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公开(公告)号：US20140048934A1
公开(公告)日：2014-02-20
申请号：US13586564
申请日：2012-08-15
申请人： Meng-Tse Chen , Jung Wei Cheng , Chun-Cheng Lin , Yu-Peng Tsai , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Jung Wei Cheng , Chun-Cheng Lin , Yu-Peng Tsai , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L23/498 , H01L21/56
CPC分类号： H01L21/563 , H01L2224/16225
摘要： A semiconductor device assembly includes a substrate having an area of the surface treated to form a surface roughness. A die is mounted on the substrate by a plurality of coupling members. An underfill substantially fills a gap disposed between the substrate and the die, wherein a fillet width of the underfill is substantially limited to the area of surface roughness.
摘要翻译： 半导体器件组件包括具有被处理以形成表面粗糙度的表面区域的衬底。 模具通过多个联接构件安装在基板上。 底部填充物基本上填充设置在基底和模具之间的间隙，其中底部填充物的圆角宽度基本上限于表面粗糙度的面积。
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公开(公告)号：US20130099385A1
公开(公告)日：2013-04-25
申请号：US13280157
申请日：2011-10-24
申请人： Meng-Tse Chen , Chun-Cheng Lin , Yu-Peng Tsai , Hsiu-Jen Lin , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Chun-Cheng Lin , Yu-Peng Tsai , Hsiu-Jen Lin , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L23/538 , H01L21/66
CPC分类号： H01L25/50 , H01L21/31105 , H01L21/565 , H01L22/12 , H01L22/20 , H01L23/3128 , H01L23/49811 , H01L23/49827 , H01L23/562 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/1131 , H01L2224/131 , H01L2224/13147 , H01L2224/16113 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81447 , H01L2224/81801 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2225/06572 , H01L2225/1023 , H01L2225/1058 , H01L2924/1431 , H01L2924/1432 , H01L2924/1434 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2924/3511 , H01L2924/014 , H01L2924/00012 , H01L2924/00
摘要： A device includes a package component having conductive features on a top surface, and a polymer region molded over the top surface of the first package component. A plurality of openings extends from a top surface of the polymer region into the polymer region, wherein each of the conductive features is exposed through one of the plurality of openings. The plurality of openings includes a first opening having a first horizontal size, and a second opening having a second horizontal size different from the first horizontal size.
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公开(公告)号：US20130062761A1
公开(公告)日：2013-03-14
申请号：US13228768
申请日：2011-09-09
申请人： Chih-Wei Lin , Ming-Da Cheng , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu , Meng-Tse Chen , Chun-Cheng Lin , Yu-Peng Tsai , Kuei-Wei Huang , Wei-Hung Lin
发明人： Chih-Wei Lin , Ming-Da Cheng , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu , Meng-Tse Chen , Chun-Cheng Lin , Yu-Peng Tsai , Kuei-Wei Huang , Wei-Hung Lin
IPC分类号： H01L23/498 , H01L21/56
CPC分类号： H01L25/0657 , H01L21/52 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L21/76898 , H01L23/3128 , H01L23/3135 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/92 , H01L24/97 , H01L25/03 , H01L25/0652 , H01L25/0655 , H01L25/105 , H01L25/50 , H01L2221/68331 , H01L2221/68345 , H01L2221/68377 , H01L2224/0231 , H01L2224/0401 , H01L2224/04105 , H01L2224/06515 , H01L2224/09181 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16225 , H01L2224/16238 , H01L2224/73259 , H01L2224/81005 , H01L2224/81191 , H01L2224/81815 , H01L2224/9202 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06541 , H01L2225/06548 , H01L2924/14 , H01L2924/1461 , H01L2924/15192 , H01L2924/15311 , H01L2924/15321 , H01L2924/15322 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2224/81 , H01L2224/03 , H01L2924/014 , H01L2924/00
摘要： Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL.
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公开(公告)号：US08609462B2
公开(公告)日：2013-12-17
申请号：US13272032
申请日：2011-10-12
申请人： Meng-Tse Chen , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L21/44
CPC分类号： B23Q3/18 , H01L21/50 , H01L21/561 , H01L21/563 , H01L23/49827 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75733 , H01L2224/75744 , H01L2224/75754 , H01L2224/7598 , H01L2224/75983 , H01L2224/81191 , H01L2224/81815 , H01L2224/83104 , H01L2224/83862 , H01L2224/83868 , H01L2224/83874 , H01L2224/97 , H01L2924/3511 , Y10T29/41 , H01L2924/00 , H01L2924/00014 , H01L2224/81 , H01L2924/00012 , H01L2924/014
摘要： A method includes dispensing an underfill between a first package component and a second package component, wherein the first package component is placed on a lower jig, and the second package component is over and bonded to the first package component. A through-opening is in the lower jig and under the first package component. The underfill is cured, wherein during the step of curing the underfill, a force is applied to flatten the first package component. The force is applied by performing an action selected from the group consisting of vacuuming and air blowing through the through-opening.
