公开(公告)号：US08366903B2

公开(公告)日：2013-02-05

申请号：US12222995

申请日：2008-08-21

申请人： Toshinori Kawamura ,  Haruo Akahoshi ,  Kunio Arai

发明人： Toshinori Kawamura ,  Haruo Akahoshi ,  Kunio Arai

IPC分类号： H05K3/07

CPC分类号： H05K3/07 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K2201/0112 ,  H05K2203/0315 ,  H05K2203/0346

摘要： In a method of manufacturing a printed wiring board, a via reaches from a surface copper layer to an inner-layer copper layer of a multilayer board, and copper layers and insulating layers are alternately layered. The wiring board is machined by a laser, and a process of machining the via includes forming a laser absorbing layer on a surface of a copper layer disposed on the surface of the multilayer board. The laser is irradiated, and an electrolytic etching and removal of the laser absorbing layer is carried out in this order.

摘要翻译： 在制造印刷电路板的方法中，通孔从多层板的表面铜层到内层铜层到达，铜层和绝缘层交替层叠。 接线板由激光加工，加工通孔的工序包括在设置在多层板的表面上的铜层的表面上形成激光吸收层。 对激光进行照射，依次进行激光吸收层的电解蚀刻和去除。

公开(公告)号：US20110036493A1

公开(公告)日：2011-02-17

申请号：US12921656

申请日：2009-02-25

申请人： Toshinori Kawamura ,  Haruo Akahoshi ,  Kunio Arai

发明人： Toshinori Kawamura ,  Haruo Akahoshi ,  Kunio Arai

IPC分类号： B29C65/16 ,  C25D11/34

CPC分类号： H05K3/0038 ,  C25D7/0614 ,  C25D11/34 ,  H05K3/4652 ,  H05K2201/0112 ,  H05K2203/0315

摘要： The present invention provides a surface treatment method for a printed wiring board to form cupric oxide on a surface of an outer layer of copper foil of a laminated board formed by laminating copper foils to base resin layers the cupric oxide being formed to have thickness 0.6 μm to 3.0 μm by performing electrolytic anodizing in an alkaline aqueous solution containing copper oxide ions at a concentration of more than 0.001 mol/l but not more than the saturation point, under the conditions that the electrolytic solution contains sodium hydroxide or potassium hydroxide of 2 mol/l to 6 mol/l and liquid temperature is 50° C. to 90° C.

摘要翻译： 本发明提供一种印刷线路板的表面处理方法，该印刷线路板在层压板的铜箔的外层的表面上形成氧化铜，所述层压板通过将铜箔层叠到形成为厚度为0.6μm的氧化铜的基础树脂层而形成 通过在浓度大于0.001mol / l且不大于饱和点的含有氧化铜离子的碱性水溶液中，在电解液含有2mol的氢氧化钠或氢氧化钾的条件下进行电解阳极氧化至3.0μm / l至6mol / l，液体温度为50℃至90℃

公开(公告)号：US20050244621A1

公开(公告)日：2005-11-03

申请号：US11117505

申请日：2005-04-29

申请人： Kunio Arai ,  Haruo Akahoshi

发明人： Kunio Arai ,  Haruo Akahoshi

IPC分类号： B32B3/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/06 ,  H05K3/42 ,  H05K3/46

CPC分类号： H05K3/4679 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/06 ,  H05K3/062 ,  H05K3/421 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0112 ,  H05K2201/09845 ,  H05K2201/09918 ,  H05K2203/0315 ,  H05K2203/0346 ,  H05K2203/0554 ,  Y10T428/24917

摘要： The invention is to provide a printed circuit board in which advance of packaging density of the printed circuit board and reduction in production cost can be attained while processing quality can be made uniform, a method for processing the printed circuit board and a method for producing the printed circuit board. There is provided a printed circuit board including an alternate laminate of electric conductor layers and electrically insulating layers, wherein a coating layer capable of absorbing laser light but insoluble in an etching solution dissolving the electric conductor layers is provided on a front surface of a first one of the electric conductor layers. In this case, the coating layer may be provided on a front surface of a rear one of the electric conductor layers. Each of the electric conductor layers may contain Cu as a main component while the coating layer may contain CuO as a main component. The coating layer may have a thickness not thinner than 0.6 μm.

