公开(公告)号：US20100072604A1

公开(公告)日：2010-03-25

申请号：US12489714

申请日：2009-06-23

申请人： Mikihiko KOMATSU ,  Takao HIDAKA ,  Junko KIMURA

发明人： Mikihiko KOMATSU ,  Takao HIDAKA ,  Junko KIMURA

IPC分类号： H01L25/16 ,  H01L23/538

CPC分类号： H01L25/0657 ,  G06F1/26 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/4952 ,  H01L23/49575 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/09 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L25/16 ,  H01L2223/6611 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01003 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/01039 ,  H01L2924/00 ,  H01L2224/48257 ,  H01L2924/00012 ,  H01L2924/00011

摘要： To provide a technique of supplying a voltage generated in any of a plurality of semiconductor chips to the other chip as a power supply voltage to realize a stable operation of a semiconductor device in which the semiconductor chips are stacked in the same package.In an example of the main technique, two chips are stacked with each other, first to third pads are disposed along corresponding sides of the respective chips, which are arranged close and in parallel to each other, and these pads are commonly connected to each other with first to third metal wires, respectively. In another example, fourth and fifth pads are disposed along a side different from a side along which the first to third pads are disposed, and further connected to each other with a fourth metal wire directly between the chips.

摘要翻译： 为了提供将多个半导体芯片中的任一个中产生的电压提供给另一芯片的技术作为电源电压，以实现其中半导体芯片堆叠在同一封装中的半导体器件的稳定操作。 在主要技术的示例中，两个芯片彼此堆叠，第一至第三焊盘沿相应的芯片的相应侧布置，它们彼此靠近并且平行地布置，并且这些焊盘彼此相连 分别具有第一至第三金属线。 在另一示例中，第四和第五焊盘沿着不同于第一至第三焊盘所设置的一侧的一侧设置，并且还通过直接在芯片之间的第四金属线彼此连接。