公开(公告)号：US20110120754A1

公开(公告)日：2011-05-26

申请号：US12674803

申请日：2007-09-13

申请人： Masayoshi Kondo ,  Masaaki Kato ,  Toshiaki Chuma ,  Toshio Komiyatani ,  Takahisa Iida ,  Kenichi Kanemasa

发明人： Masayoshi Kondo ,  Masaaki Kato ,  Toshiaki Chuma ,  Toshio Komiyatani ,  Takahisa Iida ,  Kenichi Kanemasa

IPC分类号： H05K1/02

CPC分类号： H01L23/49833 ,  H01L23/14 ,  H01L23/3735 ,  H01L23/49822 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/068 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A multilayer wiring board includes: a rigid portion including a first base member having flexibility and surfaces, the first base member having a first insulating layer and a first conductor layer, and a second base member bonded on at least one of the surfaces of the first base member and having rigidity higher than that of the first base member, the second base member having a second insulating layer and a second conductor layer; and a flexible portion provided so as to be continuously extended from the rigid portion, the flexible portion constituted from the first base member, wherein in the case where a coefficient of thermal expansion of the second insulating layer is measured by a thermal mechanical analysis based on JIS C 6481 at a predetermined temperature, the coefficient of thermal expansion of the second insulating layer in a plane direction thereof is 13 ppm/° C. or lower and the coefficient of thermal expansion of the second insulating layer in a thickness direction thereof is 20 ppm/° C. or lower.

摘要翻译： 多层布线板包括：刚性部分，其包括具有柔性和表面的第一基底构件，所述第一基底构件具有第一绝缘层和第一导体层，以及第二基底构件，其接合在所述第一和第二基底构件的至少一个表面上 所述第二基底构件具有比所述第一基底构件的刚性更高的刚性，所述第二基底构件具有第二绝缘层和第二导体层; 以及柔性部，其设置成从所述刚性部分连续延伸，所述柔性部分由所述第一基底构件构成，其中在通过基于以下的热机械分析来测量所述第二绝缘层的热膨胀系数的情况下 JIS C 6481在规定的温度下，第二绝缘层的面方向的热膨胀系数为13ppm /℃以下，第二绝缘层的厚度方向的热膨胀系数为20 ppm /℃以下。

公开(公告)号：US20110031000A1

公开(公告)日：2011-02-10

申请号：US12922852

申请日：2009-03-24

申请人： Toshio Komiyatani ,  Masayoshi Kondo

发明人： Toshio Komiyatani ,  Masayoshi Kondo

IPC分类号： H05K1/03 ,  C08K5/09 ,  B32B27/38

CPC分类号： H05K1/0326 ,  C08G59/32 ,  C08G59/621 ,  H01L23/49833 ,  H01L23/4985 ,  H01L23/5385 ,  H01L23/5387 ,  H01L2924/0002 ,  H05K3/4617 ,  H05K3/4658 ,  H05K3/4691 ,  H05K2201/0133 ,  H05K2203/0733 ,  Y10T428/31511 ,  Y10T428/31529 ,  H01L2924/00

摘要： There is disclosed a resin composition used for forming a resin layer in a sheet-formed carrier material with a resin, comprising a polyfunctional epoxy resin (a) having three or more glycidyl ether groups with an epoxy equivalent of 100 to 300, a compound (b) having one or more carboxyl groups with a melting point of equal to or more than 50 degrees C. and equal to or less than 230 degrees C., and a curing agent (c).

摘要翻译： 公开了一种树脂组合物，用于在具有树脂的片状载体材料中形成树脂层，其包含具有三个或更多个环氧当量为100至300的缩水甘油醚基团的多官能环氧树脂（a），化合物（ b）具有一个或多个熔点等于或大于50℃且等于或小于230℃的羧基和固化剂（c）。

公开(公告)号：US08042263B2

公开(公告)日：2011-10-25

申请号：US12160718

申请日：2007-02-08

申请人： Masayoshi Kondo ,  Toshio Komiyatani

发明人： Masayoshi Kondo ,  Toshio Komiyatani

IPC分类号： H01R43/00

CPC分类号： H05K3/4617 ,  H05K3/3489 ,  H05K3/386 ,  H05K3/423 ,  H05K2201/0195 ,  H05K2201/0394 ,  H05K2203/068 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49156 ,  Y10T29/49165

