公开(公告)号：US20140048934A1

公开(公告)日：2014-02-20

申请号：US13586564

申请日：2012-08-15

申请人： Meng-Tse Chen ,  Jung Wei Cheng ,  Chun-Cheng Lin ,  Yu-Peng Tsai ,  Ming-Da Cheng ,  Chung-Shi Liu

发明人： Meng-Tse Chen ,  Jung Wei Cheng ,  Chun-Cheng Lin ,  Yu-Peng Tsai ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC分类号： H01L23/498 ,  H01L21/56

CPC分类号： H01L21/563 ,  H01L2224/16225

摘要： A semiconductor device assembly includes a substrate having an area of the surface treated to form a surface roughness. A die is mounted on the substrate by a plurality of coupling members. An underfill substantially fills a gap disposed between the substrate and the die, wherein a fillet width of the underfill is substantially limited to the area of surface roughness.

摘要翻译： 半导体器件组件包括具有被处理以形成表面粗糙度的表面区域的衬底。 模具通过多个联接构件安装在基板上。 底部填充物基本上填充设置在基底和模具之间的间隙，其中底部填充物的圆角宽度基本上限于表面粗糙度的面积。

公开(公告)号：US20130119549A1

公开(公告)日：2013-05-16

申请号：US13298086

申请日：2011-11-16

申请人： Jung Wei Cheng ,  Chien-Hsiun Lee ,  Tsung-Ding Wang ,  Chun-Chih Chuang

发明人： Jung Wei Cheng ,  Chien-Hsiun Lee ,  Tsung-Ding Wang ,  Chun-Chih Chuang

IPC分类号： H01L23/48 ,  B29C39/10 ,  H01L21/56

CPC分类号： B29C39/10 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/13082 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2224/81 ,  H01L2924/00

摘要： A method includes placing a mold chase over a bottom package, wherein the bottom package has a connector at a top surface of the bottom package. The mold chase includes a cover, and a pin under and connected to the cover. The pin occupies a space extending from a top surface of the connector to the cover. A polymer is filled into a space between the cover of the mold chase and the bottom package. The polymer is then cured. After the step of curing the polymer, the mold chase is removed, and the connector is exposed through an opening in the polymer, wherein the opening is left by the pin of the mold chase.

摘要翻译： 一种方法包括将模具放置在底部包装上，其中底部包装具有位于底部包装的顶部表面处的连接器。 模具追逐包括盖子和在盖子下面并连接到盖子上的销钉。 引脚占据从连接器的顶表面延伸到盖的空间。 将聚合物填充到模具追逐的盖和底部包装之间的空间中。 然后将聚合物固化。 在固化聚合物的步骤之后，去除模具追逐，并且连接器通过聚合物中的开口暴露，其中开口留在模具追踪的销上。

公开(公告)号：US08704354B2

公开(公告)日：2014-04-22

申请号：US13586629

申请日：2012-08-15

申请人： Jung Wei Cheng ,  Tsung-Ding Wang ,  Chien-Hsun Lee ,  Chun-Chih Chuang

发明人： Jung Wei Cheng ,  Tsung-Ding Wang ,  Chien-Hsun Lee ,  Chun-Chih Chuang

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05557 ,  H01L2224/05571 ,  H01L2224/05611 ,  H01L2224/05613 ,  H01L2224/05616 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06155 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00012

摘要： The described embodiments of forming bonding structures for package on package involves removing a portion of connectors and molding compound of the lower package. The described bonding mechanisms enable easier placement and alignment of connectors of an upper package to with connector of a lower package. As a result, the process window of the bonding process is wider. In addition, the bonding structures have smoother join profile and planar joint plane. As a result, the bonding structures are less likely to crack and also are less likely to crack. Both the yield and the form factor of the package on package structure are improved.

摘要翻译： 所形成的用于包装在包装上的粘合结构的实施例包括去除连接器的一部分和下封装的模塑料。 所描述的接合机构使得能够更容易地将上部封装的连接器放置和对准到具有较低封装的连接器。 结果，接合过程的过程窗口更宽。 此外，接合结构具有更平滑的接合轮廓和平面接合平面。 结果，接合结构不太可能破裂，也不易破裂。 包装结构上的包装的产量和形状因数均得到改善。

公开(公告)号：US08658464B2

公开(公告)日：2014-02-25

申请号：US13298086

申请日：2011-11-16

申请人： Jung Wei Cheng ,  Chien-Hsiun Lee ,  Tsung-Ding Wang ,  Chun-Chih Chuang

发明人： Jung Wei Cheng ,  Chien-Hsiun Lee ,  Tsung-Ding Wang ,  Chun-Chih Chuang

IPC分类号： H01L21/00

CPC分类号： B29C39/10 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/13082 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2224/81 ,  H01L2924/00

摘要： A method includes placing a mold chase over a bottom package, wherein the bottom package has a connector at a top surface of the bottom package. The mold chase includes a cover, and a pin under and connected to the cover. The pin occupies a space extending from a top surface of the connector to the cover. A polymer is filled into a space between the cover of the mold chase and the bottom package. The polymer is then cured. After the step of curing the polymer, the mold chase is removed, and the connector is exposed through an opening in the polymer, wherein the opening is left by the pin of the mold chase.

摘要翻译： 一种方法包括将模具放置在底部包装上，其中底部包装具有位于底部包装的顶部表面处的连接器。 模具追逐包括盖子和在盖子下面并连接到盖子上的销钉。 引脚占据从连接器的顶表面延伸到盖的空间。 将聚合物填充到模具追逐的盖和底部包装之间的空间中。 然后将聚合物固化。 在固化聚合物的步骤之后，去除模具追逐，并且连接器通过聚合物中的开口暴露，其中开口留在模具追踪的销上。

公开(公告)号：US09275924B2

公开(公告)日：2016-03-01

申请号：US13585500

申请日：2012-08-14

申请人： Tsung-Ding Wang ,  Jung Wei Cheng ,  Bo-I Lee

发明人： Tsung-Ding Wang ,  Jung Wei Cheng ,  Bo-I Lee

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/31 ,  H01L23/00 ,  H01L21/00

CPC分类号： H01L23/3185 ,  H01L21/302 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3178 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/94 ,  H01L2221/6834 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/0558 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05686 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11849 ,  H01L2224/1191 ,  H01L2224/13005 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/94 ,  H01L2924/10156 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/206 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/01047

摘要： A semiconductor package includes a passivation layer overlying a semiconductor substrate, a bump overlying the passivation layer, and a molding compound layer overlying the passivation layer and covering a lower portion of the bump. A sidewall of the passivation layer is covered by the molding compound layer.

摘要翻译： 半导体封装包括覆盖半导体衬底的钝化层，覆盖钝化层的凸块以及覆盖钝化层并覆盖凸块下部的模塑复合层。 钝化层的侧壁被模塑料层覆盖。