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公开(公告)号：US20080299247A1
公开(公告)日：2008-12-04
申请号：US12129881
申请日：2008-05-30
申请人： Masahiko Ogino , Mitsuru Hasegawa , Kenya Ohashi , Akihiro Miyauchi , Hitoshi Suzuki , Toshio Haba , Haruo Akahoshi
发明人： Masahiko Ogino , Mitsuru Hasegawa , Kenya Ohashi , Akihiro Miyauchi , Hitoshi Suzuki , Toshio Haba , Haruo Akahoshi
CPC分类号： B29C33/3878 , B29C33/424 , C25D1/02 , C25D1/10 , Y10S425/81 , Y10T29/49549 , Y10T29/49552
摘要： There is provided a fine pattern mold capable of transferring a fine concave/convex pattern accurately without causing deformation of the fine concave/convex pattern itself.The fine patter mold comprises: a roll; a buffer tube whose inner peripheral surface is in contact with an outer peripheral surface of the roll; and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube.
摘要翻译： 提供了能够精确地转印精细凹凸图案的精细图案模具，而不会导致精细凹凸图案本身的变形。 精细模具包括：卷; 缓冲管，其内周面与所述辊的外周面接触; 以及其内周面与缓冲管的外周面接触的压模管，在其外周面上形成微细的凹凸图案，其中缓冲管具有较大的线膨胀系数和 比压模管的弹性模量小。
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公开(公告)号：US08083515B2
公开(公告)日：2011-12-27
申请号：US12129881
申请日：2008-05-30
申请人： Masahiko Ogino , Mitsuru Hasegawa , Kenya Ohashi , Akihiro Miyauchi , Hitoshi Suzuki , Toshio Haba , Haruo Akahoshi
发明人： Masahiko Ogino , Mitsuru Hasegawa , Kenya Ohashi , Akihiro Miyauchi , Hitoshi Suzuki , Toshio Haba , Haruo Akahoshi
CPC分类号： B29C33/3878 , B29C33/424 , C25D1/02 , C25D1/10 , Y10S425/81 , Y10T29/49549 , Y10T29/49552
摘要： The fine pattern mold comprises: that includes a roll, a buffer tube with inner peripheral surface is in contact with an outer peripheral surface of the roll, and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube.
摘要翻译： 精细图案模具包括：包括辊，具有内周表面的缓冲管与辊的外周表面接触;以及压模管，其内周表面与所述辊的外周表面接触 在其外周面形成有缓冲管和细凹凸图案，其中缓冲管具有比压模管更大的线膨胀系数和更小的弹性模量。
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公开(公告)号：US08387255B2
公开(公告)日：2013-03-05
申请号：US13307042
申请日：2011-11-30
申请人： Masahiko Ogino , Mitsuru Hasegawa , Kenya Ohashi , Akihiro Miyauchi , Hitoshi Suzuki , Toshio Haba , Haruo Akahoshi
发明人： Masahiko Ogino , Mitsuru Hasegawa , Kenya Ohashi , Akihiro Miyauchi , Hitoshi Suzuki , Toshio Haba , Haruo Akahoshi
CPC分类号： B29C33/3878 , B29C33/424 , C25D1/02 , C25D1/10 , Y10S425/81 , Y10T29/49549 , Y10T29/49552
摘要： The fine pattern mold that includes a roll, a buffer tube with inner peripheral surface is in contact with an outer peripheral surface of the roll, and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube.
摘要翻译： 包括辊，具有内周面的缓冲管的精细图案模具与辊的外周面接触，并且压模管的内周面与缓冲管的外周面接触 并且在其外周面上形成微细的凹凸图案，其中缓冲管具有比压模管更大的线膨胀系数和更小的弹性模量。
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公开(公告)号：US20120067507A1
公开(公告)日：2012-03-22
申请号：US13307042
申请日：2011-11-30
申请人： Masahiko OGINO , Mitsuru Hasegawa , Kenya Ohashi , Akihiro Miyauchi , Hitoshi Suzuki , Toshio Haba , Haruo Akahoshi
发明人： Masahiko OGINO , Mitsuru Hasegawa , Kenya Ohashi , Akihiro Miyauchi , Hitoshi Suzuki , Toshio Haba , Haruo Akahoshi
CPC分类号： B29C33/3878 , B29C33/424 , C25D1/02 , C25D1/10 , Y10S425/81 , Y10T29/49549 , Y10T29/49552
摘要： The fine pattern mold that includes a roll, a buffer tube with inner peripheral surface is in contact with an outer peripheral surface of the roll, and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube.