摘要： According to the present invention, there is provided a process for manufacturing a circuit board wherein a first substrate having a conductor post and a second substrate having a conductor pad for receiving the conductor post are laminated through an interlayer adhesive, and the conductor post and the conductor pad are electrically connected, comprising, as a first step, bonding the conductor pad with the conductor post by thermocompression under predetermined first conditions while the first and the second substrates are arranged such that the conductor pad faces the conductor post through the interlayer adhesive; thermocompressing the first substrate and the second substrate under predetermined second conditions while the conductor pad is bonded with the conductor post; and thermocompressing the first substrate and the second substrate under predetermined third conditions while the conductor pad is bonded with the conductor post, wherein the first, the second and the third conditions are different from each other.

摘要翻译： 根据本发明，提供了一种制造电路板的方法，其中具有导体柱的第一基板和具有用于接纳导体柱的导体焊盘的第二基板通过层间粘合剂层压，并且导体柱和 电导体焊盘电连接，包括作为第一步骤，在预定的第一条件下通过热压接将导体焊盘与导体柱接合，同时布置第一和第二基板，使得导体焊盘通过层间粘合剂面对导体柱; 在导体焊盘与导体柱接合的同时，在预定的第二条件下热压第一衬底和第二衬底; 以及在所述导体焊盘与所述导体柱接合的同时在预定的第三条件下热压所述第一基板和所述第二基板，其中所述第一，第二和第三条件彼此不同。

公开(公告)号：US20100326712A1

公开(公告)日：2010-12-30

申请号：US12865731

申请日：2009-02-20

申请人： Masayoshi Kondo ,  Toshio Komiyatani

发明人： Masayoshi Kondo ,  Toshio Komiyatani

IPC分类号： H05K1/09 ,  H05K3/36

CPC分类号： H05K3/4635 ,  H05K1/0393 ,  H05K3/386 ,  H05K3/4617 ,  H05K2201/0133 ,  H05K2201/09827 ,  Y10T29/49126

摘要： There are provided a circuit board, which has little outflow of an interlayer adhesive to be used for a multilayer lamination while keeping a connection reliability, and a method for manufacturing the circuit board. The circuit board (68) is characterized in that a first substrate (16) having a first base (12) and a conductor post (45) composed of a protrusion (14) projecting from the first base (12) and a metallic cover layer (15) covering the protrusion (14), and a second substrate (18) having a second base (19) and a conductor circuit (17) are laminated and adhered through an interlayer adhesive (13) and are alloyed at a bonding face (43) between the metallic cover layer (15) and the conductor circuit (17), and in that the cross-section, as viewed in the cross-section of the bonding face (43), of the metallic cover layer (15) has a shape which becomes wider from the bonding face (43) of the conductor circuit (17) toward the first substrate (16).

摘要翻译： 提供了一种电路板，其在保持连接可靠性的同时几乎没有用于多层叠层的层间粘合剂的流出，以及制造电路板的方法。 电路板（68）的特征在于，具有第一基座（12）的第一基板（16）和由从第一基座（12）突出的突起（14）构成的导体柱（45）和金属覆盖层 覆盖所述突起（14）的第一基板（15）和具有第二基座（19）和导体电路（17）的第二基板（18）通过层间粘合剂（13）层压并粘合在合金面 金属覆盖层（15）与导体电路（17）之间的截面如图43（b）所示，并且金属覆盖层（15）的接合面（43）的截面所示的横截面为 从导体电路（17）的接合面（43）朝向第一基板（16）变宽的形状。

公开(公告)号：US20100212937A1

公开(公告)日：2010-08-26

申请号：US12160718

申请日：2006-02-13

申请人： Masayoshi Kondo ,  Toshio Komiyatani

发明人： Masayoshi Kondo ,  Toshio Komiyatani

IPC分类号： H05K1/00 ,  H05K13/00

CPC分类号： H05K3/4617 ,  H05K3/3489 ,  H05K3/386 ,  H05K3/423 ,  H05K2201/0195 ,  H05K2201/0394 ,  H05K2203/068 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49156 ,  Y10T29/49165

