公开(公告)号：US06797628B2

公开(公告)日：2004-09-28

申请号：US10051678

申请日：2002-01-16

申请人： Li Li ,  Max F. Hineman ,  Mark E. Tuttle

发明人： Li Li ,  Max F. Hineman ,  Mark E. Tuttle

IPC分类号： H01L21302

CPC分类号： H01L21/76802 ,  H01L21/3065 ,  H01L21/31116 ,  H01L21/76829 ,  H01L43/12

摘要： A method of forming integrated circuitry includes chemical vapor depositing a silicon carbide comprising layer over a substrate at a temperature of no greater than 500° C. Plasma etching is conducted through at least a portion of the silicon carbide comprising layer using a gas chemistry comprising oxygen and hydrogen. Semiconductor processing methods include the above in fabrication of contact openings and in fabrication of MRAM circuitry. Semiconductor processing methods also include fabrication of contact openings using resist and removing silicon carbide comprising material and resist in a common plasma etching step.

摘要翻译： 一种形成集成电路的方法包括在不超过500℃的温度下将基于碳化硅的层化学气相沉积在衬底上。等离子体蚀刻通过使用包含氧气的气体化学物质的至少一部分碳化硅包含层进行 和氢气。 半导体处理方法包括以上制造接触开口和制造MRAM电路。 半导体处理方法还包括使用抗蚀剂制造接触开口，并在公共等离子体蚀刻步骤中除去包含材料和抗蚀剂的碳化硅。

公开(公告)号：US07067429B2

公开(公告)日：2006-06-27

申请号：US10719634

申请日：2003-11-21

申请人： Li Li ,  Max F. Hineman ,  Mark E. Tuttle

发明人： Li Li ,  Max F. Hineman ,  Mark E. Tuttle

IPC分类号： H01L21/311 ,  H01L21/302 ,  H01L21/461

CPC分类号： H01L21/76802 ,  H01L21/3065 ,  H01L21/31116 ,  H01L21/76829 ,  H01L43/12

摘要： A method of forming integrated circuitry includes chemical vapor depositing a silicon carbide comprising layer over a substrate at a temperature of no greater than 500° C. Plasma etching is conducted through at least a portion of the silicon carbide comprising layer using a gas chemistry comprising oxygen and hydrogen. Semiconductor processing methods include the above in fabrication of contact openings and in fabrication of MRAM circuitry. Semiconductor processing methods also include fabrication of contact openings using resist and removing silicon carbide comprising material and resist in a common plasma etching step.

摘要翻译： 一种形成集成电路的方法包括在不超过500℃的温度下将基于碳化硅的层化学气相沉积在衬底上。等离子体蚀刻通过使用包含氧气的气体化学物质的至少一部分碳化硅包含层进行 和氢气。 半导体处理方法包括以上制造接触开口和制造MRAM电路。 半导体处理方法还包括使用抗蚀剂制造接触开口，并在公共等离子体蚀刻步骤中除去包含材料和抗蚀剂的碳化硅。

公开(公告)号：US09153614B2

公开(公告)日：2015-10-06

申请号：US11839377

申请日：2007-08-15

申请人： Mark E. Tuttle

发明人： Mark E. Tuttle

IPC分类号： H04N5/225 ,  H01L27/146 ,  G02B3/00

CPC分类号： H01L27/14627 ,  G02B3/0056 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685

摘要： Non-symmetrically located lenses are employed with semiconductor devices comprising optically active regions which are non-symmetrically located on a surface thereof. The optical axes of the lenses are aligned with the centers of the optically active regions. Wafer-level assemblies of semiconductor devices and lenses may be fabricated, mutually secured with the non-symmetrically placed lenses aligned over the non-symmetrically placed optically active regions, and singulated to form packages, such as image sensor packages. Related methods, and systems incorporating devices with non-symmetrically placed optically active regions and aligned lenses are also disclosed.

摘要翻译： 使用非对称定位的透镜，其半导体器件包括非对称地位于其表面上的光学活性区域。 透镜的光轴与光学活性区域的中心对准。 可以制造半导体器件和透镜的晶片级组件，其中非对称放置的透镜在非对称放置的光学有源区域上对准地相互固定，并且被单个化以形成封装，例如图像传感器封装。 还公开了相关方法和包括具有非对称放置的光学活性区域和对准透镜的装置的系统。

公开(公告)号：US08624711B2

公开(公告)日：2014-01-07

申请号：US11968561

申请日：2008-01-02

申请人： Mark E. Tuttle ,  John R. Tuttle

发明人： Mark E. Tuttle ,  John R. Tuttle

IPC分类号： H04Q5/22

CPC分类号： H01Q1/2225 ,  G01S13/767 ,  G01S13/78 ,  G06K7/10346 ,  G06K19/0723 ,  G06K19/0726 ,  G06K19/07749 ,  H01Q1/22 ,  H01Q7/00

摘要： An adjustable radio frequency data communications device has a monolithic semiconductor integrated circuit with integrated circuitry, interrogation receiving circuitry provided on the monolithic integrated circuit forming at least part of the integrated circuitry and configured to receive an interrogation signal from the interrogator unit, an antenna electrically coupled to the interrogation receiving circuitry and configured to communicate with the remote interrogator unit, a power source electrically coupled to the integrated circuitry and configured to generate operating power for the communications device, and at least one of the antenna and the interrogation receiving circuitry having reconfigurable electrical characteristics, the electrical characteristics being reconfigurable to selectively tune the at least one of the antenna and the interrogation receiving circuitry within a range of tuned and detuned states to realize a desired receiver sensitivity of the communications device. Additionally, a method for tuning receiver sensitivity and/or transmitter sensitivity according to construction of the above device is disclosed.