摘要翻译： 包括辊，具有内周面的缓冲管的精细图案模具与辊的外周面接触，并且压模管的内周面与缓冲管的外周面接触 并且在其外周面上形成微细的凹凸图案，其中缓冲管具有比压模管更大的线膨胀系数和更小的弹性模量。
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公开(公告)号：US07922887B2
公开(公告)日：2011-04-12
申请号：US11340570
申请日：2006-01-27
申请人： Toshio Haba , Hiroshi Yoshida , Haruo Akahoshi , Hitoshi Suzuki
发明人： Toshio Haba , Hiroshi Yoshida , Haruo Akahoshi , Hitoshi Suzuki
摘要： The present invention provides a method for producing a metal structure comprising a substrate and a metal film formed on the substrate; comprising the steps of providing surface having irregularities made of a electrical conductor in the area of the substrate where the metal body or film is to be formed; and preferentially forming the metal body or film by electroplating in the area provided with the conductive surface having irregularities. The plating bath may preferably contain an additive compound such as a cyanine dye which is capable of suppressing the plating reaction, and which loses such plating-suppressing effect with the progress of the plating reaction. The metal film can be produced by electroplating in the area provided with the surface having irregularities.
摘要翻译： 本发明提供一种金属结构体的制造方法，该金属结构体包括在基板上形成的基板和金属膜; 包括以下步骤：在要形成金属体或膜的基板的区域中提供具有由电导体制成的凹凸的表面; 并且优选地在设置有具有不规则性的导电表面的区域中通过电镀形成金属体或膜。 电镀浴可以优选含有能够抑制电镀反应的花青染料等添加剂化合物，并且随着电镀反应的进行而失去这种电镀抑制效果。 金属膜可以通过在具有不规则的表面的区域中进行电镀而制造。
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公开(公告)号：US20070287289A1
公开(公告)日：2007-12-13
申请号：US11760969
申请日：2007-06-11
申请人： Toshio Haba , Hitoshi Suzuki , Naohito Satou , Haruo Akahoshi , Hiroshi Yoshida , Akira Chinda
发明人： Toshio Haba , Hitoshi Suzuki , Naohito Satou , Haruo Akahoshi , Hiroshi Yoshida , Akira Chinda
IPC分类号： H01L21/44
CPC分类号： H01L21/2885 , C25D3/38 , C25D5/022 , C25D5/34 , H05K3/108 , H05K3/241 , H05K3/4007 , H05K2201/0367 , H05K2203/0392
摘要： [Problem to be Solved] An object of the present invention is to provide a method of forming a conductive pattern having an excellent uniformity of film thickness within the surface of a substrate independently of the density of the pattern. [Solution] The production method of a conductive pattern in accordance with the present invention comprises the step of electroplating for forming a conductive pattern by electroplating on a metal seed layer formed on an insulated substrate using a plating bath containing an accelerator for reducing the deposition overpotential of a plated metal.
摘要翻译： [待解决的问题]本发明的目的在于提供一种形成与图案的密度无关地在基板的表面内具有优异的膜厚均匀性的导电图案的方法。 [解决方案]根据本发明的导电图案的制造方法包括通过使用包含用于降低沉积超电势的促进剂的电镀液通过电镀在形成在绝缘基板上的金属种子层上形成导电图案的电镀步骤 的镀金属。
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公开(公告)号：US20060163725A1
公开(公告)日：2006-07-27
申请号：US11205175
申请日：2005-08-17
申请人： Toshio Haba , Hiroshi Yoshida , Haruo Akahoshi , Hitoshi Suzuki , Akira Chinda
发明人： Toshio Haba , Hiroshi Yoshida , Haruo Akahoshi , Hitoshi Suzuki , Akira Chinda
CPC分类号： H05K3/241 , H01L21/4846 , H01L23/49838 , H01L2924/0002 , H01L2924/09701 , H05K3/108 , H05K3/382 , H05K3/388 , H01L2924/00
摘要： It is an object of the present invention to provide a wiring board having high-density wiring with a controlled shape without masking by a resist film and a production method thereof. In the present invention, the production method of a wiring board having copper wiring on an insulating substrate includes the steps of forming a metal seed layer on the insulating substrate, the metal seed layer having a roughened shape in a portion on which the copper wiring or a bump is to be formed, and forming an electroplated film of copper or an alloy of copper through electroplating on the portion of the metal seed layer having the roughened shape. A substance for suppressing the plating reaction is added to a plating bath to provide an angle of 90 degrees or smaller between a surface of the insulating substrate and a side of the electroplated film.
摘要翻译： 本发明的目的是提供一种具有受控形状的高密度布线而不用抗蚀剂膜掩蔽的布线板及其制造方法。 在本发明中，在绝缘基板上具有铜布线的布线基板的制造方法包括以下步骤：在绝缘基板上形成金属籽晶层，金属种子层的粗糙化部分在铜布线或 形成凸起，并且通过电镀在具有粗糙形状的金属种子层的部分上形成铜或铜的合金的电镀膜。 在镀浴中加入抑制电镀反应的物质，在绝缘性基材的表面与电镀膜的一侧之间形成90度以下的角度。
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公开(公告)号：US20110114368A1
公开(公告)日：2011-05-19
申请号：US13001848
申请日：2009-06-25
申请人： Hiroshi Nakano , Hitoshi Suzuki , Toshio Haba , Haruo Akahoshi
发明人： Hiroshi Nakano , Hitoshi Suzuki , Toshio Haba , Haruo Akahoshi
CPC分类号： H05K3/045 , H05K1/0284 , H05K3/107 , H05K3/241 , H05K2201/09018 , H05K2201/09118 , H05K2203/0723 , Y10T29/49155
摘要： A small-sized electronic circuit component comprising micro-wiring and a method for manufacturing the same are provided. The electronic circuit component is manufactured by a manufacturing method comprising the steps of forming a recessed portion which is to be a three-dimensional wiring in the surface of an insulating base material of the electronic circuit component comprising the wiring, forming a first metal layer which is to be an electroplated conductive layer on the surface of the insulating base material including the recessed portion, selectively forming a second metal layer which is to be the wiring only in the recessed portion which is to be the wiring, and removing the first metal layer formed on the surface other than in the recessed portion which is to be the wiring.