摘要： According to the present invention, there is provided a process for manufacturing a circuit board wherein a first substrate having a conductor post and a second substrate having a conductor pad for receiving the conductor post are laminated through an interlayer adhesive, and the conductor post and the conductor pad are electrically connected, comprising, as a first step, bonding the conductor pad with the conductor post by thermocompression under predetermined first conditions while the first and the second substrates are arranged such that the conductor pad faces the conductor post through the interlayer adhesive; thermocompressing the first substrate and the second substrate under predetermined second conditions while the conductor pad is bonded with the conductor post; and thermocompressing the first substrate and the second substrate under predetermined third conditions while the conductor pad is bonded with the conductor post, wherein the first, the second and the third conditions are different from each other.

摘要翻译： 根据本发明，提供了一种制造电路板的方法，其中具有导体柱的第一基板和具有用于接纳导体柱的导体焊盘的第二基板通过层间粘合剂层压，并且导体柱和 电导体焊盘电连接，包括作为第一步骤，在预定的第一条件下通过热压接将导体焊盘与导体柱接合，同时布置第一和第二基板，使得导体焊盘通过层间粘合剂面对导体柱; 在导体焊盘与导体柱接合的同时，在预定的第二条件下热压第一衬底和第二衬底; 以及在所述导体焊盘与所述导体柱接合的同时在预定的第三条件下热压所述第一基板和所述第二基板，其中所述第一，第二和第三条件彼此不同。

公开(公告)号：US20060042826A1

公开(公告)日：2006-03-02

申请号：US10534962

申请日：2003-11-19

申请人： Masayoshi Kondo

发明人： Masayoshi Kondo

IPC分类号： H05K1/03

CPC分类号： H05K3/4635 ,  H05K1/0393 ,  H05K3/3489 ,  H05K3/386 ,  H05K3/4602 ,  H05K3/4617 ,  H05K3/4691 ,  H05K2201/0195 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2203/0733 ,  H05K2203/1189

摘要： The object of the present invention is to provide a multilayer flexible wiring board which is capable of effecting interlaminar connection with certainty, has high reliability and allows lamination of outer layer wiring boards. According to the present invention, there is provided a multilayer flexible wiring board including (1) plural single-sided wiring boards each having a wiring pattern on one side of the corresponding substrate and two-layer conductor posts projecting from the wiring pattern to the side of the substrate opposite from the wiring pattern, wherein the substrates other than that of the outermost layer have the pads to be connected to the two-layer conductor posts on the side opposite from the conductor posts, and the wiring pattern has no surface coating; (2) a flexible wiring board having on at least one side thereof the pads for connection to the conductor posts and including a wiring pattern with surface coating applied on the flexible portion but no surface coating applied on the multilayer portion, and (3) an,adhesive layer having a flux function, wherein the conductor posts and pads are connected by a metal or an alloy, and the wiring patterns are electrically connected.

摘要翻译： 本发明的目的是提供一种能够确定地实现层间连接，具有高可靠性并允许层叠外层布线板的多层挠性布线板。 根据本发明，提供了一种多层柔性布线基板，其包括：（1）多个单面布线板，其各自具有在相应基板的一侧上的布线图案和从布线图案向侧面突出的两层导体柱 所述基板与所述最外层的基板不同，所述基板与所述导体柱相反一侧的所述两层导体柱连接，所述布线图形没有表面被覆; （2）柔性布线板，其至少一侧具有用于连接到导体柱的焊盘，并且包括施加在柔性部分上的表面涂层的布线图案，但是没有施加在多层部分上的表面涂层，以及（3） ，具有助焊剂功能的粘合剂层，其中导体柱和焊盘通​​过金属或合金连接，并且布线图案电连接。