摘要翻译： 一种可调节射频数据通信设备具有集成电路的单片半导体集成电路，在单片集成电路上提供的询问接收电路，其形成集成电路的至少一部分并且被配置为从询问器单元接收询问信号，天线电耦合 所述询问接收电路被配置为与所述远程询问器单元通信;电源，其耦合到所述集成电路并且被配置为生成所述通信设备的操作功率，并且所述天线和所述询问接收电路中的至少一个具有可重新配置的电 特性，电特性是可重构的，以在调谐和失谐状态的范围内选择性地调谐天线和询问接收电路中的至少一个，以实现通信设备的期望接收机灵敏度 e。 此外，公开了根据上述装置的结构来调整接收机灵敏度和/或发射机灵敏度的方法。

公开(公告)号：USRE44409E1

公开(公告)日：2013-08-06

申请号：US13269853

申请日：2011-10-10

申请人： Ross S. Dando ,  Mark E. Tuttle

发明人： Ross S. Dando ,  Mark E. Tuttle

IPC分类号： G08B13/14

CPC分类号： G06K7/10366 ,  A22B5/0064 ,  A22B7/00 ,  A22B7/007 ,  A22C17/10 ,  G06K7/0008 ,  G06K17/0022 ,  G06K2017/0045 ,  G08B13/2434 ,  G08B13/2462

摘要： In one aspect, the invention encompasses a method for electronic tracking of units originating from a common source which comprises a plurality of units physically joined with one another. A first transponder is physically associated with the common source, and the source is split to separate it into three or more of the units. A second transponder is physically associated with one of the three or more units, and the second transponder sends a code. The code of the second transponder is electrically associated with an identifier of the common source. In a particular aspect, the common source is an animal carcass. A batch comprises separate units of objects that are physically joined together. RFID tags are attached to each of the units and to the batch. The codes stored in the RFID tags are electrically associated with one another in the database.

摘要翻译： 一方面，本发明包括用于电子跟踪源自公共源的单元的方法，该方法包括彼此物理连接的多个单元。 第一个转发器与公共源物理关联，源被拆分成三个或更多个单元。 第二个转发器与三个或更多个单元中的一个物理相关联，第二个应答器发送一个代码。 第二应答器的代码与公共源的标识符电连接。 在一个特定方面，共同的来源是动物尸体。 批次包括物理连接在一起的单独的物体单元。 RFID标签连接到每个单元和批次。 存储在RFID标签中的代码在数据库中彼此电联系。

公开(公告)号：US08502353B2

公开(公告)日：2013-08-06

申请号：US13154550

申请日：2011-06-07

申请人： Salman Akram ,  Charles M. Watkins ,  William M. Hiatt ,  David R. Hembree ,  James M. Wark ,  Warren M. Farnworth ,  Mark E. Tuttle ,  Sidney B. Rigg ,  Steven D. Oliver ,  Kyle K. Kirby ,  Alan G. Wood ,  Lu Velicky

发明人： Salman Akram ,  Charles M. Watkins ,  William M. Hiatt ,  David R. Hembree ,  James M. Wark ,  Warren M. Farnworth ,  Mark E. Tuttle ,  Sidney B. Rigg ,  Steven D. Oliver ,  Kyle K. Kirby ,  Alan G. Wood ,  Lu Velicky

IPC分类号： H01L23/485

CPC分类号： H01L21/76877 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/45 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2221/6834 ,  H01L2224/02166 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

摘要翻译： 公开了一种用于成像器，存储器和其他集成电路应用的透晶片互连，从而消除了对引线接合的需要，使得结合这种互连的器件可堆叠并且实现成像器件的晶片级封装。 此外，实现了更小且更可靠的管芯封装，并且由于信号路径长度的减小，电路寄生（例如，L和R）被减小。

公开(公告)号：USRE43918E1

公开(公告)日：2013-01-08

申请号：US11864718

申请日：2007-09-28

申请人： Mark E. Tuttle ,  Rickie C. Lake ,  Steven F. Schicht ,  John R. Tuttle

发明人： Mark E. Tuttle ,  Rickie C. Lake ,  Steven F. Schicht ,  John R. Tuttle

IPC分类号： G06F11/00

CPC分类号： G01R31/303 ,  G01R31/01 ,  G01R31/2822 ,  G01R31/3025 ,  G06K7/0095 ,  G06K19/0701

摘要： A plurality of battery-operated transceivers encapsulated by lamination to form a sheet of independent transceivers is tested in a two piece fixture that forms an enclosure surrounding each in-sheet transceiver. Each enclosure has an antenna for transmitting a command signal to the transceiver at a known power level and for receiving a reply message from the transceiver containing a power level measurement made by the transceiver. Test methods using the fixture of the present invention are also described. An RFID tag and interrogator may each include a transmitter and a receiver. The tag and interrogator may communicate with each other at different frequency bands and may communicate in accordance with a wireless communication protocol.