摘要翻译： 提供一种包括微型布线的小尺寸电子电路元件及其制造方法。 电子电路部件通过以下的制造方法制造，该方法包括以下步骤：在包括布线的电子电路部件的绝缘基材的表面中形成作为三维布线的凹部，形成第一金属层， 在包括凹部的绝缘基材的表面上形成电镀导电层，在作为布线的凹部中选择形成作为布线的第二金属层，除去第一金属层 形成在除了作为布线的凹部中的表面上。
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公开(公告)号：US20090057156A1
公开(公告)日：2009-03-05
申请号：US12190610
申请日：2008-08-13
申请人： Toshio Haba , Haruo Akahoshi , Hitoshi Suzuki , Akira Chinda
发明人： Toshio Haba , Haruo Akahoshi , Hitoshi Suzuki , Akira Chinda
IPC分类号： C25D5/02
CPC分类号： H05K3/423 , C23C18/1608 , C23C18/1653 , C23C18/1806 , C23C18/1844 , C23C18/22 , C23C18/31 , C25D3/02 , C25D3/38 , C25D5/02 , C25D5/04 , C25D5/18 , C25D7/123 , H05K3/107
摘要： It is an object of the present invention to alleviate a work for removing an unnecessary metal layer when wiring and vias are formed on a substrate by electroplating.An additive is added to a plating solution to be used for electroplating. The additive has a plating reaction suppressing capability, but has a characteristic that the plating reaction suppressing capability is reduced as the plating reaction progresses. The additive has a capability for increasing a metal deposition overpotential and has a characteristic that the metal deposition overpotential is reduced as the reaction progresses. As a result, the metal can be deposited selectively in a trench and a via formed on the substrate. When a wiring and a via are formed on the substrate, the trench and the via having a predetermined surface roughness are formed on the substrate.
摘要翻译： 本发明的目的是减轻当通过电镀在基板上形成布线和通孔时去除不需要的金属层的工作。 向用于电镀的电镀液中加入添加剂。 添加剂具有电镀反应抑制能力，但具有电镀反应抑制能力随镀层反应进行而降低的特征。 该添加剂具有增加金属沉积超电位的能力，并且具有随反应进行而使金属沉积超电势降低的特征。 结果，金属可以选择性地沉积在形成在衬底上的沟槽和通孔中。 当在衬底上形成布线和通孔时，在衬底上形成具有预定表面粗糙度的沟槽和通孔。
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公开(公告)号：US20080251387A1
公开(公告)日：2008-10-16
申请号：US12137582
申请日：2008-06-12
申请人： Toshio Haba , Hiroshi Yoshida , Haruo Akahoshi , Hitoshi Suzuki , Akira Chinda
发明人： Toshio Haba , Hiroshi Yoshida , Haruo Akahoshi , Hitoshi Suzuki , Akira Chinda
CPC分类号： H05K3/241 , H01L21/4846 , H01L23/49838 , H01L2924/0002 , H01L2924/09701 , H05K3/108 , H05K3/382 , H05K3/388 , H01L2924/00
摘要： It is an object of the present invention to provide a wiring board having high-density wiring with a controlled shape without masking by a resist film and a production method thereof. In the present invention, the production method of a wiring board having copper wiring on an insulating substrate includes the steps of forming a metal seed layer on the insulating substrate, the metal seed layer having a roughened shape in a portion on which the copper wiring or a bump is to be formed, and forming an electroplated film of copper or an alloy of copper through electroplating on the portion of the metal seed layer having the roughened shape. A substance for suppressing the plating reaction is added to a plating bath to provide an angle of 90 degrees or smaller between a surface of the insulating substrate and a side of the electroplated film.
摘要翻译： 本发明的目的是提供一种具有受控形状的高密度布线而不用抗蚀剂膜掩蔽的布线板及其制造方法。 在本发明中，在绝缘基板上具有铜布线的布线基板的制造方法包括以下步骤：在绝缘基板上形成金属籽晶层，金属种子层的粗糙化部分在铜布线或 形成凸起，并且通过电镀在具有粗糙形状的金属种子层的部分上形成铜或铜的合金的电镀膜。 在镀浴中加入抑制电镀反应的物质，在绝缘性基材的表面与电镀膜的一侧之间形成90度以下的角度。
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