摘要翻译： 本发明提供一种印刷电路板，其中能够使加工质量均匀的印刷电路板的封装密度的提高和生产成本的降低，印刷电路板的处理方法和制造方法 印刷电路板。 提供了一种印刷电路板，其包括导电层和电绝缘层的交替叠层，其中在第一个的前表面上设置有能够吸收激光但不溶于溶解导电层的蚀刻溶液的涂层 的导电层。 在这种情况下，涂层可以设置在后导体层的前表面上。 每个导电体层可以包含Cu作为主要成分，而涂层可以包含CuO作为主要成分。 涂层可以具有不小于0.6μm的厚度。

公开(公告)号：US20080230512A1

公开(公告)日：2008-09-25

申请号：US12110466

申请日：2008-04-28

申请人： Kunio Arai ,  Haruo Akahoshi

发明人： Kunio Arai ,  Haruo Akahoshi

IPC分类号： H01B13/00

CPC分类号： H05K3/4679 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/06 ,  H05K3/062 ,  H05K3/421 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0112 ,  H05K2201/09845 ,  H05K2201/09918 ,  H05K2203/0315 ,  H05K2203/0346 ,  H05K2203/0554 ,  Y10T428/24917

摘要： The invention is to provide a printed circuit board in which advance of packaging density of the printed circuit board and reduction in production cost can be attained while processing quality can be made uniform, a method for processing the printed circuit board and a method for producing the printed circuit board.There is provided a printed circuit board including an alternate laminate of electric conductor layers and electrically insulating layers, wherein a coating layer capable of absorbing laser light but insoluble in an etching solution dissolving the electric conductor layers is provided on a front surface of a first one of the electric conductor layers. In this case, the coating layer may be provided on a front surface of a rear one of the electric conductor layers. Each of the electric conductor layers may contain Cu as a main component while the coating layer may contain CuO as a main component. The coating layer may have a thickness not thinner than 0.6 μm.

摘要翻译： 本发明提供一种印刷电路板，其中能够使加工质量均匀的印刷电路板的封装密度的提高和生产成本的降低，印刷电路板的处理方法和制造方法 印刷电路板。 提供了一种印刷电路板，其包括导电层和电绝缘层的交替叠层，其中在第一个的前表面上设置有能够吸收激光但不溶于溶解导电层的蚀刻溶液的涂层 的导电层。 在这种情况下，涂层可以设置在后导体层的前表面上。 每个导电体层可以包含Cu作为主要成分，而涂层可以包含CuO作为主要成分。 涂层可以具有不小于0.6μm的厚度。

公开(公告)号：US20090084684A1

公开(公告)日：2009-04-02

申请号：US12222995

申请日：2008-08-21

申请人： Toshinori Kawamura ,  Haruo Akahoshi ,  Kunio Arai

发明人： Toshinori Kawamura ,  Haruo Akahoshi ,  Kunio Arai

IPC分类号： H05K3/07

CPC分类号： H05K3/07 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K2201/0112 ,  H05K2203/0315 ,  H05K2203/0346

摘要： There is provided a method for manufacturing a printed wiring board that allows molten scattered Cu and an overhang to be selectively removed while scarcely decreasing a thickness of wires, and an electrolytic etching solution suitably used in the method. In the method for manufacturing a printed wiring board in which a via that reaches from a surface copper layer to an inner-layer copper layer of a multilayer board in which copper layers and insulating layers are alternately layered is machined by means of a laser, a process of machining the via including steps of forming a laser absorbing layer on a surface of a copper layer disposed on the surface of the multilayer board, irradiating the laser, performing an electrolytic etching and removing the laser absorbing layer is carried out in this order.

摘要翻译： 提供了一种制造印刷线路板的方法，其允许选择性地去除熔融散射的Cu和悬空，同时几乎不减少线的厚度，以及在该方法中适当使用的电解蚀刻溶液。 在其中通过激光加工其中铜层和绝缘层交替层叠的从表面铜层到达多层板的内层铜层的通孔的印刷线路板的制造方法中， 在通过包括在多层板的表面设置的铜层的表面上形成激光吸收层的步骤，照射激光，进行电解蚀刻和去除激光吸收层的步骤是按顺序进行的。

公开(公告)号：US07666320B2

公开(公告)日：2010-02-23

申请号：US11443013

申请日：2006-05-31

申请人： Toshinori Kawamura ,  Haruo Akahoshi ,  Kunio Arai

发明人： Toshinori Kawamura ,  Haruo Akahoshi ,  Kunio Arai

IPC分类号： B23K26/00 ,  H05K3/00

CPC分类号： B23K26/18 ,  B23K26/009 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/35 ,  B23K2101/42 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/06 ,  H05K3/4652 ,  H05K2203/0315 ,  H05K2203/0346 ,  H05K2203/0793 ,  Y10T428/31678

