公开(公告)号：US5588207A

公开(公告)日：1996-12-31

申请号：US437085

申请日：1995-05-05

申请人： Kouji Kawakita ,  Masahide Tsukamoto ,  Yasukiho Horio ,  Seiichi Nakatani ,  Akihito Hatakeyama

发明人： Kouji Kawakita ,  Masahide Tsukamoto ,  Yasukiho Horio ,  Seiichi Nakatani ,  Akihito Hatakeyama

IPC分类号： H05K1/03 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H01K3/10 ,  H05K3/20

CPC分类号： H05K3/4046 ,  H01L2224/16237 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K3/4614 ,  H05K3/4644 ,  H05K3/4652 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49165

摘要： A two-sided printed circuit board including a base having a first surface, a second surface substantially parallel to the first surface, and a plurality of through-holes formed in the base; a first conductive layer provided on the first surface of the base; a second conductive layer provided on the second surface of the base; and a conductive particle buried in each of the through-holes in a pressurized state for electrically connecting the first conductive layer and the second conductive layer.

摘要翻译： 一种双面印刷电路板，包括具有第一表面，基本上平行于第一表面的第二表面和形成在基底中的多个通孔的基底; 设置在所述基座的第一表面上的第一导电层; 设置在所述基座的第二表面上的第二导电层; 以及以加压状态掩埋在每个通孔中的导电颗粒，用于电连接第一导电层和第二导电层。

公开(公告)号：US5440075A

公开(公告)日：1995-08-08

申请号：US124317

申请日：1993-09-20

申请人： Kouji Kawakita ,  Masahide Tsukamoto ,  Yasuhiko Horio ,  Seiichi Nakatani ,  Akihito Hatakeyama

发明人： Kouji Kawakita ,  Masahide Tsukamoto ,  Yasuhiko Horio ,  Seiichi Nakatani ,  Akihito Hatakeyama

IPC分类号： H05K1/03 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H05K1/02

CPC分类号： H05K3/4046 ,  H01L2224/16237 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K3/4614 ,  H05K3/4644 ,  H05K3/4652 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49165

摘要： A two-sided printed circuit board including a base having a first surface, a second surface substantially parallel to the first surface, and a plurality of through-holes formed in the base; a first conductive layer provided on the first surface of the base; a second conductive layer provided on the second surface of the base; and a conductive particle buried in each of the through-holes in a pressurized state for electrically connecting the first conductive layer and the second conductive layer.

摘要翻译： 一种双面印刷电路板，包括具有第一表面，基本上平行于第一表面的第二表面和形成在基底中的多个通孔的基底; 设置在所述基座的第一表面上的第一导电层; 设置在所述基座的第二表面上的第二导电层; 以及以加压状态掩埋在每个通孔中的导电颗粒，用于电连接第一导电层和第二导电层。

公开(公告)号：US6108903A

公开(公告)日：2000-08-29

申请号：US582930

申请日：1996-01-04

申请人： Seiichi Nakatani ,  Akihito Hatakeyama ,  Kouji Kawakita ,  Hiroshi Sogou ,  Tatsuo Ogawa ,  Tamao Kojima

发明人： Seiichi Nakatani ,  Akihito Hatakeyama ,  Kouji Kawakita ,  Hiroshi Sogou ,  Tatsuo Ogawa ,  Tamao Kojima

IPC分类号： H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K3/10 ,  H05K3/36

CPC分类号： H05K3/462 ,  H01R12/523 ,  H05K3/4069 ,  H05K2201/0116 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  H05K3/4623 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24917

摘要： A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality. By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably. In addition to that, since the conductive paste is filled up to the surface of the tackfree films, the conductive paste sticks out from the surface of the organic porous base material when the tackfree films are separated. As a result, the filled amount of the conductive substance increases after the lamination, and thus, the connection resistance is reduced considerably.

