The object of this invention can be achieved by a phase change type optical recording medium, characterized in that at least a first dielectric layer, a first boundary layer, a recording layer, a second boundary layer, an absorption correction layer and a reflection layer are provided in this order on a substrate, that the recording layer has a specific composition, that the first and second boundary layers are respectively mainly composed of at least one selected from carbon, carbides, oxides and nitrides, and that the absorption correction layer is 1.0 to 4.0 in refractive index and 0.5 to 3.0 in attenuation coefficient.

摘要翻译： 本发明的目的是提供即使在高线速度高密度记录中也具有良好的擦除特性和抖动小的可重写相变型光学记录介质和光学记录装置，即使在使用中也不会引起交叉擦除 具有窄轨道宽度的基板，即使在用激光束重复照射之后也不可能劣化信号质量，并且也具有良好的储存耐久性。本发明的目的可以通过相变型光学记录介质 其特征在于，至少第一介电层，第一边界层，记录层，第二边界层，吸收校正层和反射层依次设置在基板上，记录层具有特定的组成 第一和第二边界层分别主要由选自碳，碳化物，氧化物和氮化物中的至少一种构成 吸收校正层的折射率为1.0〜4.0，衰减系数为0.5〜3.0。