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公开(公告)号：US08884431B2
公开(公告)日：2014-11-11
申请号：US13228768
申请日：2011-09-09
申请人： Chih-Wei Lin , Ming-Da Cheng , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu , Meng-Tse Chen , Chun-Cheng Lin , Yu-Peng Tsai , Kuei-Wei Huang , Wei-Hung Lin
发明人： Chih-Wei Lin , Ming-Da Cheng , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu , Meng-Tse Chen , Chun-Cheng Lin , Yu-Peng Tsai , Kuei-Wei Huang , Wei-Hung Lin
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L21/683 , H01L23/498 , H01L21/56 , H01L25/065 , H01L23/538 , H01L25/00 , H01L23/00 , H01L23/31 , H01L25/10 , H01L25/03 , H01L21/768
CPC分类号： H01L25/0657 , H01L21/52 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L21/76898 , H01L23/3128 , H01L23/3135 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/92 , H01L24/97 , H01L25/03 , H01L25/0652 , H01L25/0655 , H01L25/105 , H01L25/50 , H01L2221/68331 , H01L2221/68345 , H01L2221/68377 , H01L2224/0231 , H01L2224/0401 , H01L2224/04105 , H01L2224/06515 , H01L2224/09181 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16225 , H01L2224/16238 , H01L2224/73259 , H01L2224/81005 , H01L2224/81191 , H01L2224/81815 , H01L2224/9202 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06541 , H01L2225/06548 , H01L2924/14 , H01L2924/1461 , H01L2924/15192 , H01L2924/15311 , H01L2924/15321 , H01L2924/15322 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2224/81 , H01L2224/03 , H01L2924/014 , H01L2924/00
摘要： Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL.
摘要翻译： 公开了用于半导体器件的封装方法和结构。 在一个实施例中，封装的半导体器件包括具有第一表面和与第一表面相对的第二表面的再分配层（RDL）。 至少一个集成电路耦合到RDL的第一表面，并且多个金属凸块耦合到RDL的第二表面。 模制化合物设置在RDL的至少一个集成电路和第一表面上。
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公开(公告)号：US20130234317A1
公开(公告)日：2013-09-12
申请号：US13416805
申请日：2012-03-09
申请人： Meng-Tse Chen , Wei-Hung Lin , Yu-Peng Tsai , Chun-Cheng Lin , Chih-Wei Lin , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Wei-Hung Lin , Yu-Peng Tsai , Chun-Cheng Lin , Chih-Wei Lin , Ming-Da Cheng , Chung-Shi Liu
CPC分类号： H01L24/32 , B23K35/24 , B23K35/3612 , H01L23/49816 , H01L24/17 , H01L25/105 , H01L25/50 , H01L2224/16237 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48228 , H01L2224/73204 , H01L2224/73265 , H01L2224/81815 , H01L2225/1023 , H01L2225/1058 , H01L2924/0665 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2924/00014 , H01L2224/48227 , H01L2924/00 , H01L2924/00012
摘要： Packaging methods and packaged semiconductor devices are disclosed. In one embodiment, a packaging method includes providing a first die, partially packaging the first die, and forming a plurality of solder balls on a surface of the partially packaged first die. An epoxy flux is disposed over the plurality of solder balls. A second die is provided, and the second die is partially packaged. The plurality of solder balls is coupled to the partially packaged second die.
摘要翻译： 公开了封装方法和封装的半导体器件。 在一个实施例中，包装方法包括提供第一模具，部分地包装第一模具，以及在部分封装的第一模具的表面上形成多个焊球。 环氧助焊剂设置在多个焊球上。 提供第二模具，并且第二模具被部分包装。 多个焊球与部分封装的第二管连接。
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公开(公告)号：US20130095608A1
公开(公告)日：2013-04-18
申请号：US13272032
申请日：2011-10-12
申请人： Meng-Tse Chen , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu
CPC分类号： B23Q3/18 , H01L21/50 , H01L21/561 , H01L21/563 , H01L23/49827 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75733 , H01L2224/75744 , H01L2224/75754 , H01L2224/7598 , H01L2224/75983 , H01L2224/81191 , H01L2224/81815 , H01L2224/83104 , H01L2224/83862 , H01L2224/83868 , H01L2224/83874 , H01L2224/97 , H01L2924/3511 , Y10T29/41 , H01L2924/00 , H01L2924/00014 , H01L2224/81 , H01L2924/00012 , H01L2924/014
摘要： A method includes dispensing an underfill between a first package component and a second package component, wherein the first package component is placed on a lower jig, and the second package component is over and bonded to the first package component. A through-opening is in the lower jig and under the first package component. The underfill is cured, wherein during the step of curing the underfill, a force is applied to flatten the first package component. The force is applied by performing an action selected from the group consisting of vacuuming and air blowing through the through-opening.