公开(公告)号：US5661909A

公开(公告)日：1997-09-02

申请号：US565722

申请日：1995-11-30

申请人： Masayoshi Kondo ,  Kunio Amano ,  Katsufumi Takeda ,  Hideki Okubo

发明人： Masayoshi Kondo ,  Kunio Amano ,  Katsufumi Takeda ,  Hideki Okubo

IPC分类号： B23D51/10 ,  B27B19/09

CPC分类号： B23D51/10 ,  Y10T279/17547

摘要： A blade mounting device is operable for mounting a blade on a movable member of a cutting member which is moved in a predetermined motion for a cutting operation. The blade mounting device includes a pair of claws mounted on the movable member and operable by an operator between a closed position for clamping the blade and an open position for releasing the blade. A first and a second thread mechanism are provided for converting the rotation of the actuation member into an axial movement of the actuation member relative to the movable member and for converting the rotation of the actuation member into an axial movement of the claws relative to the actuation member.

摘要翻译： 叶片安装装置可操作以将叶片安装在切割构件的可移动构件上，该切割构件以预定的运动方式移动以进行切割操作。 刀片安装装置包括一对安装在可移动部件上的爪，可由操作者在夹紧刀片的关闭位置和用于释放刀片的打开位置之间操作。 提供第一和第二螺纹机构，用于将致动构件的旋转转换成致动构件相对于可移动构件的轴向运动，并且用于将致动构件的旋转转换成爪相对于致动器的轴向运动 会员。

公开(公告)号：US20130347143A1

公开(公告)日：2013-12-26

申请号：US13822131

申请日：2011-09-16

申请人： Yoshikazu Tanaka ,  Noriko Nakamura ,  Hitoshi Kobayashi ,  Hiroaki Okuhara ,  Masayoshi Kondo ,  Yosuke Koike ,  Yosuke Hoshi ,  Toshikazu Nomizu

发明人： Yoshikazu Tanaka ,  Noriko Nakamura ,  Hitoshi Kobayashi ,  Hiroaki Okuhara ,  Masayoshi Kondo ,  Yosuke Koike ,  Yosuke Hoshi ,  Toshikazu Nomizu

IPC分类号： C12N15/82

CPC分类号： C12N15/825 ,  A01H5/02 ,  A01H6/56

摘要： Provided is a method for producing lilies containing a blue pigment (delphinidin) in the petals thereof by introducing a foreign gene into lilies. The method pertaining to the present invention is a method for producing lilies containing delphinidin in the petals thereof, including the following steps: introducing, into a lily, a F3′5′H gene derived from a campanula and comprising a nucleotide sequence encoding a peptide having flavonoid 3′5′-hydroxylase (F3′5′H) activity, such as a nucleotide sequence represented by SEQ ID NO: 1 or SEQ ID NO: 11; while also introducing a F3′H gene fragment derived from a lily and comprising a nucleotide sequence encoding a peptide having flavonoid 3′-hydroxylase activity, such as a nucleotide sequence represented by SEQ ID NO: 3 or SEQ ID NO: 16; and inhibiting the expression of endogenous F3′H expression, which acts on cyanidin synthesis in lily petals, while the F3′5′H gene that has been introduced acts to cause the synthesis of delphinidin.

摘要翻译： 本发明提供了通过将外来基因引入百合中来生产其中含有蓝色色素（花翠素）的百合的方法。 本发明的方法是在其花瓣中制备含有花翠素的百合的方法，包括以下步骤：向百合中加入来自菜园的F3'5'H基因，并含有编码肽的核苷酸序列 具有类黄酮3'5'-羟化酶（F3'5'H）活性，例如由SEQ ID NO：1或SEQ ID NO：11表示的核苷酸序列; 同时引入来自百合的F3'H基因片段，并且包含编码具有类黄酮3'-羟化酶活性的肽的核苷酸序列，例如由SEQ ID NO：3或SEQ ID NO：16表示的核苷酸序列; 并抑制内源性F3'H表达，其作用于百合花瓣中的花青素合成，而已引入的F3'5'H基因则起到促进花翠素的合成作用。