摘要： There is provided a method for removing molten and scattered Cu and overhang that are generated around a via opening during laser machining in a direct laser via forming method of directly machining an outer-layer copper foil. In a manufacturing method of a printed wiring board of machining the via by laser directly through the copper foil of a copper-clad laminate in which the copper foil is clad on a base material resin, a process for machining the via is carried out in a sequence of (a) a copper foil surface treatment step of forming an oxide film on the surface of said copper foil, (b) a laser via machining step, (c) an alkali treatment step and (d) a molten and scattered Cu etching step. It is desirable to carry out (e) a de-smearing treatment after the molten and scattered Cu etching.

摘要翻译： 提供了一种用于在直接加工外层铜箔的直接激光通孔形成方法的激光加工期间在通孔开口周围产生的熔融和分散的Cu和悬垂线的方法。 在通过激光直接通过铜箔被覆在基材树脂上的覆铜层压板的铜箔进行加工通孔的印刷线路板的制造方法中，将通孔的加工过程 （a）在所述铜箔的表面形成氧化膜的铜箔表面处理工序的顺序，（b）激光通孔机械加工工序，（c）碱处理工序和（d）熔融和散射的Cu蚀刻 步。 期望在熔融和散射的Cu蚀刻之后进行（e）去涂抹处理。

公开(公告)号：US20060270232A1

公开(公告)日：2006-11-30

申请号：US11443013

申请日：2006-05-31

申请人： Toshinori Kawamura ,  Haruo Akahoshi ,  Kunio Arai

发明人： Toshinori Kawamura ,  Haruo Akahoshi ,  Kunio Arai

IPC分类号： H01L21/302 ,  B32B15/04 ,  B23K26/00 ,  C09K13/00

CPC分类号： B23K26/18 ,  B23K26/009 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/35 ,  B23K2101/42 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/06 ,  H05K3/4652 ,  H05K2203/0315 ,  H05K2203/0346 ,  H05K2203/0793 ,  Y10T428/31678

摘要： There is provided a method for removing molten and scattered Cu and overhang that are generated around a via opening during laser machining in a direct laser via forming method of directly machining an outer-layer copper foil. In a manufacturing method of a printed wiring board of machining the via by laser directly through the copper foil of a copper-clad laminate in which the copper foil is clad on a base material resin, a process for machining the via is carried out in a sequence of (a) a copper foil surface treatment step of forming an oxide film on the surface of said copper foil, (b) a laser via machining step, (c) an alkali treatment step and (d) a molten and scattered Cu etching step. It is desirable to carry out (e) a de-smearing treatment after the molten and scattered Cu etching.

摘要翻译： 提供了一种用于在直接加工外层铜箔的直接激光通孔形成方法的激光加工期间在通孔开口周围产生的熔融和分散的Cu和悬垂线的方法。 在通过激光直接通过铜箔被覆在基材树脂上的覆铜层压板的铜箔进行加工通孔的印刷线路板的制造方法中，将通孔的加工过程 （a）在所述铜箔的表面上形成氧化膜的铜箔表面处理工序，（b）激光通孔机械加工工序，（c）碱处理工序和（d）熔融和散射的Cu蚀刻 步。 期望在熔融和散射的Cu蚀刻之后进行（e）去涂抹处理。

公开(公告)号：US20080283491A1

公开(公告)日：2008-11-20

申请号：US11987980

申请日：2007-12-06

申请人： Kunio Arai ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

发明人： Kunio Arai ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

IPC分类号： H01B13/00

CPC分类号： H05K3/465 ,  B23K26/0604 ,  B23K26/0661 ,  B23K26/0738 ,  B23K26/082 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/35 ,  B23K2101/42 ,  B23K2103/16 ,  B23K2103/42 ,  B23K2103/50 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/045 ,  H05K3/107 ,  H05K3/16 ,  H05K3/4661 ,  H05K2201/0166 ,  H05K2201/09563 ,  H05K2203/0557 ,  H05K2203/108 ,  Y10T29/49155

摘要： There is provided a printed circuit board whose peel strength is large and a printed circuit board fabrication method and a printed circuit board machining apparatus that allow a fabrication time and a fabrication cost to be reduced. The fabrication method of the printed circuit board comprises steps of forming a resist layer on a surface of the printed circuit board whose surface is made of an insulator, of forming a hole that is connected from the surface of the resist layer to a conductor pattern of an inner layer and a hole and grooves having a depth not connected with the conductor layer of the inner layer by irradiating lasers, of filling a conductive material into the holes and the grooves to form a conductor pattern and of removing the resist layer to project a portion of the conductor pattern out of the surface of the insulating layer.