摘要翻译： 一种方法包括在第一包装部件和第二包装部件之间分配底部填充物，其中第一包装部件被放置在下部夹具上，并且第二包装部件结合到第一包装部件上。 通孔位于下夹具中并在第一包装部件下方。 底部填充物被固化，其中在固化底部填充物的步骤期间，施加力以使第一包装部件变平。 通过执行从通过通孔的抽真空和空气吹扫的组中选择的动作来施加力。
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公开(公告)号：US20120299181A1
公开(公告)日：2012-11-29
申请号：US13118108
申请日：2011-05-27
申请人： Meng-Tse Chen , Wei-Hung Lin , Sheng-Yu Wu , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chih-Wei Lin , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Wei-Hung Lin , Sheng-Yu Wu , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chih-Wei Lin , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L23/488 , H01L21/56
CPC分类号： H01L24/17 , H01L21/565 , H01L21/566 , H01L23/3114 , H01L23/3128 , H01L23/49827 , H01L24/16 , H01L24/81 , H01L25/105 , H01L25/50 , H01L2224/131 , H01L2224/16055 , H01L2224/16113 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2225/1023 , H01L2225/1058 , H01L2924/01029 , H01L2924/014 , H01L2924/12042 , H01L2924/1304 , H01L2924/14 , H01L2924/1432 , H01L2924/1434 , H01L2924/15174 , H01L2924/15311 , H01L2924/15321 , H01L2924/181 , H01L2924/00
摘要： A method of packaging includes placing a package component over a release film, wherein solder balls on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder balls remain in physical contact with the release film.
摘要翻译： 包装方法包括将包装部件放置在脱模膜上，其中包装部件表面上的焊球与剥离膜物理接触。 接下来，填充在剥离膜和包装部件之间的模塑料固化，其中在固化步骤期间，焊球与剥离膜保持物理接触。
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公开(公告)号：US08927391B2
公开(公告)日：2015-01-06
申请号：US13118108
申请日：2011-05-27
申请人： Meng-Tse Chen , Wei-Hung Lin , Sheng-Yu Wu , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chih-Wei Lin , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Wei-Hung Lin , Sheng-Yu Wu , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chih-Wei Lin , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Ming-Da Cheng , Chung-Shi Liu
CPC分类号： H01L24/17 , H01L21/565 , H01L21/566 , H01L23/3114 , H01L23/3128 , H01L23/49827 , H01L24/16 , H01L24/81 , H01L25/105 , H01L25/50 , H01L2224/131 , H01L2224/16055 , H01L2224/16113 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2225/1023 , H01L2225/1058 , H01L2924/01029 , H01L2924/014 , H01L2924/12042 , H01L2924/1304 , H01L2924/14 , H01L2924/1432 , H01L2924/1434 , H01L2924/15174 , H01L2924/15311 , H01L2924/15321 , H01L2924/181 , H01L2924/00
摘要： A method of packaging includes placing a package component over a release film, wherein solder balls on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder balls remain in physical contact with the release film.
摘要翻译： 包装方法包括将包装部件放置在脱模膜上，其中包装部件表面上的焊球与剥离膜物理接触。 接下来，填充在剥离膜和包装部件之间的模塑料固化，其中在固化步骤期间，焊球与剥离膜保持物理接触。
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公开(公告)号：US09030022B2
公开(公告)日：2015-05-12
申请号：US13280157
申请日：2011-10-24
申请人： Meng-Tse Chen , Chun-Cheng Lin , Yu-Peng Tsai , Hsiu-Jen Lin , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Chun-Cheng Lin , Yu-Peng Tsai , Hsiu-Jen Lin , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L23/48 , H01L23/498 , H01L23/31 , H01L23/00 , H01L25/10
CPC分类号： H01L25/50 , H01L21/31105 , H01L21/565 , H01L22/12 , H01L22/20 , H01L23/3128 , H01L23/49811 , H01L23/49827 , H01L23/562 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/1131 , H01L2224/131 , H01L2224/13147 , H01L2224/16113 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81447 , H01L2224/81801 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2225/06572 , H01L2225/1023 , H01L2225/1058 , H01L2924/1431 , H01L2924/1432 , H01L2924/1434 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2924/3511 , H01L2924/014 , H01L2924/00012 , H01L2924/00
摘要： A device includes a package component having conductive features on a top surface, and a polymer region molded over the top surface of the first package component. A plurality of openings extends from a top surface of the polymer region into the polymer region, wherein each of the conductive features is exposed through one of the plurality of openings. The plurality of openings includes a first opening having a first horizontal size, and a second opening having a second horizontal size different from the first horizontal size.
摘要翻译： 一种器件包括在顶表面上具有导电特征的封装元件和模塑在第一封装元件的顶表面上的聚合物区域。 多个开口从聚合物区域的顶表面延伸到聚合物区域中，其中每个导电特征通过多个开口中的一个露出。 多个开口包括具有第一水平尺寸的第一开口和具有不同于第一水平尺寸的第二水平尺寸的第二开口。
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