公开(公告)号：US07576288B2

公开(公告)日：2009-08-18

申请号：US10534962

申请日：2003-11-19

申请人： Masayoshi Kondo ,  Masaaki Kato ,  Toshiaki Chuma ,  Satoru Nakao ,  Kentaro Fujiura

发明人： Masayoshi Kondo ,  Masaaki Kato ,  Toshiaki Chuma ,  Satoru Nakao ,  Kentaro Fujiura

IPC分类号： H05K1/00

CPC分类号： H05K3/4635 ,  H05K1/0393 ,  H05K3/3489 ,  H05K3/386 ,  H05K3/4602 ,  H05K3/4617 ,  H05K3/4691 ,  H05K2201/0195 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2203/0733 ,  H05K2203/1189

摘要： A multilayer flexible wiring board including (1) plural single-sided wiring boards each having a wiring pattern on one side of the corresponding substrate and two-layer conductor posts projecting from the wiring pattern to the side of the substrate opposite from the wiring pattern, wherein the substrates other than that of the outermost layer have the pads to be connected to the two-layer conductor posts on the side opposite from the conductor posts, and the wiring pattern has no surface coating; (2) a flexible wiring board having on at least one side thereof the pads for connection to the conductor posts and including a wiring pattern with surface coating applied on the flexible portion but no surface coating applied on the multilayer portion, and (3) an adhesive layer having a flux function, wherein the conductor posts and pads are connected by a metal or an alloy, and the wiring patterns are electrically connected.

摘要翻译： 一种多层柔性布线基板，包括：（1）多个单面布线板，其各自具有在相应基板的一侧上的布线图案和从该布线图案向与该布线图案相对的一侧突出的两层导体柱， 其中除了最外层之外的衬底具有与导体柱相反的一侧连接到两层导体柱的焊盘，并且布线图案没有表面涂层; （2）柔性布线板，其至少一侧具有用于连接到导体柱的焊盘，并且包括施加在柔性部分上的表面涂层的布线图案，但是没有施加在多层部分上的表面涂层，以及（3） 具有助焊剂功能的粘合剂层，其中导体柱和焊盘通​​过金属或合金连接，并且布线图案电连接。

公开(公告)号：US20090126975A1

公开(公告)日：2009-05-21

申请号：US12092160

申请日：2006-10-30

申请人： Masayoshi Kondo

发明人： Masayoshi Kondo

IPC分类号： H05K1/00 ,  B32B37/26

CPC分类号： H05K3/4673 ,  H05K3/386 ,  H05K3/4617 ,  H05K3/4626 ,  H05K3/4647 ,  H05K2201/09881 ,  H05K2203/0264 ,  H05K2203/066 ,  H05K2203/1189

摘要： A method for fabricating a multilayer circuit board, including: preparing a film 1 with interlayer adhesive in which a first protective film 102 and a first interlayer adhesive 104 are stacked; preparing a first circuit board 2 having a first base 202 and a conductive post 204 protruding from the first base 202; stacking the surface of the first interlayer adhesive and the surface including the conductive post together; peeling off the first protective film 102; preparing a second circuit board 3 including a conductive pad 302 receiving the conductive post 204; and stacking and bonding the first circuit board 2 and the second circuit board 3 through the first interlayer adhesive 104 so that the conductive post 204 and the conductive pad 302 face each other, wherein in the peeling off, the first interlayer adhesive 104 at the top portion 206 of the conductive post is selectively removed while peeling off the first protective film 102.

摘要翻译： 一种多层电路板的制造方法，其特征在于，包括：在第1保护膜102和第1层间粘接剂104的层叠粘接剂中制备膜1， 准备具有从第一基座202突出的第一基座202和导电柱204的第一电路板2; 将第一层间粘合剂的表面和包括导电柱的表面堆叠在一起; 剥离第一保护膜102; 准备包括接收导电柱204的导电垫302的第二电路板3; 并且通过第一层间粘合剂104层叠并接合第一电路板2和第二电路板3，使得导电柱204和导电焊盘302彼此面对，其中在剥离时，顶部的第一层间粘合剂104 在剥离第一保护膜102的同时选择性地去除导电柱的部分206。