摘要翻译： 通过层压封装以形成独立收发器片的多个电池供电的收发器在形成围绕每一张片内收发器的外壳的两件式夹具中进行测试。 每个外壳具有用于以已知功率电平向收发器发送命令信号并用于从收发器接收包含由收发器进行的功率电平测量的应答消息的天线。 还描述了使用本发明的固定装置的测试方法。 RFID标签和询问器可以各自包括发射机和接收机。 标签和询问器可以在不同的频带彼此通信，并且可以根据无线通信协议进行通信。

公开(公告)号：US07902643B2

公开(公告)日：2011-03-08

申请号：US11514568

申请日：2006-08-31

申请人： Mark E. Tuttle

发明人： Mark E. Tuttle

IPC分类号： H01L23/58

CPC分类号： H01L21/76898 ,  H01L21/76895 ,  H01L23/552 ,  H01L24/10 ,  H01L24/13 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/13 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599

摘要： Microfeature workpieces having interconnects and conductive backplanes and associated systems and methods are disclosed herein. One such device includes a semiconductor substrate having integrated circuitry and terminals electrically coupled to the integrated circuitry. The device also includes electrically conductive interconnects extending through at least a portion of the semiconductor substrate and electrically coupled to corresponding terminals. The device further includes a conductive backplane assembly having a conductive layer at a back side of the semiconductor substrate. One or more of the interconnects are electrically coupled to the conductive layer at the back side of the semiconductor substrate.

摘要翻译： 具有互连和导电背板的微特征工件以及相关联的系统和方法在本文中公开。 一种这样的器件包括具有集成电路和电耦合到集成电路的端子的半导体衬底。 该器件还包括延伸穿过半导体衬底的至少一部分并电耦合到相应端子的导电互连。 该器件还包括导电底板组件，其在半导体衬底的背面具有导电层。 一个或多个互连件在半导体衬底的背面电耦合到导电层。

公开(公告)号：US20090273449A1

公开(公告)日：2009-11-05

申请号：US12115156

申请日：2008-05-05

申请人： Mark E. Tuttle

发明人： Mark E. Tuttle

IPC分类号： H04Q5/22 ,  G08B21/00

CPC分类号： H04Q9/00 ,  G06K7/10346 ,  H04Q2209/47 ,  H04Q2209/823

摘要： A radio frequency identification (RFID) interrogator housed in a portable platform that includes at least one antenna, a transceiver for transmitting and receiving a radio frequency (RF) signal through the antenna, and a controller in communication with the transceiver for adjusting power and direction of the transmitted RF signal. The controller can be configured to adjust the antenna orientation, and can also selectively activate and deactivate one or more antennas.

摘要翻译： 容纳在便携式平台中的射频识别（RFID）询问器，其包括至少一个天线，用于通过天线发送和接收射频（RF）信号的收发器，以及与收发器通信的控制器，用于调整功率和方向 的发射RF信号。 控制器可以被配置为调整天线方向，并且还可以选择性地激活和去激活一个或多个天线。

公开(公告)号：US20090160030A1

公开(公告)日：2009-06-25

申请号：US12395989

申请日：2009-03-02

申请人： Mark E. Tuttle

发明人： Mark E. Tuttle

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L23/5384 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K7/06 ,  H01L2924/014 ,  H01L2224/05552

摘要： The present invention relates to methods for forming through-wafer interconnects in semiconductor substrates and the resulting structures. In one embodiment, a method for forming a through-wafer interconnect includes providing a substrate having a pad on a surface thereof, depositing a passivation layer over the pad and the surface of the substrate, and forming an aperture through the passivation layer and the pad using a substantially continuous process. An insulative layer is deposited in the aperture followed by a conductive layer and a conductive fill. In another embodiment of the invention, a semiconductor device is formed including a first interconnect structure that extends through a conductive pad and is electrically coupled with the conductive pad while a second interconnect structure is formed through another conductive pad while being electrically isolated therefrom. Semiconductor devices and assemblies produced with the methods are also disclosed.

摘要翻译： 本发明涉及在半导体衬底中形成贯穿晶片互连的方法以及所得到的结构。 在一个实施例中，用于形成贯通晶片互连的方法包括提供在其表面上具有焊盘的衬底，在焊盘和衬底的表面上沉积钝化层，以及通过钝化层和焊盘形成孔 使用基本上连续的过程。 绝缘层沉积在孔中，随后是导电层和导电填料。 在本发明的另一实施例中，形成半导体器件，其包括延伸穿过导电焊盘并与导电焊盘电耦合的第一互连结构，而第二互连结构通过另一个导电焊盘形成，同时与之电绝缘。 还公开了使用该方法制造的半导体器件和组件。