摘要翻译： 提供了剥离强度大的印刷电路板和允许制造时间和制造成本降低的印刷电路板制造方法和印刷电路板加工装置。 印刷电路板的制造方法包括以下步骤：在其表面由绝缘体制成的印刷电路板的表面上形成抗蚀剂层，形成从抗蚀剂层的表面连接到孔的导体图案 内层和孔以及通过照射激光而不与内层的导体层连接的深度的凹槽，将导电材料填充到孔和凹槽中以形成导体图案并且去除抗蚀剂层以投射 导体图案的部分从绝缘层的表面出来。

公开(公告)号：US07205501B2

公开(公告)日：2007-04-17

申请号：US10927185

申请日：2004-08-27

申请人： Kunio Arai ,  Kazuhisa Ishii ,  Hiroaki Ashizawa

发明人： Kunio Arai ,  Kazuhisa Ishii ,  Hiroaki Ashizawa

IPC分类号： B23K26/38

CPC分类号： H05K3/0038 ,  B23K26/04 ,  B23K26/0622 ,  B23K26/384 ,  B23K2101/42 ,  B23K2103/12

摘要： A laser machining method and a laser machining apparatus superior in hole position accuracy and hole quality. An outgoing beam outputted as short pulses is shaped by a pulse shaping unit so as to form a #1 branch beam. The #1 branch beam is supplied to a portion to be machined, so as to machine the portion. In this case, the #1 branch beam may be controlled to synchronize with the outgoing beam. When a piece to be machined is made from a metal material and at least one of an organic material and an inorganic material, the metal material is machined with a laser beam shaped to have a pulse width not shorter than 100 ns, and at least one of the organic material and the inorganic material is machined with a laser beam shaped to have a pulse width shorter than 100 ns.

摘要翻译： 激光加工方法和激光加工装置，其孔位精度和孔质量优异。 作为短脉冲输出的输出光束通过脉冲整形单元成形，从而形成＃1分支光束。 将＃1分支光束供给到要加工的部分，以便加工该部分。 在这种情况下，可以控制＃1分支光束与输出光束同步。 当要被加工的零件由金属材料和有机材料和无机材料中的至少一种制成时，金属材料被加工成具有不小于100ns的脉冲宽度的激光束，并且至少一个 的有机材料和无机材料用激光束加工成具有短于100ns的脉冲宽度。

公开(公告)号：US20050155958A1

公开(公告)日：2005-07-21

申请号：US10927185

申请日：2004-08-27

申请人： Kunio Arai ,  Kazuhisa Ishii ,  Hiroaki Ashizawa

发明人： Kunio Arai ,  Kazuhisa Ishii ,  Hiroaki Ashizawa

IPC分类号： B23K26/04 ,  B23K26/06 ,  B23K26/073 ,  B23K101/40 ,  B23K101/42 ,  H05K3/00 ,  B23K26/40

CPC分类号： H05K3/0038 ,  B23K26/04 ,  B23K26/0622 ,  B23K26/384 ,  B23K2101/42 ,  B23K2103/12

摘要： A laser machining method and a laser machining apparatus superior in hole position accuracy and hole quality. An outgoing beam outputted as short pulses is shaped by a pulse shaping unit so as to form a #1 branch beam. The #1 branch beam is supplied to a portion to be machined, so as to machine the portion. In this case, the #1 branch beam may be controlled to synchronize with the outgoing beam. When a piece to be machined is made from a metal material and at least one of an organic material and an inorganic material, the metal material is machined with a laser beam shaped to have a pulse width not shorter than 100 ns, and at least one of the organic material and the inorganic material is machined with a laser beam shaped to have a pulse width shorter than 100 ns.

摘要翻译： 激光加工方法和激光加工装置，其孔位精度和孔质量优异。 作为短脉冲输出的输出光束通过脉冲整形单元成形，从而形成＃1分支光束。 将＃1分支光束供给到要加工的部分，以便加工该部分。 在这种情况下，可以控制＃1分支光束与输出光束同步。 当要被加工的零件由金属材料和有机材料和无机材料中的至少一种制成时，金属材料被加工成具有不小于100ns的脉冲宽度的激光束，并且至少一个 的有机材料和无机材料用激光束加工成具有短于100ns的脉冲宽度。