摘要翻译： 电路基板的连接构件包括在两侧设置有无粘性薄膜的有机多孔基材，设置在要求位置的通孔，其填充有导电树脂组合物直到无粘膜的表面。 这种结构能够实现内通孔连接，从而可以获得电路基板的连接构件和高可靠性和高质量的电连接器。 通过使用包括在两侧设置有无粘膜的有机多孔基材的电路基板的连接构件，以及设置在填充有导电树脂组合物的所需位置的通孔，直到无粘膜的表面，可以形成 来自可以制造得相当稳定的双面板或四层基板的高多层基板。 除此之外，由于导电膏被填充到无粘性膜的表面，所以当无粘性膜分离时，导电糊从有机多孔基材的表面突出出来。 结果，在层压之后导电物质的填充量增加，因此连接电阻显着降低。

公开(公告)号：US06326694B1

公开(公告)日：2001-12-04

申请号：US09337407

申请日：1999-06-21

申请人： Akihito Hatakeyama ,  Seiichi Nakatani ,  Kouji Kawakita ,  Hiroshi Sogou ,  Tatsuo Ogawa ,  Tamao Kojima

发明人： Akihito Hatakeyama ,  Seiichi Nakatani ,  Kouji Kawakita ,  Hiroshi Sogou ,  Tatsuo Ogawa ,  Tamao Kojima

IPC分类号： H01L2348

CPC分类号： H05K3/462 ,  H05K1/0366 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0278 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2201/2072 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

摘要： A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.

摘要翻译： 印刷电路板包括具有封闭空隙的未固化衬底材料，所述未固化衬底材料设置有通孔。 当形成通孔时，存在于基板材料中的空隙从通孔的内壁开口形成中空形部分。 通过用导电膏填充通孔和中空形部分，通过导电膏和通孔的壁表面之间的保持效果增加，粘附性得到改善。

公开(公告)号：US06211487B1

公开(公告)日：2001-04-03

申请号：US09379008

申请日：1999-08-23

申请人： Akihito Hatakeyama ,  Seiichi Nakatani ,  Kouji Kawakita ,  Hiroshi Sogou ,  Tatsuo Ogawa ,  Tamao Kojima

发明人： Akihito Hatakeyama ,  Seiichi Nakatani ,  Kouji Kawakita ,  Hiroshi Sogou ,  Tatsuo Ogawa ,  Tamao Kojima

IPC分类号： H05K336

CPC分类号： H05K3/462 ,  H05K1/0366 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0278 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2201/2072 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

摘要： A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.

公开(公告)号：US5972482A

公开(公告)日：1999-10-26

申请号：US740261

申请日：1996-10-25

申请人： Akihito Hatakeyama ,  Seiichi Nakatani ,  Kouji Kawakita ,  Hiroshi Sogou ,  Tatsuo Ogawa ,  Tamao Kojima

发明人： Akihito Hatakeyama ,  Seiichi Nakatani ,  Kouji Kawakita ,  Hiroshi Sogou ,  Tatsuo Ogawa ,  Tamao Kojima

IPC分类号： H05K1/03 ,  H05K3/40 ,  H05K3/46 ,  B32B9/00

CPC分类号： H05K3/462 ,  H05K3/4069 ,  H05K1/0366 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0278 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2201/2072 ,  H05K2203/0191 ,  H05K2203/1461 ,  H05K3/4614 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

摘要： A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.

