摘要:
A laminated gas sensor for exhaust gases improving thermal shock resistance, durability and reliability without permitting characteristics of the exhaust gas sensor to be particularly lowered is provided. A laminated gas sensor comprising a solid electrolyte layer (4) formed on one surface of a substrate (1) holding a lower electrode layer (3) therebetween, and an upper electrode layer (5) on the solid electrolyte layer (4), wherein the substrate (1) is a dense substrate made of at least one substrate material selected from silicon nitride, silicon carbide and aluminum nitride, and, as required, a thermal expansion buffer layer (8) is provided between the substrate (1) inclusive of at least part of the lower electrode layer (3) and the solid electrolyte layer (4), and the difference is not more than 5 ppm/° C. between the coefficient of thermal expansion of the solid electrolyte layer (4) and the coefficient of thermal expansion of the substrate (1) that comes in contact with at least part of the solid electrolyte layer (4) or of the thermal expansion buffer layer (8), and a method of producing the same.
摘要:
A zirconia structural body includes a substrate having one surface on which a first electrode, a zirconia layer, and a second electrode are successively laminated. The zirconia layer is a bonded body of mixture consisting of monoclinic zirconia crystal grains and cubic zirconia crystal grains.
摘要:
A manufacturing method of a semiconductor device includes: irradiating a laser beam on a single crystal silicon substrate, and scanning the laser beam on the substrate so that a portion of the substrate is poly crystallized, wherein at least a part of a poly crystallized portion of the substrate is exposed on a surface of the substrate; and etching the poly crystallized portion of the substrate with an etchant. In this case, a process time is improved.
摘要:
The present invention provides a conductive adhesive that is applicable as means for forming conductive junction to process for surface mounting of electronic parts for vehicle loading and process for the manufacture of the electronic parts per se for the purpose of substituting soldering therewith. The conductive adhesive according to the present invention is a conductive adhesive produced by dispersing a conductive medium, such as silver powder, in a binder resin component of a one-component epoxy thermosetting resin which has such a composition that the resin comprises, as essential components, an epoxy resin component composed mainly of an epoxy compound with a polycyclic aromatic ring skeleton, and a cyclic acid anhydride as a curing agent component thereof, and is further added with a coupling agent as an adherence imparting agent therefor.
摘要:
A pressure-sensitive sensor includes two base films opposite to each other, a pair of electrodes provided on the two base films, and first and second pressure-sensitive resistors provided by two layers on the electrodes to form a predetermined gap therebetween. Further, a contact state between the first and second pressure-sensitive resistors is changed in accordance with a pressure applied to at least one of the base films, and a resistance between the electrodes is changed in accordance with the contact state between the pressure-sensitive resistors. In addition, each of the pressure-sensitive resistors is constructed with a binder resin having an elasticity modulus in a range between 10 and 1000 Mpa, and electrical conductive particles each of which is coated with a polymer. Accordingly, the pressure-sensitive sensor including the pressure-sensitive resistors can accurately detect a pressure in a range between 1 and 20 kPa.
摘要:
A manufacturing method of a semiconductor device includes: irradiating a laser beam on a single crystal silicon substrate, and scanning the laser beam on the substrate so that a portion of the substrate is poly crystallized, wherein at least a part of a poly crystallized portion of the substrate is exposed on a surface of the substrate; and etching the poly crystallized portion of the substrate with an etchant. In this case, a process time is improved.
摘要:
A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes (11) of a mounting substrate (10) and one or more surface mounting components (20) are connected through a conductor composition (30), and one or more surface wirings (14) of the mounting substrate (10), one or more inner-layer wirings (13) and one or more via conductors (12) are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 nm or less.
摘要:
A method of producing a circuit board includes a step of providing a conductive paste including metal nano-particles at an insulating substrate, and a step of sintering the conductive paste so as to form a circuit conductor. In the sintering step, the conductive paste is sintered in a low-oxygen condition including alcohol such that the metal nano-particles are sintered.
摘要:
A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes (11) of a mounting substrate (10) and one or more surface mounting components (20) are connected through a conductor composition (30), and one or more surface wirings (14) of the mounting substrate (10), one or more inner-layer wirings (13) and one or more via conductors (12) are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 nm or less.
摘要:
In a manufacturing method of a semiconductor device, a substrate including single crystalline silicon is prepared, a reformed layer that continuously extends is formed in the substrate, and the reformed layer is removed by etching. The forming the reformed layer includes polycrystallizing a portion of the single crystalline silicon by irradiating the substrate with a pulsed laser beam while moving a focal point of the laser beam in the substrate.