摘要翻译： 印刷电路板包括具有封闭空隙的未固化衬底材料，所述未固化衬底材料设置有通孔。 当形成通孔时，存在于基板材料中的空隙从通孔的内壁开口形成中空形部分。 通过用导电膏填充通孔和中空形部分，通过导电膏和通孔的壁表面之间的保持效果增加，粘附性得到改善。

公开(公告)号：US5484647A

公开(公告)日：1996-01-16

申请号：US308982

申请日：1994-09-20

申请人： Seiichi Nakatani ,  Akihito Hatakeyama ,  Kouji Kawakita ,  Hirishi Sogou ,  Tatsuo Ogawa ,  Tamao Kojima

发明人： Seiichi Nakatani ,  Akihito Hatakeyama ,  Kouji Kawakita ,  Hirishi Sogou ,  Tatsuo Ogawa ,  Tamao Kojima

IPC分类号： H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  B32B9/00

CPC分类号： H05K3/462 ,  H01R12/523 ,  H05K3/4069 ,  H05K2201/0116 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  H05K3/4623 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/249994 ,  Y10T428/249996 ,  Y10T442/2475 ,  Y10T442/674

摘要： A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality.By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably. In addition to that, since the conductive paste is filled up to the surface of the tackfree films, the conductive paste sticks out from the surface of the organic porous base material when the tackfree-films are separated. As a result, the filled amount of the conductive substance increases after the lamination, and thus, the connection resistance is reduced considerably.

摘要翻译： 电路基板的连接构件包括在两侧设置有无粘性薄膜的有机多孔基材，设置在要求位置的通孔，其填充有导电树脂组合物直到无粘膜的表面。 这种结构能够实现内通孔连接，从而可以获得电路基板的连接构件和高可靠性和高质量的电连接器。 通过使用包括在两侧设置有无粘膜的有机多孔基材的电路基板的连接构件以及设置在导电性树脂组合物的要求位置处的通孔，直到无粘膜的表面，可以形成 来自可以制造得相当稳定的双面板或四层基板的高多层基板。 除此之外，由于导电膏被填充到无粘性膜的表面，所以当无粘膜分离时，导电糊从有机多孔基材的表面突出出来。 结果，在层压之后导电物质的填充量增加，因此连接电阻显着降低。

公开(公告)号：US5960538A

公开(公告)日：1999-10-05

申请号：US31082

申请日：1998-02-26

申请人： Kouji Kawakita ,  Seiichi Nakatani ,  Masahide Tsukamoto

发明人： Kouji Kawakita ,  Seiichi Nakatani ,  Masahide Tsukamoto

IPC分类号： H05K1/11 ,  H01L21/48 ,  H01L23/367 ,  H01L23/538 ,  H05K1/02 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46 ,  H05K3/02

CPC分类号： H05K3/4069 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3677 ,  H01L23/5384 ,  H05K1/0206 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T428/24917 ,  Y10T428/24926

摘要： The present invention provides a printed circuit board in which electrode layers can electrically be connected by an inner-through-hole connection, the coefficient of thermal expansion of the board is equal to that of a semiconductor, high thermal conductivity can be obtained and wiring can be formed at a high density. A cover film is laminated on both surfaces of a resin impregnated fabric sheet, holes are formed by laser beams in the direction of the thickness of the sheet and cover film, an electrically conductive paste that contains the electrically conductive particles and a thermosetting resin is filled in the holes. The cover film is removed, a copper foil is placed on both sides of the sheet, and pressed and heated, and the resin component of the sheet and that of the electrically conductive paste are hardened. The copper foil is etched to form circuit patterns, and further etching removes the electrically conductive particles present at a surface layer portion so that an electrical insulating layer is thus formed.

摘要翻译： 本发明提供一种印刷电路板，其中电极层可以通过内部通孔连接而电连接，板的热膨胀系数等于半导体的热膨胀系数，可以获得高导热性，并且布线可以 以高密度形成。 在树脂浸渍织物片的两个表面上层压覆盖膜，在片材和覆盖膜的厚度方向上通过激光束形成孔，填充含有导电性粒子和热固性树脂的导电性糊剂 在洞里 除去覆盖膜，将铜箔放置在片材的两侧，并被加压和加热，并且片材的树脂成分和导电膏的树脂成分硬化。 蚀刻铜箔以形成电路图案，并且进一步蚀刻除去存在于表面层部分的导电颗粒，从而形成电绝缘层。

公开(公告)号：US5817404A

公开(公告)日：1998-10-06

申请号：US585508

申请日：1996-01-16

申请人： Kouji Kawakita ,  Seiichi Nakatani ,  Masahide Tsukamoto

发明人： Kouji Kawakita ,  Seiichi Nakatani ,  Masahide Tsukamoto

IPC分类号： H05K1/11 ,  H01L21/48 ,  H01L23/367 ,  H01L23/538 ,  H05K1/02 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46 ,  B32B3/00

CPC分类号： H05K3/4069 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3677 ,  H01L23/5384 ,  H05K1/0206 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T428/24917 ,  Y10T428/24926

摘要： The present invention provides a printed circuit board in which electrode layers can electrically be connected by an inner-through-hole connection, the coefficient of thermal expansion of the board is equal to that of a semiconductor, high thermal conductivity can be obtained and wiring can be formed at a high density. A cover film is laminated on both surfaces of a resin impregnated fabric sheet, holes are formed by laser beams in the direction of the thickness of the sheet and cover film, an electrically conductive paste that contains the electrically conductive particles and a thermosetting resin is filled in the holes. The cover film is removed, a copper foil is placed on both sides of the sheet, and pressed and heated, and the resin component of the sheet and that of the electrically conductive paste are hardened. The copper foil is etched to form circuit patterns, and further etching removes the electrically conductive particles present at a surface layer portion so that an electrical insulating layer is thus formed.

公开(公告)号：US6096411A

公开(公告)日：2000-08-01

申请号：US38625

申请日：1998-03-12

申请人： Seiichi Nakatani ,  Kouji Kawakita ,  Tatsuo Ogawa

发明人： Seiichi Nakatani ,  Kouji Kawakita ,  Tatsuo Ogawa

IPC分类号： C08K3/00 ,  C08K3/08 ,  C08L63/00 ,  H05K1/09 ,  H05K3/40 ,  H05K3/46 ,  B32B3/00

CPC分类号： H05K3/4069 ,  C08K3/08 ,  H05K1/095 ,  C08K2003/085 ,  H05K2201/0355 ,  H05K2203/1461 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T428/24917

摘要： The invention related to a paste for via hole filling which enables inner via hole connection between electrode layers without employing through hole plating techniques, and a multi-layered printed circuit board using the same. The conductive paste composition of the invention comprises a) 70-90 wt % of copper particles of an average particle size of 0.5-8 .mu.m; b) 0.5-15 wt % of insulating particles of an average particle size of 8-20 .mu.m; and, c) 6-17 wt % of heat setting type liquid epoxy resin, in order to exhibit low viscosity and low volatility. The conductive paste is printed and filled into through holes passing through a laminated substrate which is provide with copper foils on both sides thereof, to form a printed circuit board in which the via holes are electrically connected after thermosetting. By adding insulating particles of large particle size, the amount of copper particles to be added is decreased so that a via hole connection of low specific resistance and high reliability is obtained, and improvements in a decrease of viscosity and continuous printability of the paste itself can be achieved.

摘要翻译： 本发明涉及一种用于通孔填充的糊剂，其能够在不使用通孔电镀技术的情况下实现电极层之间的内部通孔连接，以及使用该糊状物的多层印刷电路板。 本发明的导电糊组合物包含a）70-90重量％的平均粒径为0.5-8μm的铜颗粒; b）0.5-15重量％的平均粒径为8-20μm的绝缘颗粒; 和c）6-17重量％的热固定型液体环氧树脂，以显示低粘度和低挥发性。 将导电性糊料印刷填充到通过其两侧设置有铜箔的层叠基板的通孔中，形成印刷电路基板，其中通孔在热固化后电连接。 通过添加大粒径的绝缘粒子，可以减少添加的铜粒子的量，从而获得低电阻率和高可靠性的通孔连接，并且可以提高糊剂本身的粘度和连续印刷性的降低 实现。